公开(公告)号：US20160305025A1

公开(公告)日：2016-10-20

申请号：US15196751

申请日：2016-06-29

Applicant: Applied Materials, Inc.

Inventor： Soo Young CHOI ,  Robin L. TINER ,  Shinichi KURITA ,  John M. WHITE ,  Carl A. SORENSEN ,  Jeffrey A. KHO ,  Suhail ANWAR ,  Makoto INAGAWA ,  Gaku FURUTA

IPC: C23C16/509

CPC classification number: C23C16/5096 ,  C23C16/4585 ,  H01J37/32091 ,  H01J37/32174 ,  H01J37/32568 ,  H01L21/67069

Abstract: A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.

Abstract translation: 描述了一种用于提供用于两个电极之间的电流的电对称接地或返回路径的方法和装置。 该装置至少包括耦合到电极之一和处理室的侧壁和/或底部之间的射频（RF）装置。 该方法包括相对于另一个电极移动一个电极，并且基于使用耦合到侧壁和电极的RF器件中的一个或两个的位移电极实现接地返回路径，耦合到腔室的底部的RF器件和 电极或其组合。

公开(公告)号：US20160211162A1

公开(公告)日：2016-07-21

申请号：US14916676

申请日：2014-09-18

Applicant: APPLIED MATERIALS, INC.

Inventor： John M. WHITE ,  Zuoqian WANG

IPC: H01L21/683 ,  C23C16/458 ,  C23C14/50 ,  H01L21/677

CPC classification number: H01L21/6833 ,  C23C14/042 ,  C23C14/12 ,  C23C14/24 ,  C23C14/50 ,  C23C14/541 ,  C23C14/562 ,  C23C16/042 ,  C23C16/345 ,  C23C16/401 ,  C23C16/45578 ,  C23C16/4587 ,  C23C16/463 ,  C23C16/545 ,  F26B3/00 ,  F27B1/08 ,  H01L21/67109 ,  H01L21/6732 ,  H01L21/67706 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67742 ,  H05B3/03

Abstract: A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport within a processing system. A quick disconnect is coupled to the body and configured to trap a heat regulating medium in the reservoir heating/cooling reservoir when the body is decoupled from a source of heat regulating medium.

公开(公告)号：US20150364350A1

公开(公告)日：2015-12-17

申请号：US14834324

申请日：2015-08-24

Applicant: Applied Materials, Inc.

Inventor： John M. WHITE ,  Robin L. TINER

IPC: H01L21/67 ,  C23C14/22 ,  C23C16/46

CPC classification number: H01L21/67103 ,  C23C14/22 ,  C23C16/4586 ,  C23C16/46 ,  C23C16/463 ,  H01J2237/2001 ,  H01L21/67109

Abstract: A process chamber and a method for controlling the temperature of a substrate positioned on a substrate support assembly within the process chamber are provided. The substrate support assembly includes a thermally conductive body, a substrate support surface on the surface of the thermally conductive body and adapted to support a large area substrate thereon, one or more heating elements embedded within the thermally conductive body, and two or more cooling channels embedded within the thermally conductive body to be coplanar with the one or more heating elements. The cooling channels may be branched into two or more equal-length cooling passages being extended from a single point inlet and into a single point outlet to provide equal resistance cooling.

Abstract translation: 提供了处理室和用于控制位于处理室内的基板支撑组件上的基板的温度的方法。 衬底支撑组件包括导热体，导热体表面上的衬底支撑表面，并且适于支撑其上的大面积衬底，一个或多个嵌入导热体内的加热元件，以及两个或多个冷却通道 嵌入在导热体内以与一个或多个加热元件共面。 冷却通道可以分支成两个或更多个等长的冷却通道，其从单个点入口延伸到单个点出口以提供相等的电阻冷却。

公开(公告)号：US20150273490A1

公开(公告)日：2015-10-01

申请号：US14726067

申请日：2015-05-29

Applicant: Applied Materials, Inc.

Inventor： Jozef KUDELA ,  Jonghoon BAEK ,  John M. WHITE ,  Robin TINER ,  Suhail ANWAR ,  Gaku FURUTA

IPC: B05B1/18

CPC classification number: B05B1/185 ,  C23C16/45565 ,  C23C16/509 ,  C23C16/5096 ,  H01J37/3244 ,  H01J37/32532 ,  H01J37/32623 ,  H01J37/32651 ,  Y10T137/6851

Abstract: Embodiments of the invention generally include shield frame assembly for use with a showerhead assembly, and a showerhead assembly having a shield frame assembly that includes an insulator that tightly fits around the perimeter of a showerhead in a vacuum processing chamber. In one embodiment, a showerhead assembly includes a gas distribution plate and a multi-piece frame assembly that circumscribes a perimeter edge of the gas distribution plate. The multi-piece frame assembly allows for expansion of the gas distribution plate without creating gaps which may lead to arcing. In other embodiments, the insulator is positioned to be have the electric fields concentrated at the perimeter of the gas distribution plate located therein, thereby reducing arcing potential.

Abstract translation: 本发明的实施例通常包括用于喷头组件的屏蔽框架组件和具有屏蔽框架组件的喷头组件，所述屏蔽框架组件包括紧密配合在真空处理室中的喷头周边周围的绝缘体。 在一个实施例中，喷头组件包括气体分配板和环绕气体分布板的周边边缘的多片框架组件。 多件式框架组件允许气体分配板的膨胀而不产生可能导致电弧的间隙。 在其它实施例中，绝缘体被定位成具有集中在位于其中的气体分配板的周边的电场，从而减少电弧电势。