HOT-MELT ADHESIVE COMPOSITION
    34.
    发明申请

    公开(公告)号:US20230026879A1

    公开(公告)日:2023-01-26

    申请号:US17786201

    申请日:2020-12-17

    申请人: BOSTIK SA

    摘要: The invention relates to a hot-melt adhesive composition, comprising at least one polyolefin polymer at a content from 5 to 90% by weight; at least one branched polypropylene at a content from 0.1 to 10% by weight; at least one tackifying resin at a content from 0.1 to 60% by weight; optionally, at least one styrene block copolymer from 0 to 30% by weight; optionally, at least one plasticizer at a content from 0 to 30% by weight; optionally, at least one stabilizer at a content from 0 to 5% by weight; and optionally, at least one wax at a content from 0 to 30% by weight. The invention further relates to the use of a branched polypropylene for reducing stringing of a hot-melt adhesive composition.

    ADHESIVE SHEET
    35.
    发明申请

    公开(公告)号:US20210309889A1

    公开(公告)日:2021-10-07

    申请号:US17269580

    申请日:2019-08-19

    摘要: Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of grinding accuracy, low contamination property, productivity, and fixing property. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains: a pressure-sensitive adhesive containing a base polymer; and a foaming agent having a foaming temperature of 90° C. or more, and wherein the pressure-sensitive adhesive sheet has, when a pressure-sensitive adhesive surface thereof is bonded to a silicon chip, a shear adhesive strength of 1.0 MPa or more under an ambient temperature of 25° C., and a shear adhesive strength of 0.2 MPa or more under an ambient temperature of 80° C.