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公开(公告)号：US3252798A
公开(公告)日：1966-05-24
申请号：US40564464
申请日：1964-10-02
申请人： PHILIPS CORP
IPC分类号： G03C5/58
CPC分类号： G03C5/58
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32.发明授权Method of manufacturing, by photographic means, external, electrically conductive noble-metal patterns on non-metallic, electrically non-conductive, macromolecular supports and products obtained by these methods 失效通过照相方法制造在非金属，非导电的大分子载体上的外部导电的贵金属图案和通过这些方法获得的产品的方法
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公开(公告)号：US09034419B2
公开(公告)日：2015-05-19
申请号：US12341811
申请日：2008-12-22
IPC分类号： B05D7/00 , H05K9/00 , C03C17/10 , C03C17/36 , G03C5/58 , H01J9/20 , H01J11/44 , H01J29/86 , H05K3/10 , G02F1/1333 , G03C1/08
CPC分类号： H05K9/0096 , C03C17/10 , C03C17/36 , C03C17/3676 , C03C2217/256 , C03C2217/445 , C03C2217/475 , C03C2217/93 , C03C2218/11 , G02F2001/133334 , G03C1/08 , G03C5/58 , H01J9/205 , H01J11/44 , H01J29/868 , H01J2211/446 , H01J2229/8636 , H01J2329/869 , H05K3/106 , Y10T428/24273 , Y10T428/24802 , Y10T428/26 , Y10T442/10 , Y10T442/109 , Y10T442/112 , Y10T442/164
摘要： A silver salt-containing layer containing a silver salt and provided on a support is exposed and developed to form a metal silver portion and a light-transmitting portion, and then the metal silver portion is further subjected to physical development and/or plating to form a conductive metal portion consisting of the metal silver portion carrying conductive metal particles. A method for producing a light-transmitting electromagnetic wave-shielding film which enables production of an electromagnetic wave-shielding material simultaneously having high EMI-shielding property and high transparency in a fine line pattern and also enables mass production of such films at a low cost, and a light-transmitting electromagnetic wave-shielding film obtained by the production method and free from the problem of moire are provided.
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公开(公告)号：US20080286701A1
公开(公告)日：2008-11-20
申请号：US11749800
申请日：2007-05-17
申请人： David L. Rath , Emanuel I. Cooper
发明人： David L. Rath , Emanuel I. Cooper
CPC分类号： H01L21/32134 , C23F1/14 , C23F1/18 , C23F1/34
摘要： An etching composition, particularly for kinetically controlled etching of copper and copper alloy surfaces; a process for etching copper and copper alloys, particularly for etching at high rates to provide uniform and smooth, isotropic surfaces; an etched copper or copper alloy surface obtained by the process; and a process for generating copper or copper alloy electrical interconnects or contact pads. The etching composition and etching processes provide a smooth, isotropic fast etch of copper and copper alloys for semiconductor fabrication and packaging.
摘要翻译： 蚀刻组合物，特别用于铜和铜合金表面的动态控制蚀刻; 蚀刻铜和铜合金的方法，特别是用于高速蚀刻以提供均匀和光滑的各向同性表面的方法; 通过该方法获得的蚀刻铜或铜合金表面; 以及用于产生铜或铜合金电互连或接触焊盘的工艺。 蚀刻组合物和蚀刻工艺提供用于半导体制造和封装的铜和铜合金的平滑，各向同性的快速蚀刻。
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35.发明授权
公开(公告)号：US5656415A
公开(公告)日：1997-08-12
申请号：US609803
申请日：1996-03-01
CPC分类号： G03C5/3053 , G03C5/30
摘要： A novel inorganic composition for developing silver halide photographic products has improved stability in air. The composition comprises at least one oxidizable metallic ion, ethylenediamine tetraacetic acid and at least one additional complexing agent of formula (I): ##STR1## wherein R.sup.1 and R.sup.2 are each independently a hydrogen atom, an alkyl group of 1 to 10 carbon atoms, a hydroxyl group, or a hydroxyalkyl group, R.sup.3 is --COOM wherein M is hydrogen or a counter-ion such as lithium, sodium or potassium, or --CONR.sup.4 R.sup.5 wherein R.sup.4 and R.sup.5 are each independently a hydrogen atom, an alkyl group of 1 to 10 carbon atoms, and n, p and q are independently 1, 2 or 3.
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36.发明授权
公开(公告)号：US5478693A
公开(公告)日：1995-12-26
申请号：US250447
申请日：1994-05-27
申请人： Hiroyuki Hirai
发明人： Hiroyuki Hirai
CPC分类号： G03C8/408
摘要： The present invention provides a diffusion transfer heat-developable color photographic light-sensitive material comprising a support having thereon at least one light-sensitive silver halide emulsion layer and a nondiffusing dye-providing compound which releases or forms a diffusive dye in response to or in counter response to a reaction by which a silver halide is reduced to silver under the presence of a reducing agent, and an organic solid pigment in at least one of light-sensitive silver halide emulsion layer and the layer(s) adjacent thereto, and a method for forming a color image using the light-sensitive material.
摘要翻译： 本发明提供了一种扩散转移热显影彩色照相感光材料，其包括其上具有至少一个感光卤化银乳剂层的支持体和不依赖于染料的化合物，其响应于或在其中释放或形成扩散染料 在还原剂存在下将卤化银还原为银的反应的反应反应，以及在感光卤化银乳剂层和与其相邻的层中的至少一种中的有机固体颜料，以及 使用感光材料形成彩色图像的方法。
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公开(公告)号：US5314725A
公开(公告)日：1994-05-24
申请号：US18560
申请日：1993-02-17
申请人： Shinya Morishita
发明人： Shinya Morishita
CPC分类号： C23C18/31 , C23C18/1865 , C23C18/1868 , C23C18/1889 , C23C18/1893 , G03C5/58 , H05K3/185
摘要： A process for photo-plating only a light-irradiated portion of a dye layer formed on a substrate comprises: forming a dye layer on the surface of a substrate; immersing the substrate with the dye layer into an electroless plating solution comprising a sacrificial reagent for supplying electrons by irreversible oxidative decomposition, and at least one of copper ions, nickel ions, cobalt ions, and tin ions; and irradiating the surface of the dye layer with light having an energy higher than the excitation energy of the dye in the dye layer. A thick coating containing at least one of copper, nickel, cobalt, and tin can be formed with excellent adhesion strength only on the light-irradiated portion of the dye layer formed on the substrate.
摘要翻译： 仅对形成在基板上的染料层的光照射部分进行光电镀的工艺包括：在基板的表面上形成染料层; 将具有染料层的基板浸入包含用于通过不可逆氧化分解提供电子的牺牲试剂和铜离子，镍离子，钴离子和锡离子中的至少一种的化学镀溶液; 并且用染料层中具有比染料的激发能量高的能量的光照射染料层的表面。 只有在形成在基板上的染料层的光照射部分上，才能形成含有铜，镍，钴和锡中的至少一种的厚涂层。
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38.发明授权Multilayer photoresist comprising poly-(vinylbenzoic acid) as a planarizing layer 失效包含聚（乙烯基苯甲酸）作为平坦化层的多层光致抗蚀剂
公开(公告)号：US5260172A
公开(公告)日：1993-11-09
申请号：US808999
申请日：1991-12-17
申请人： Hiroshi Ito
发明人： Hiroshi Ito
CPC分类号： G03F7/094
摘要： The present invention relates to an improved process for forming a multilayer resist image comprising a planarizing layer of poly(vinylbenzoic acid).
摘要翻译： 本发明涉及一种用于形成包含聚（乙烯基苯甲酸）平坦化层的多层抗蚀剂图像的改进方法。
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公开(公告)号：US5260170A
公开(公告)日：1993-11-09
申请号：US461857
申请日：1990-01-08
申请人： Vernon L. Brown
发明人： Vernon L. Brown
CPC分类号： H05K3/465 , G03F7/002 , G03F7/0035 , H05K3/4661 , H05K2201/0236 , H05K2201/0376 , H05K2201/09563 , H05K2203/1157 , H05K2203/125 , H05K3/0023 , H05K3/184
摘要： A dielectric layered sequentially processed circuit board is disclosed. A first photodefinable resin containing an electroless plating catalyst is disposed on a substrate and portions of the substrate are exposed through the first resin. A second photodefinable resin absent the electroless plating catalyst is disposed on the first resin, and portions coincident with the exposed portions of the substrate as well as portions of the first resin are exposed through the second resin. A conductive material is deposited on the exposed portions of the substrate and the exposed portions of the first resin.
摘要翻译： 公开了一种电介质层状顺序处理电路板。 含有化学镀催化剂的第一光可固化树脂设置在基材上，并且基板的部分通过第一树脂曝光。 没有化学镀催化剂的第二光可固化树脂设置在第一树脂上，并且与基板的暴露部分重合的部分以及第一树脂的部分通过第二树脂暴露。 导电材料沉积在基板的暴露部分和第一树脂的暴露部分上。
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公开(公告)号：US5206122A
公开(公告)日：1993-04-27
申请号：US662586
申请日：1991-02-28
CPC分类号： G01N33/585 , G03C5/58
摘要： A light-stable physical developer comprising a solution of silver ions, a desensitizing agent and a reducing agent. A method for the detection of one or more components of an aggregate formed between at least one specific binding agent and its corresponding bindable substance by labelling at least one component of said aggregate with a marker and contacting said aggregate with said light-stable physical developer, whereby under influence of the marker a metal particle is formed which can be detected. Further the invention also relates to products, e.g. a test-kit adapted for carrying out the above mentioned method.
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