发明申请
- 专利标题： Re-peelable pressure-sensitive adhesive sheet
- 专利标题（中）： 可再剥离的压敏粘合片
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申请号： US10912615申请日： 2004-08-05
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公开(公告)号： US20050031861A1公开(公告)日： 2005-02-10
- 发明人: Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
- 申请人： Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
- 优先权： JP2003-206670 20030808
- 主分类号： B32B7/12
- IPC分类号： B32B7/12 ; C09J7/02 ; C09J9/00 ; C09J133/00 ; C09J201/00 ; H01L21/301 ; H01L21/304 ; H01L21/68 ; H01L21/683
摘要：
The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.
公开/授权文献
- US07514143B2 Re-peelable pressure-sensitive adhesive sheet 公开/授权日：2009-04-07
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