公开(公告)号：US10780447B2

公开(公告)日：2020-09-22

申请号：US15497814

申请日：2017-04-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Richard Fovell ,  Silverst Rodrigues ,  James D. Carducci

IPC: B05B1/24 ,  H01J37/32 ,  C23C16/455 ,  C23C16/44

Abstract: Apparatus for controlling thermal uniformity of a substrate-facing surface of a showerhead are provided herein. In some embodiments, a heat transfer system includes a heat transfer plate having a first diameter and a plurality of independent flow paths disposed within the heat transfer plate, each flow path having a first inlet and a first outlet; a supply conduit system having a second inlet fluidly coupled to a plurality of second outlets, wherein each second outlet is fluidly coupled to a corresponding first inlet of the heat transfer plate; and a return conduit system having a third outlet fluidly coupled to a plurality of third inlets, wherein each third inlet is fluidly coupled to a corresponding first outlet of the heat transfer plate, wherein the supply conduit system and the return conduit system are each disposed within an imaginary cylindrical projection above the heat transfer plate.

公开(公告)号：US12144090B2

公开(公告)日：2024-11-12

申请号：US18082452

申请日：2022-12-15

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H05B6/64 ,  H05B6/80

Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.

公开(公告)号：US20230135935A1

公开(公告)日：2023-05-04

申请号：US18082452

申请日：2022-12-15

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H05B6/64 ,  H05B6/80

Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.

公开(公告)号：US11881384B2

公开(公告)日：2024-01-23

申请号：US16586482

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Vladimir Knyazik ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32 ,  C23C16/511 ,  C23C16/455

CPC classification number: H01J37/3244 ,  C23C16/45559 ,  C23C16/45561 ,  C23C16/511 ,  H01J2237/334 ,  H01J2237/335 ,  H01J2237/3321

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.

公开(公告)号：US20210391149A1

公开(公告)日：2021-12-16

申请号：US16898259

申请日：2020-06-10

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Robert Moore ,  James Carducci ,  Richard Fovell ,  Sathya Swaroop Ganta ,  Karthikeyan Balaraman ,  Silverst Rodrigues

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

公开(公告)号：US12191118B2

公开(公告)日：2025-01-07

申请号：US18419389

申请日：2024-01-22

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Vladimir Knyazik ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/511

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.

公开(公告)号：US11564292B2

公开(公告)日：2023-01-24

申请号：US16586548

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H05B6/64 ,  H05B6/80

Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.

公开(公告)号：US20210100076A1

公开(公告)日：2021-04-01

申请号：US16586548

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H05B6/64 ,  H05B6/80

Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.

公开(公告)号：US12033835B2

公开(公告)日：2024-07-09

申请号：US16898259

申请日：2020-06-10

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Robert Moore ,  James Carducci ,  Richard Fovell ,  Sathya Swaroop Ganta ,  Karthikeyan Balaraman ,  Silverst Rodrigues

IPC: H01J37/32

CPC classification number: H01J37/32467 ,  H01J37/3222 ,  H01J37/3244 ,  H01J37/32513

Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

公开(公告)号：US20210098231A1

公开(公告)日：2021-04-01

申请号：US16586482

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Vladimir Knyazik ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.