公开(公告)号：US20050208736A1

公开(公告)日：2005-09-22

申请号：US11082112

申请日：2005-03-16

申请人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

发明人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC分类号： C09J7/02 ,  C09J133/00 ,  C09J201/00 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L23/52 ,  H01L21/78 ,  H01L21/50

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512

摘要： The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)

摘要翻译： 本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中 在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。 在23℃下，在与工件附着区域（3a）相对应的区域（2a）和对应于另一区域（3b）的一部分或全部的区域（2b）之间是不同的， 剥离粘合剂层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂的粘合性 层（2a）到芯片粘合层（3）的面积不高于2.3N / 25mm。 因此，即使工作较薄，也可以提供切割/切断/芯片接合薄膜，其与切片粘合剂层一起在切割薄片时的保持性和切割的切片加工的脱模性之间的平衡优异。

公开(公告)号：US20050153129A1

公开(公告)日：2005-07-14

申请号：US11038147

申请日：2005-01-21

申请人： Yoshinori Yoshida ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

发明人： Yoshinori Yoshida ,  Yohei Maeno ,  Kouji Akazawa ,  Takeshi Matsumura ,  Tomokazu Takahashi

IPC分类号： B32B27/08 ,  C09J7/02 ,  H01L21/68 ,  B32B9/00 ,  B32B33/00 ,  B32B7/12 ,  B32B15/04

CPC分类号： B32B27/08 ,  B32B7/12 ,  B32B2307/748 ,  B32B2405/00 ,  C09J7/29 ,  C09J2201/162 ,  C09J2433/006 ,  C09J2475/006 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6839 ,  Y10T428/28 ,  Y10T428/2848

摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

摘要翻译： 公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。

公开(公告)号：US20050139973A1

公开(公告)日：2005-06-30

申请号：US11012998

申请日：2004-12-15

申请人： Takeshi Matsumura ,  Masayuki Yamamoto

发明人： Takeshi Matsumura ,  Masayuki Yamamoto

IPC分类号： C09J7/02 ,  C09J201/00 ,  H01L21/301 ,  H01L21/52 ,  H01L21/58 ,  H01L21/66 ,  H01L21/68 ,  H01L23/544 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02

CPC分类号： H01L21/6836 ,  H01L22/20 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00

摘要： A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

摘要翻译： 切割芯片接合膜具有支撑基板，形成在支撑基板上的粘合层，以及形成在粘合剂层上的芯片接合粘合剂层，并且还具有用于识别芯片粘合粘合剂层的位置的标记。 可以提供一种切割芯片接合膜，其中在半导体晶片和切割芯片接合膜彼此粘合的情况下，可以识别膜中的芯片粘合粘合剂层的位置。

公开(公告)号：US20050031861A1

公开(公告)日：2005-02-10

申请号：US10912615

申请日：2004-08-05

申请人： Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

发明人： Takeshi Matsumura ,  Kouji Akazawa ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

IPC分类号： B32B7/12 ,  C09J7/02 ,  C09J9/00 ,  C09J133/00 ,  C09J201/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

CPC分类号： C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  Y10T156/1052 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2848

摘要： The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.

摘要翻译： 本发明的可再剥离粘合片是可再剥离的粘合片，其包含在基膜上形成的粘合剂层，并且还包括在基膜和 粘合剂层，中间层在23℃下的储能弹性模量（G'）为3.0×10 4至1​​.0×10 8 Pa，储存弹性模量（G'）为1.0×10 3至 在200℃下为8.0×10 4 Pa。即使这种可再剥离粘合片和半导体晶片彼此粘合并且它们被放置在加热环境中，也可以防止晶片 从扭曲。

公开(公告)号：US06558019B2

公开(公告)日：2003-05-06

申请号：US10075307

申请日：2002-02-15

申请人： Shiro Iida ,  Takeshi Matsumura ,  Kenji Itaya ,  Nobuharu Hata

发明人： Shiro Iida ,  Takeshi Matsumura ,  Kenji Itaya ,  Nobuharu Hata

IPC分类号： F21V2900

CPC分类号： H01J61/32 ,  H01J61/34 ,  H01J61/56 ,  H01J61/72

摘要： A less costly bulb-shaped fluorescent lamp with improved assembly efficiency is provided which prevents the impairment of product quality due to the change in color of a holder or the slipping off of a fluorescent tube from the holder decreased in resin strength. The fluorescent lamp includes a set of fluorescent tubes, filament coils disposed at both ends of each fluorescent tube, a starter circuit for activating the fluorescent tubes, a holder for retaining the fluorescent tubes, and a case containing the starter circuit. The holder includes holes for receiving the fluorescent tubes, and a recess defined in a central portion of the holder and extended in the opposite direction of the fluorescent tubes.

公开(公告)号：US06456001B1

公开(公告)日：2002-09-24

申请号：US09498226

申请日：2000-02-03

申请人： Shiro Iida ,  Takeshi Matsumura ,  Kenji Itaya ,  Tetsuya Tahara

发明人： Shiro Iida ,  Takeshi Matsumura ,  Kenji Itaya ,  Tetsuya Tahara

IPC分类号： H01J162

CPC分类号： H01J5/62

摘要： A fluorescent lamp in which a connecting terminals of a lighting circuit board and lead wires of a fluorescent tube easily can be connected. The lamp includes a fluorescent tube, a holder holding the fluorescent tube, a lighting circuit board provided with a lighting circuit for lighting the fluorescent tube, and a case connected to the holder and housing the lighting circuit board. At the end portion of the lighting circuit board, V-shaped or Y-shaped cut-outs, which widen toward an outer side, are formed. In the vicinity of the inner narrow portion of the cut-outs, the connecting terminals connected to the lighting circuit are provided. On a side wall formed on the holder opposite to the fluorescent tube, V-shaped or Y-shaped cut-outs, which widen as the distance from said fluorescent tube increases, are provided, and the broad portion of the cut-outs of the holder and the broad portion of the cut-outs of the lighting circuit board are arranged facing each other. The lead wires of the fluorescent tube are connected to the connection terminals by welding.

摘要翻译： 一种荧光灯，其中可以容易地连接照明电路板的连接端子和荧光管的引线。 灯包括荧光管，保持荧光管的保持器，设置有用于点亮荧光管的点亮电路的照明电路板，以及连接到保持器并容纳照明电路板的壳体。 在照明电路板的端部，形成向外侧变宽的V形或Y形切口。 在切口的内部狭窄部分附近，设置连接到照明电路的连接端子。 在形成在与荧光管相对的保持架上的侧壁上，设置有与所述荧光管的距离变宽的V形或Y形切口，并且所述切口的大部分 并且照明电路板的切口的宽部被布置为彼此面对。 荧光管的引线通过焊接连接到连接端子。

公开(公告)号：US06431725B1

公开(公告)日：2002-08-13

申请号：US09588300

申请日：2000-06-07

申请人： Shiro Iida ,  Takeshi Matsumura ,  Kenji Itaya ,  Nobuharu Hata

发明人： Shiro Iida ,  Takeshi Matsumura ,  Kenji Itaya ,  Nobuharu Hata

IPC分类号： F21V2900

CPC分类号： H01J61/32 ,  H01J61/34 ,  H01J61/56 ,  H01J61/72

摘要： A less costly bulb-shaped fluorescent lamp with improved assembly efficiency is provided which prevents the impairment of product quality due to the change in color of a holder or the slipping off of a fluorescent tube from the holder decreased in resin strength. The fluorescent lamp includes a set of fluorescent tubes, filament coils disposed at both ends of each fluorescent tube, a starter circuit for activating the fluorescent tubes, a holder for retaining the fluorescent tubes, and a case containing the starter circuit. The holder includes holes for receiving the fluorescent tubes, and a recess defined in a central portion of the holder and extended in the opposite direction of the fluorescent tubes.

公开(公告)号：US6126772A

公开(公告)日：2000-10-03

申请号：US973984

申请日：1997-12-15

申请人： Takayuki Yamamoto ,  Tatsuya Kubozono ,  Yasuo Kihara ,  Yuji Okawa ,  Koichi Hashimoto ,  Takeshi Matsumura ,  Tatsuya Sekido ,  Masayuki Yamamoto ,  Chiaki Harada

发明人： Takayuki Yamamoto ,  Tatsuya Kubozono ,  Yasuo Kihara ,  Yuji Okawa ,  Koichi Hashimoto ,  Takeshi Matsumura ,  Tatsuya Sekido ,  Masayuki Yamamoto ,  Chiaki Harada

IPC分类号： B08B7/00 ,  G03F7/34 ,  G03F7/42 ,  B32B35/00

CPC分类号： H01L21/6836 ,  B08B7/0028 ,  G03F7/346 ,  G03F7/42 ,  G03F7/34 ,  H01L2221/68327 ,  Y10S156/922 ,  Y10T156/11

摘要： An object is to peel off a disused resist from an article, e.g., a silicon wafer, with an adhesive sheet while preventing impurities contained in the adhesive sheet from transferring to the surface of the article, e.g., wafer, and from thus arousing electrical troubles resulting in problems such as decreases in the yield and reliability of the article. A method for resist removal comprising forming an adhesive layer on an article on which a resist is present and peeling the adhesive layer as a united sheet including the resist material from the article, characterized in that the adhesive layer has been regulated so as to have a modulus of elasticity of 1 Kg/mm.sup.2 or higher in the peeling, and an adhesive or an adhesive sheet both for use in the method.

摘要翻译： PCT No.PCT / JP96 / 01621 Sec。 371 1997年12月15日第 102（e）日期1997年12月15日PCT提交1996年6月13日PCT公布。 出版物WO97 / 00534 日期1997年1月3日目的在于，使用粘合片从物品（例如硅晶片）上剥离未使用的抗蚀剂，同时防止粘合片中所含的杂质转移到制品的表面，例如晶片，以及 从而引起电气故障，导致制品的产量和可靠性降低等问题。 一种抗蚀剂去除方法，包括在其上存在抗蚀剂的制品上形成粘合剂层，并将粘合层作为包含抗蚀剂材料的联合薄片从制品上剥离，其特征在于粘合剂层被调节成具有 剥离时的弹性模量为1Kg / mm 2以上，以及用于该方法的粘合剂或粘合片。

公开(公告)号：USD421138S

公开(公告)日：2000-02-22

申请号：US98264

申请日：1998-12-24

申请人： Masayoshi Kato ,  Takeshi Matsumura ,  Shiro Iida

设计人： Masayoshi Kato ,  Takeshi Matsumura ,  Shiro Iida

公开(公告)号：USD415294S

公开(公告)日：1999-10-12

申请号：US98280

申请日：1998-12-24

申请人： Masayoshi Kato ,  Takeshi Matsumura ,  Shiro Iida

设计人： Masayoshi Kato ,  Takeshi Matsumura ,  Shiro Iida