公开(公告)号：US09580689B2

公开(公告)日：2017-02-28

申请号：US13811572

申请日：2011-07-22

Applicant: Nobuaki Kikyo ,  Hiroyuki Hirai

Inventor： Nobuaki Kikyo ,  Hiroyuki Hirai

IPC: C12N5/00 ,  C12N5/074 ,  C07K14/47 ,  C12N15/85

CPC classification number: C12N5/0696 ,  A01K2207/12 ,  A01K2227/105 ,  C07K14/4702 ,  C07K2319/71 ,  C12N15/8509 ,  C12N2501/602 ,  C12N2501/603 ,  C12N2501/604 ,  C12N2501/606 ,  C12N2506/1307 ,  C12N2510/00 ,  C12N2740/15041

Abstract: Described herein is a major breakthrough in nuclear reprogramming and induced pluripotent stem cell (iPSC) technology. Fusion of the powerful transcription activation domain (TAD) of MyoD to the Oct4 protein makes iPSCs generation faster, more efficient, purer, safer and feeder-free. Also, disclosed herein is the first report of the use of a TAD fused to a transcription factor as a method for making iPSCs. By combining transcription factors and TADs, this approach to nuclear reprogramming can have a range of applications from inducing pluriopotency to inducing transdifferentiation without transitioning through iPSCs.

Abstract translation: 这里描述的是核重新编程和诱导多能干细胞（iPSC）技术的重大突破。 将MyoD强大的转录激活结构域（TAD）融合到Oct4蛋白质中，使得iPSC生成更快，更有效，更纯净，更安全，更无饲料。 此外，本文公开的是使用与转录因子融合的TAD作为制备iPSC的方法的第一个报告。 通过组合转录因子和TAD，这种核重新编程方法可以具有诱导多能性诱导转分化而不通过iPSC过渡的应用范围。

公开(公告)号：US20130195812A1

公开(公告)日：2013-08-01

申请号：US13811572

申请日：2011-07-22

Applicant: Nobuaki Kikyo ,  Hiroyuki Hirai

Inventor： Nobuaki Kikyo ,  Hiroyuki Hirai

IPC: C12N5/071

CPC classification number: C12N5/0696 ,  A01K2207/12 ,  A01K2227/105 ,  C07K14/4702 ,  C07K2319/71 ,  C12N15/8509 ,  C12N2501/602 ,  C12N2501/603 ,  C12N2501/604 ,  C12N2501/606 ,  C12N2506/1307 ,  C12N2510/00 ,  C12N2740/15041

Abstract: Described herein is a major breakthrough in nuclear reprogramming and induced pluripotent stem cell (iPSC) technology. Fusion of the powerful transcription activation domain (TAD) of MyoD to the Oct4 protein makes iPSCs generation faster, more efficient, purer, safer and feeder-free. Also, disclosed herein is the first report of the use of a TAD fused to a transcription factor as a method for making iPSCs. By combining transcription factors and TADs, this approach to nuclear reprogramming can have a range of applications from inducing pluriopotency to inducing transdifferentiation without transitioning through iPSCs.

Abstract translation: 这里描述的是核重新编程和诱导多能干细胞（iPSC）技术的重大突破。 将MyoD强大的转录激活结构域（TAD）融合到Oct4蛋白质中，使得iPSC生成更快，更有效，更纯净，更安全，更无饲料。 此外，本文公开的是使用与转录因子融合的TAD作为制备iPSC的方法的第一个报告。 通过组合转录因子和TAD，这种核重新编程方法可以具有诱导多能性诱导转分化而不通过iPSC过渡的应用范围。

公开(公告)号：US20090130022A1

公开(公告)日：2009-05-21

申请号：US11916391

申请日：2006-06-06

Applicant: Junji Nishigaki ,  Hiroyuki Hirai ,  Masayoshi Kojima ,  Kazuhiro Aikawa

Inventor： Junji Nishigaki ,  Hiroyuki Hirai ,  Masayoshi Kojima ,  Kazuhiro Aikawa

IPC: A61B5/055 ,  A61K9/127

CPC classification number: A61K49/1812

Abstract: A liposome containing a phosphatidylcholine and a phosphatidylserine in combination as membrane components at a phosphatidylcholine:phosphatidylserine molar ratio of 3:1 to 1:2, and said liposome containing superparamagnetic particles having a mean particle size not less than 1 nm and not more than 50 nm. A means for selectively accumulating an MRI contrast medium in a lesion of a vascular disease caused by abnormal proliferation of vascular smooth muscle cells such as arteriosclerosis and restenosis after PTCA is provided.

Abstract translation: 含有磷脂酰胆碱和磷脂酰丝氨酸的磷脂酰丝氨酸组合为磷脂酰胆碱的膜组分：磷脂酰丝氨酸摩尔比为3:1至1:2，所述脂质体含有平均粒度不小于1nm且不大于50的超顺磁性颗粒 nm。 用于选择性地累积由血管平滑肌细胞的异常增殖引起的血管疾病的病变中的MRI造影剂的手段，所述血管病变由PTCA提供之后的动脉硬化和再狭窄引起。

公开(公告)号：US07462300B2

公开(公告)日：2008-12-09

申请号：US10982876

申请日：2004-11-08

Applicant: Hiroyuki Hirai ,  Keiko Sugihara ,  Junji Nishigaki

Inventor： Hiroyuki Hirai ,  Keiko Sugihara ,  Junji Nishigaki

IPC: C09K11/56 ,  B82B1/00 ,  C01G9/08

CPC classification number: C09K11/574 ,  B82Y15/00 ,  C09K11/584 ,  G01N33/582 ,  G01N33/588 ,  Y10S977/773 ,  Y10S977/786 ,  Y10S977/813 ,  Y10S977/824 ,  Y10S977/834 ,  Y10T428/2991

Abstract: A doped-type metal sulfide phosphor nanoparticle, whose surface is modified with a surface modifier, the surface modifier being a compound of formula [I]: HS-L-W  Formula [I] wherein L is a divalent linking group; and W is COOM or NH2, in which M is a hydrogen atom, an alkali metal atom, or NX4, in which X is a hydrogen atom or an alkyl group; a dispersion containing the nanoparticle; and a method of producing the nanoparticle or the dispersion.

Abstract translation: 掺杂型金属硫化物荧光体纳米颗粒，其表面用表面改性剂改性，表面改性剂为式[I]的化合物：<？in-line-formula description =“In-line Formulas”end =“lead” α> HS-LW式[I] <？in-line-formula description =“In-line formula”end =“tail”？>其中L是二价连接基团; W为COOM或NH 2，其中M为氢原子，碱金属原子或NX4，其中X为氢原子或烷基; 含有纳米颗粒的分散体; 以及制备纳米颗粒或分散体的方法。

公开(公告)号：US20080156736A1

公开(公告)日：2008-07-03

申请号：US11883742

申请日：2006-02-08

Applicant: Hiroyuki Hirai ,  Masayoshi Kojima

Inventor： Hiroyuki Hirai ,  Masayoshi Kojima

IPC: B03C1/02 ,  H01F1/42

CPC classification number: B03C1/01 ,  B82Y25/00 ,  H01F1/0054

Abstract: A magnetic composite body comprising magnetic nanoparticles having a number average particle diameter of 1 to 50 nm and having a compound represented by formula (I) fixed on their surfaces, and a method comprising bringing the magnetic composite body into contact with a test piece followed by magnetic separation: R1O—(CH(R2)CH2O)n-L-X   Formula (I) wherein R1 represents a hydrogen atom, an alkyl or alkenyl group having a carbon chain length of 1 to 20, or a substituted or unsubstituted, aryl or heterocyclic group; R2 represents a hydrogen atom or a methyl group; L may be present or not present, and, when L is present, L represents an alkylene or alkenylene group having a carbon chain length of 1 to 10 which may have a branched chain or a substituent; X represents a hydrogen atom, a carboxylic acid group, a phosphoric acid group, or a sulfonic acid group; and n represents an integer of 1 to 10

Abstract translation: 一种磁性复合体，其包含数均粒径为1〜50nm的磁性纳米颗粒，并且具有固定在其表面上的式（I）表示的化合物，以及包括使磁性复合体与试验片接触的方法， 磁分离：<？in-line-formula description =“In-line Formulas”end =“lead”？> R O-（CH（R 2）2 CH 式（I）<？in-line-formula description =“In-line formula”end =“tail”？>其中R ^{1 表示氢原子，碳链长度为1-20的烷基或烯基，或取代或未取代的芳基或杂环基; R 2表示氢原子或甲基; L可以存在或不存在，并且当存在L时，L表示碳链长度为1至10的亚烷基或亚烯基，其可以具有支链或取代基; X表示氢原子，羧酸基，磷酸基或磺酸基; n表示1〜10的整数}

公开(公告)号：US07242591B2

公开(公告)日：2007-07-10

申请号：US10530518

申请日：2003-10-06

Applicant: Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

Inventor： Tatsuro Imamura ,  Yuji Yamaguchi ,  Kazuhiro Shinozaki ,  Satoshi Shibazaki ,  Yoshitaka Fukuoka ,  Hiroyuki Hirai ,  Osamu Shimada ,  Kenji Sasaoka ,  Kenichi Matsumura

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H05K1/023 ,  H05K1/186 ,  H05K3/3442 ,  H05K3/4602 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49798

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

Abstract translation: 提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。 所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触 电气/电子部件。

公开(公告)号：US20070125985A1

公开(公告)日：2007-06-07

申请号：US11647368

申请日：2006-12-29

Applicant: Hiroyuki Hirai ,  Keiko Sugihara ,  Junji Nishigaki

Inventor： Hiroyuki Hirai ,  Keiko Sugihara ,  Junji Nishigaki

IPC: C09K11/54 ,  C09K11/56

CPC classification number: C09K11/574 ,  B82Y15/00 ,  C09K11/584 ,  G01N33/582 ,  G01N33/588 ,  Y10S977/773 ,  Y10S977/786 ,  Y10S977/813 ,  Y10S977/824 ,  Y10S977/834 ,  Y10T428/2991

Abstract: A doped-type metal sulfide phosphor nanoparticle dispersion, comprising a doped-type metal sulfide phosphor nanoparticle dispersed in water and/or a hydrophilic solvent, wherein the doped-type metal sulfide phosphor nanoparticle comprises a surface that is modified with a surface modifier, the surface modifier being a compound represented by formula [I]: HS-L-W   Formula [I] wherein L represents a divalent linking group; and W represents COOM or NH2, in which M represents a hydrogen atom, an alkali metal atom, or NX4, in which X represents a hydrogen atom or an alkyl group.

Abstract translation: 掺杂型金属硫化物荧光体纳米颗粒分散体，其包含分散在水中的掺杂型金属硫化物荧光体纳米颗粒和/或亲水性溶剂，其中所述掺杂型金属硫化物荧光体纳米颗粒包括用表面改性剂改性的表面， 表面改性剂是由式[I]表示的化合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> HS-LW Formula [I] <？in-line-formula description = “In-line Formulas”end =“tail”？>其中L表示二价连接基团; W表示COOM或NH 2，其中M表示氢原子，碱金属原子或NX 4，其中X表示氢原子或烷基 。

公开(公告)号：US20070108415A1

公开(公告)日：2007-05-17

申请号：US11647369

申请日：2006-12-29

Applicant: Hiroyuki Hirai ,  Keiko Sugihara ,  Junji Nishigaki

Inventor： Hiroyuki Hirai ,  Keiko Sugihara ,  Junji Nishigaki

IPC: C09K11/08

CPC classification number: C09K11/574 ,  B82Y15/00 ,  C09K11/584 ,  G01N33/582 ,  G01N33/588 ,  Y10S977/773 ,  Y10S977/786 ,  Y10S977/813 ,  Y10S977/824 ,  Y10S977/834 ,  Y10T428/2991

Abstract: A doped-type metal sulfide phosphor nanoparticle dispersion, comprising a doped-type metal sulfide phosphor nanoparticle dispersed in a hydrophobic organic solvent, wherein the doped-type metal sulfide phosphor nanoparticle comprises a surface that is modified with a surface modifier, the surface modifier being a compound represented by formula [I]: HS-L-W  Formula [I] wherein L represents a divalent linking group; and W represents COOM or NH2, in which M represents a hydrogen atom, an alkali metal atom, or NX4, in which X represents a hydrogen atom or an alkyl group.

Abstract translation: 1.一种掺杂型金属硫化物荧光体纳米颗粒分散体，其包含分散在疏水性有机溶剂中的掺杂型金属硫化物荧光体纳米粒子，其中所述掺杂型金属硫化物荧光体纳米粒子包含用表面改性剂改性的表面，所述表面改性剂为 由式[I]表示的化合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> HS-LW Formula [I] <？in-line-formula description =“In- 线式“end =”tail“？>其中L表示二价连接基团; W表示COOM或NH 2，其中M表示氢原子，碱金属原子或NX 4，其中X表示氢原子或烷基 。

公开(公告)号：US07100276B2

公开(公告)日：2006-09-05

申请号：US11023499

申请日：2004-12-29

Applicant: Yoshitaka Fukuoka ,  Tooru Serizawa ,  Hiroshi Yagi ,  Osamu Shimada ,  Hiroyuki Hirai ,  Yuji Yamaguchi

Inventor： Yoshitaka Fukuoka ,  Tooru Serizawa ,  Hiroshi Yagi ,  Osamu Shimada ,  Hiroyuki Hirai ,  Yuji Yamaguchi

IPC: H05K3/36

CPC classification number: H05K1/162 ,  H05K1/095 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/09763 ,  H05K2203/0338 ,  H05K2203/1189 ,  Y10T29/4902 ,  Y10T29/49099 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.

Abstract translation: 公开了一种具有无源元件的布线板的制造方法。 制造方法包括在第一金属箔和第二金属箔的至少一个第一表面上涂覆电阻浆料和电介质浆料中的一种或两种，每个第一表面具有第一表面和第二表面; 布置具有热塑性和热固性的绝缘板，以便面对第一金属箔的第一表面，并且将第二金属箔的第一表面侧布置成面对不同于表面的表面 绝缘板的第一金属箔面; 通过对所配置的第一金属箔，绝缘板和第二金属箔进行堆叠，加压和加热来形成双面布线板，从而将它们集成; 以及图案化第一金属箔和/或第二金属箔。

公开(公告)号：US20060086925A1

公开(公告)日：2006-04-27

申请号：US11119923

申请日：2005-05-03

Applicant: Hiroyuki Hirai ,  Keiko Sugihara

Inventor： Hiroyuki Hirai ,  Keiko Sugihara

IPC: C09K11/08

CPC classification number: C09K11/025 ,  C09K11/565 ,  C09K11/574

Abstract: A nanoparticle fluorescent material of metal oxide or metal sulfide which is surface modified by a surface modification agent, wherein a half width of emission spectrum is 50 to 200 nm, and the surface modification agent is a compound represented by formula (I) or a degradation product thereof, and a dispersion of the same. M-(R)4  formula (I) In formula (I), M is an Si or Ti atom, and R is an organic group. The R groups may be the same or different from each other, but at least one R group is a group having reactivity with an affinity molecule.

Abstract translation: 由表面改性剂表面改性的金属氧化物或金属硫化物的纳米颗粒荧光体，发光光谱的半值宽度为50〜200nm，表面改性剂为式（I）所示的化合物或降解 其产物及其分散体。 <？in-line-formula description =“In-line Formulas”end =“lead”？M-（R）4式（I）<？in-line-formula description =“In 式（I）中，M为Si或Ti原子，R为有机基团。 R基可以相同或不同，但至少一个R基是与亲和分子具有反应性的基团。