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公开(公告)号：US11874189B2
公开(公告)日：2024-01-16
申请号：US17367250
申请日：2021-07-02
Applicant: Applied Materials, Inc.
Inventor： Chuang-Chia Lin , David Peterson , Philip Allan Kraus , Amir Bayati
CPC classification number: G01L19/0092 , H03H9/02015 , H03H9/02574 , H03H9/14502 , G01N29/022 , G01N2291/014
Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.
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公开(公告)号：US11564292B2
公开(公告)日：2023-01-24
申请号：US16586548
申请日：2019-09-27
Applicant: Applied Materials, Inc.
Inventor： James Carducci , Richard C. Fovell , Larry D. Elizaga , Silverst Rodrigues , Thai Cheng Chua , Philip Allan Kraus
Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
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公开(公告)号：US20230003598A1
公开(公告)日：2023-01-05
申请号：US17367250
申请日：2021-07-02
Applicant: Applied Materials, Inc.
Inventor： Chuang-Chia Lin , David Peterson , Philip Allan Kraus , Amir Bayati
Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.
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公开(公告)号：US11508558B2
公开(公告)日：2022-11-22
申请号：US16834814
申请日：2020-03-30
Applicant: Applied Materials, Inc.
Inventor： Timothy Joseph Franklin , Steven E. Babayan , Philip Allan Kraus
Abstract: Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a chill plate, a gas plate, and a gas distribution plate having a top surface and a bottom surface. A plurality of protruded features contacts the top surface of the gas distribution plate. A fastener and an energy storage structure is provided on the protruded features. The energy storage structure is compressed by the fastener and axially loads at least one of the protruded features to compress the chill plate, the gas plate and the gas distribution plate.
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公开(公告)号：US11325827B2
公开(公告)日：2022-05-10
申请号：US16985959
申请日：2020-08-05
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Joseph R. Johnson
IPC: B81C1/00 , H01L21/02 , G01N33/487 , G01N27/49 , H01L21/302
Abstract: Methods are provided for manufacturing well-controlled, solid-state nanopores and arrays thereof. In one aspect, methods for manufacturing nanopores and arrays thereof exploit a physical seam. One or more etch pits are formed in a topside of a substrate and one or more trenches, which align with the one or more etch pits, are formed in a backside of the substrate. An opening is formed between the one or more etch pits and the one or more trenches. A dielectric material is then formed over the substrate to fill the opening. Contacts are then disposed on the topside and the backside of the substrate and a voltage is applied from the topside to the backside, or vice versa, through the dielectric material to form a nanopore. In another aspect, the nanopore is formed at or near the center of the opening at a seam, which is formed in the dielectric material.
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Patent Agency Ranking
公开(公告)号：US11217443B2
公开(公告)日：2022-01-04
申请号：US16676097
申请日：2019-11-06
Applicant: Applied Materials, Inc.
Inventor： Vinayak Veer Vats , Hang Yu , Philip Allan Kraus , Sanjay G. Kamath , William John Durand , Lakmal Charidu Kalutarage , Abhijit B. Mallick , Changling Li , Deenesh Padhi , Mark Joseph Saly , Thai Cheng Chua , Mihaela A. Balseanu
IPC: H01L21/311 , H01L21/02 , H01J37/32 , C23C16/34 , C23C16/56
Abstract: Embodiments disclosed herein include methods of forming high quality silicon nitride films. In an embodiment, a method of depositing a film on a substrate may comprise forming a silicon nitride film over a surface of the substrate in a first processing volume with a deposition process, and treating the silicon nitride film in a second processing volume, wherein treating the silicon nitride film comprises exposing the film to a plasma induced by a modular high-frequency plasma source. In an embodiment, a sheath potential of the plasma is less than 100 V, and a power density of the high-frequency plasma source is approximately 5 W/cm2 or greater, approximately 10 W/cm2 or greater, or approximately 20 W/cm2 or greater.
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公开(公告)号：US20210327685A1
公开(公告)日：2021-10-21
申请号：US17359318
申请日：2021-06-25
Applicant: Applied Materials, Inc.
Inventor： Thai Cheng Chua , Christian Amormino , Hanh Nguyen , Kallol Bera , Philip Allan Kraus
IPC: H01J37/32
Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
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公开(公告)号：US20210287882A1
公开(公告)日：2021-09-16
申请号：US17338510
申请日：2021-06-03
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Thai Cheng Chua , Mani Subramani
IPC: H01J37/32 , H01J27/18 , H05H1/46 , C23C16/511 , C23C14/35
Abstract: Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.
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公开(公告)号：US11114282B2
公开(公告)日：2021-09-07
申请号：US16895904
申请日：2020-06-08
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Thai Cheng Chua , Christian Amormino , Dmitry A. Dzilno
Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.
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公开(公告)号：US20210100076A1
公开(公告)日：2021-04-01
申请号：US16586548
申请日：2019-09-27
Applicant: Applied Materials, Inc.
Inventor： James Carducci , Richard C. Fovell , Larry D. Elizaga , Silverst Rodrigues , Thai Cheng Chua , Philip Allan Kraus
Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
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