公开(公告)号：US20210391149A1

公开(公告)日：2021-12-16

申请号：US16898259

申请日：2020-06-10

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Robert Moore ,  James Carducci ,  Richard Fovell ,  Sathya Swaroop Ganta ,  Karthikeyan Balaraman ,  Silverst Rodrigues

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

公开(公告)号：US12033835B2

公开(公告)日：2024-07-09

申请号：US16898259

申请日：2020-06-10

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Robert Moore ,  James Carducci ,  Richard Fovell ,  Sathya Swaroop Ganta ,  Karthikeyan Balaraman ,  Silverst Rodrigues

IPC: H01J37/32

CPC classification number: H01J37/32467 ,  H01J37/3222 ,  H01J37/3244 ,  H01J37/32513

Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.