公开(公告)号：US20210063366A1

公开(公告)日：2021-03-04

申请号：US16412497

申请日：2019-05-15

Applicant: General Electric Company

Inventor： Radislav Alexandrovich Potyrailo ,  Richard St. Pierre ,  Emad Andarawis Andarawis

IPC: G01N33/00 ,  G01N33/52

Abstract: A sensor system includes an electrical circuit having plural leads coupled with one or more sensing regions. The sensing regions include gaps having sensing materials that detect an analyte of interest. The gaps close responsive to the sensing material corresponding to the gaps detecting the analyte of interest. One or more processors communicatively coupled with the electrical circuit receive electrical signals from the electrical circuit indicative of the gaps closing responsive to the sensing material of the corresponding gaps detecting the analyte of interest. The electrical circuit is in a closed position in the presence of the analyte of interest. The sensor system is configured to consume an increased amount of power when the electrical circuit is in the closed position relative to the electrical circuit in an open position responsive to the one or more of the gaps closing. A responsive action is determined based on the electrical signals.

公开(公告)号：US20190277617A1

公开(公告)日：2019-09-12

申请号：US15913434

申请日：2018-03-06

Applicant: General Electric Company

Inventor： Cheng-Po Chen ,  Christopher Bruce Gushee ,  Jose Luis Virgen ,  Emad Andarawis Andarawis ,  Glen William Brooksby ,  Jeffrey Ross Mayton ,  Nancy Cecelia Stoffel ,  Wyatt Beale Smith ,  Daniel Leroy Olson

IPC: G01B7/14 ,  G08B21/02 ,  G01R19/155

Abstract: A voltage detection device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a processing device embedded in the housing and communicatively coupled to the signal processing circuitry, the processing device configured to determine, from the processed signal, whether the voltage detection device is proximate to the active AC voltage source, and an electronic switch embedded in the housing and one of included within the processing device and communicatively coupled to the processing device, the electronic switch configured to reduce an impact of interference on detection of the active AC voltage source.

公开(公告)号：US20180306750A1

公开(公告)日：2018-10-25

申请号：US15491083

申请日：2017-04-19

Applicant: General Electric Company

Inventor： Dayu Huang ,  Emad Andarawis Andarawis ,  Edward James Nieters ,  Cheng-Po Chen ,  Marco Guerriero

IPC: G01N29/04 ,  E21B47/00 ,  G01N29/44

Abstract: A detection system includes a first sensor configured to send a first ultrasonic pulse toward an object in a blowout prevention system. The first ultrasonic pulse has a first parameter. The detection system also includes a second sensor spaced from the first sensor and configured to send a second ultrasonic pulse toward the object. The second ultrasonic pulse has a second parameter that is different from the first parameter of the first ultrasonic pulse. The first parameter and the second parameter are one of an amplitude, a frequency, a duration, an emission time, and an excitation code. The second sensor is further configured to receive the first ultrasonic pulse after the first ultrasonic pulse interacts with the object. The detection system is configured to determine that the first ultrasonic pulse received by the second sensor was sent by the first sensor. The detection system further includes a controller coupled to the second sensor and configured to determine a characteristic of the object based on the first ultrasonic pulse.

公开(公告)号：US20160197620A1

公开(公告)日：2016-07-07

申请号：US14589484

申请日：2015-01-05

Applicant: General Electric Company

Inventor： Amit Satish Gore ,  Emad Andarawis Andarawis ,  Naresh Kesavan Rao

IPC: H03M3/00 ,  G01B7/00

CPC classification number: H03M3/35 ,  G01D5/2291 ,  H03M3/466

Abstract: An analog-to-digital converter (ADC) is provided includes a first sigma-delta modulator (SDM) electrically coupled to a first signal input. The first SDM includes a first summing junction configured to receive a plurality of inputs to the first SDM. The ADC further includes a second sigma-delta modulator (SDM) electrically coupled to a second signal input. The second SDM includes a second summing junction configured to receive a plurality of inputs to the second SDM. The first SDM also includes a cross-coupled feedback loop from an output of the first SDM to a negative input of the first summing junction and to a positive input of the second summing junction. The second SDM also includes a cross-coupled feedback loop from an output of the second SDM to a negative input of the first summing junction and to a negative input of the second summing junction.

Abstract translation: 提供了一种模拟 - 数字转换器（ADC），包括电耦合到第一信号输入的第一Σ-Δ调制器（SDM）。 第一SDM包括被配置为接收到第一SDM的多个输入的第一求和点。 ADC还包括电耦合到第二信号输入的第二Σ-Δ调制器（SDM）。 第二SDM包括被配置为接收到第二SDM的多个输入的第二求和结。 第一SDM还包括从第一SDM的输出到第一求和结的负输入和第二求和结的正输入的交叉耦合反馈回路。 第二SDM还包括从第二SDM的输出到第一求和结的负输入和第二求和结的负输入的交叉耦合反馈回路。

公开(公告)号：US09130365B2

公开(公告)日：2015-09-08

申请号：US14486138

申请日：2014-09-15

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Avinash Srikrishnan Kashyap ,  Emad Andarawis Andarawis ,  David Mulford Shaddock

IPC: H01L29/66 ,  H01L21/332 ,  H02H1/04 ,  H01L21/50 ,  H01L29/861 ,  H01L21/82 ,  H01L27/06 ,  H01L27/08 ,  H01L27/02 ,  H01L23/00 ,  H02H3/20 ,  H01L29/45 ,  H01L29/06 ,  H01L29/16 ,  H01L29/20 ,  H01L21/8252

CPC classification number: H02H1/04 ,  H01L21/50 ,  H01L21/8213 ,  H01L21/8252 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/96 ,  H01L27/0255 ,  H01L27/0605 ,  H01L27/0814 ,  H01L29/0661 ,  H01L29/1602 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/45 ,  H01L29/861 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13109 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81825 ,  H01L2924/10272 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/15192 ,  H01L2924/3025 ,  H02H3/20 ,  H01L2924/0105 ,  H01L2924/00

Abstract: A high temperature electronic system includes an electronics unit configured for exposure to an environment having a temperature greater than approximately 150.0° C. The remote electronics unit includes a transient voltage suppressor (TVS) assembly coupled in operative relationship with at least some electronic components of the electronics unit. The TVS assembly includes at least one TVS device comprising at least one of a punch-through wide band-gap semiconductor TVS die and an avalanche breakdown wide band-gap semiconductor TVS die encapsulated in a flip-chip package at least partially surrounding the die, and coupled to first and second electrodes exposed to a single side of the encapsulation.

Abstract translation: 高温电子系统包括被配置为暴露于温度大于约150.0℃的环境的电子单元。远程电子单元包括瞬态电压抑制器（TVS）组件，其与至少一些电子部件的操作关系耦合 电子单元。 TVS组件包括至少一个TVS装置，其包括穿透宽带隙半导体TVS管芯和封装在至少部分围绕管芯的倒装芯片封装的雪崩击穿宽带隙半导体TVS管芯中的至少一个， 并且耦合到暴露于封装的单侧的第一和第二电极。