摘要:
A photomask is provided having a stepped portion formed on at least one of a first and second areas corresponding to a stepped structure within an exposure area on the sensitive substrate onto which the pattern is to be exposed to make different height positions of the first and second areas of the pattern forming surface of the transparent substrate in the optical axis direction of the projection optical system. Also provides is an exposure method involving the step of shifting an image forming surface of a projection optical system in an optical axis direction corresponding to a stepped structure of an exposure area on a sensitive substrate. The image forming surface of the projection optical system coincides with the exposure area surface when exposing the pattern on an original substrate onto the sensitive substrate through the projection optical system. A projection exposure apparatus is also provided including a projection optical system for projecting and forming an image of a pattern on the original substrate on the sensitive substrate, and a stage for retaining the sensitive substrate so that the surface of the sensitive substrate is disposed close to the image forming surface. The exposure apparatus also has an image surface compensating member for shifting the image forming surface in the optical axis direction corresponding to the stepped structure.
摘要:
An image projection system for all surfaces of a three dimensional object such as a polyhedron in which direct and angle reflected image patterns are projected from superpositioned non-overlapping mask patterns mounted on different levels where the separation of the levels is related to the size of the object. The apparatus and process permits simultaneous photolithigraphic printing of conductors on the top and all sides of a cube shaped stack of integrated circuit chips.
摘要:
In order to perform micromachining of a precision smooth curved surface on a workpiece, light emitted from a mercury lamp is transmitted through a photomask, Fourier transform lens, aperture material, and inverse Fourier transform lens, after which it is beamed upon the workpiece material to be surface-machined and a positive photoresist layer which is formed on the surface of the workpiece material. By means of the foregoing structure, the high-frequency optical components which are included in the light emitted from the mercury lamp and which may cause roughening of curved-surface machining are made to converge at a location away from the optical axis and are removed by means of an aperture provided thereupon, with the only the residual low-frequency optical components being transmitted through the aperture, and so the intensity profile of the light which is beamed upon the positive photoresist layer is smoothed and a smooth-surface curved surface is transcribed to the positive photoresist layer.
摘要:
A projective exposure apparatus for imaging a pattern formed on an original onto a substrate at a predetermined magnification to form a pattern image on the substrate includes an original support member, a substrate support member, and a projection lens disposed between these support members for imaging the pattern onto the substrate. In the projection exposure apparatus, a partial deviation of positions of portions of the pattern image from regular positions are obtained in at least one of the directions along and perpendicular to a surface of the pattern image, and the partial deviation is eliminated by deforming at least one of the original and the substrate based on the thus obtained result.
摘要:
The deformable wafter chuck system includes a base with a recess having a diameter slightly smaller than the diameter of the wafer to be held. The base may have one or more orifices or channels running therethrough for distributing a vacuum to secure the wafer to the chuck, or it may have a plurality of clips attached at the rim of the chuck for holding the wafer. Attached to the chuck within the recess is a plurality of distortive actuators, such as piezoelectric crystals, which cause the wafer to be selectively deformed to assume arbitrary shapes, cancelling the warpage of the wafer to permit reduced distortion of the projected pattern. An interferometer system is included to combine light reflected from the wafer surface with a portion of incoming light modulated by a mask or reticle, thereby forming an interference pattern. The interference pattern is sued by a computer to determine warpage-induced distortions to activate the actuators to provide realtime correction of wafer flatness and also permits adjustment of depth of focus by varying heights of portions of the wafer.
摘要:
An exposure apparatus for use in the manufacture of semiconductor devices, for transferring an integrated circuit pattern of a reticle onto a semiconductor wafer by use of a projection lens optical system. A portion of the pattern of the reticle is irradiated with a light beam, and the light beam is scanningly deflected so that the whole of the pattern of the reticle is scanned with the light beam, whereby the pattern of the reticle is transferred onto the wafer. For compensation of a curvature of field of the projection lens optical system, the wafer is displaced in the direction of an optical axis of the projection lens optical system in accordance with the position of scan, on the reticle, whereby a high resolving power is assured over the entire surface of the reticle pattern. This allows enlargement of the pattern area of the reticle.
摘要:
A projection objective for imaging a pattern arranged in an object surface of the projection objective into an image surface of the projection objective with a demagnified imaging scale has a plurality of optical elements which are arranged along an optical axis of the projection objective and are configured in such a way that a defined image field curvature of the projection objective is set in such a way that an object surface that is curved convexly with respect to the projection objective can be imaged into a planar image surface. What can be achieved given a suitable setting of the object surface curvature is that a gravitation-dictated bending of a mask does not have a disturbing effect on the imaging quality.
摘要:
An extreme ultraviolet lithography (EUVL) system is disclosed. The system includes an extreme ultraviolet (EUV) mask with three states having respective reflection coefficient is r1, r2 and r3, wherein r3 is a pre-specified value that is a function of r1 and r2. The system also includes a nearly on-axis illumination (ONI) with partial coherence a less than 0.3 to expose the EUV mask to produce diffracted light and non-diffracted light. The system further includes a projection optics box (PUB) to remove a portion of the non-diffracted light and to collect and direct the diffracted light and the remaining non-diffracted light to expose a target.
摘要:
A method of obtaining information indicative of the topography of a surface of a flexible substrate, the method including directing a beam of radiation at the surface of the flexible substrate; and detecting changes in intensity distribution, or angle of reflection, of the beam of radiation after the beam of radiation has been reflected from the surface of the substrate to obtain information indicative of the topography of the surface of the flexible substrate.
摘要:
Various non-planar reflective lithography masks, systems using such lithography masks, and methods are disclosed. An embodiment is a lithography mask comprising a transparent substrate, a reflective material, and a reticle pattern. The transparent substrate comprises a curved surface. The reflective material adjoins the curved surface of the transparent substrate, and an interface between the reflective material and the transparent substrate is a reflective surface. The reticle pattern is on a second surface of the transparent substrate. A reflectivity of the reticle pattern is less than a reflectivity of the reflective material. Methods for forming similar lithography masks and for using similar lithography masks are disclosed.