Abstract:
A bidirectional repeater and data multiplexer for serial data has A-side 12C port devices A1-A4 coupled to comparators 302-308 and pull-downs to ground 316-322. Comparator outputs are coupled responsive to select lines S1-S4 of N:1 Select 310 to terminal A1 of bidirectional control 210 to control pull-down to non-zero low voltage Vp 206 at B-side device B. An inverting comparator 208 coupled to terminal B1 of bidirectional control 210 responds to input threshold voltage Vt less than low voltage Vp, to prevent data lockup due to data flowback to devices A1-A4. Output data from comparator 208 is coupled responsive to select lines S1-S4 of 1:N Select 312 to control pull-downs 316-322. This selectively repeats routing of device A1-A4 data to device B. Data from device B is selectively routed to pull-downs of devices A1-A4.
Abstract:
A semiconductor memory device includes a switch circuit that inverts input data or output data when burn-in mode enable signals are activated or a control signal switch that inverts external control signals or internal control signals when burn-in mode enable signals are activated. A burn-in test method for the semiconductor memory device performs a pass/fail decision to determine whether the output data has passed or failed based on an inverted logical value of the input data.
Abstract:
The present invention relates to a method for fabricating a recessed gate structure. The method includes the steps of: selectively etching a substrate to form a plurality of openings; forming a gate oxide layer on the openings and the substrate; forming a first conductive silicon layer on the gate oxide layer to form a plurality of valleys at a height equal to or greater than a thickness remaining after an intended pattern is formed; planarizing the first conductive silicon layer until the thickness remaining after the intended pattern formation is obtained, so that the valleys are removed; forming a second conductive layer on a planarized first conductive silicon layer; and selectively etching the second conductive layer, the first conductive silicon layer and the gate oxide layer to form a plurality of the recessed gate structures.
Abstract:
Disclosed are a memory device and a method for fabricating the same. The memory device includes: a substrate provided with a trench; a bit line contact junction formed beneath the trench; a plurality of storage node contact junctions formed outside the trench; and a plurality of gate structures each being formed on the substrate disposed between the bit line contact junction and one of the storage node contact junctions. Each sidewall of the trench becomes a part of the individual channels and thus, channel lengths of the transistors in the cell region become elongated. Accordingly, the storage node contact junctions have a decreased level of leakage currents, thereby increasing data retention time.
Abstract:
An after-image prevention apparatus and method for a plasma display panel having a plurality of address electrodes and a plurality of scan and sustain electrodes arranged in pairs and in a zigzag pattern. An average signal level until the current frame from currently input picture data and an average signal level of each cell until the previous frame as stored in a memory section is calculated. The average signal level is compared with the picture data. An attenuation coefficient is generated corresponding to the difference between the average signal level and the picture data. The picture data is multiplied by the attenuation coefficient to output correction data, thereby preventing an after-image phenomenon on the plasma display panel.
Abstract:
The present invention facilitates serial communication by performing duty cycle correction. A duty cycle correction component 302 performs duty cycle corrections on a pair of differential sinusoidal signals according to a pair of adjustment signals and, as a result, generates a differential pair of square wave signals. A cross coupled buffer 306 buffers the differential pair of square wave signals and provides the buffered signals to a feedback circuit 304 that measures duty cycles of the signals and generates the pair of adjustment signals accordingly. The buffer 306 can also remove skew from the signals. In a transmitter 102, the buffered signals are also generally provided to a multiplexer 112 or encoder and in a receiver 106, the buffered signals are also generally provided to a sampling component 122.
Abstract:
A memory allocation method and apparatus is disclosed in which the macro blocks are grouped into a plurality block sets and stored in the memory as block set. By grouping and storing the macro blocks, an efficient reading of the data is achieved.
Abstract:
A method for detecting operational errors in a tester of a test system for determining whether a semiconductor device is good or failed includes a diagnostic test having the step of periodically inputting data to the device and checking whether the data can be retrieved intact from the tester. If not, then an operational error may be present in the tester. The method requires that the diagnostic test be carried out after a predetermined number of devices has been tested, and that the data inputted to the device during the diagnostic test be inputted to every I/O pin of the device. The diagnostic test includes inputting a value of 0 to each I/O pin, and then comparing the output of the device to a predetermined expected value. The diagnostic test also includes inputting a value of 1 to each I/O pin, and similarly comparing the output to an expected value.
Abstract:
A method for fabricating a nonvolatile memory device is provided. The method includes forming a transistor including an impurity region formed in a substrate, forming a first interlayer insulation layer covering the transistor, the first interlayer insulation layer including a protrusion overlapping the impurity region, and forming an information storage unit on the protrusion, the information storage unit exposing side surfaces of the protrusion using point cusp magnetron-physical vapor deposition (PCM-PVD) and electrically connected to the impurity region.
Abstract:
An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate; a device attached on a top surface of the substrate; a mold encapsulating the device, the mold having a through via and a recessed pattern characterized by being formed in a single process; and a conductive via in the through via and a conductive pattern in the recessed pattern characterized by being formed in another single process.