Abstract:
Methods for forming a magneto-resistive memory device and a capacitor in an interconnect structure are disclosed herein. An exemplary method includes forming a first level interconnect metal layer and a second level interconnect metal layer of an interconnect structure. The method further includes simultaneously forming a first plurality of layers in a first region of the interconnect structure and a second plurality of layers in a second region of the interconnect structure, wherein the first plurality of layers and the second plurality of layers are disposed between the first level interconnect metal layer and the second level interconnect metal layer. The first plurality of layers is configured as a magneto-resistive memory device. The second plurality of layers is configured as the capacitor. The magneto-resistive memory device and the capacitor are each coupled to the first level interconnect metal layer and the second level interconnect metal layer.
Abstract:
A voltage regulator circuit is provided. The voltage regulator circuit includes a voltage regulator configured to provide an output voltage at an output terminal. A plurality of macros are connectable at a plurality of connection nodes of a connector connected to the output terminal of the voltage regulator. A feedback circuit having a plurality of feedback loops is connectable to the plurality of connection nodes. The feedback loop of the plurality of feedback loops, when connected to a connection node of the plurality of connection nodes, is configured to provide an instantaneous voltage of the connection node as a feedback to the voltage regulator. The voltage regulator is configured, in response to the instantaneous voltage, regulate the output voltage to maintain the instantaneous voltage of the connection node approximately equal to a reference voltage.
Abstract:
Methods for forming a magneto-resistive memory device and a capacitor in an interconnect structure are disclosed herein. An exemplary method includes forming a first level interconnect metal layer and a second level interconnect metal layer of an interconnect structure. The method further includes simultaneously forming a first plurality of layers in a first region of the interconnect structure and a second plurality of layers in a second region of the interconnect structure, wherein the first plurality of layers and the second plurality of layers are disposed between the first level interconnect metal layer and the second level interconnect metal layer. The first plurality of layers is configured as a magneto-resistive memory device. The second plurality of layers is configured as the capacitor. The magneto-resistive memory device and the capacitor are each coupled to the first level interconnect metal layer and the second level interconnect metal layer.
Abstract:
The present disclosure provides a semiconductor structure which includes a conductive layer and a resistance configurable structure over the conductive layer. The resistance configurable structure includes a first electrode, a resistance configurable layer over the first electrode, and a second electrode over the resistance configurable layer. The first electrode has a first sidewall, a second sidewall, and a bottom surface on the conductive layer. A joint between the first sidewall and the second sidewall includes an electric field enhancement structure. The present disclosure also provides a method for manufacturing the above semiconductor structure, including patterning a hard mask on a conductive layer; forming a spacer around the hard mask; removing at least a portion of the hard mask; forming a conforming resistance configurable layer on the spacer; and forming a second conductive layer on the conforming resistance configurable layer.
Abstract:
A device is configured to provide low dropout regulation. An amplifier stage includes a first transistor electrically connected to an output of the device, and a second transistor. A current mirror includes a third transistor electrically connected to the second transistor, and a fourth transistor electrically connected to the third transistor. The auxiliary current source has a control terminal electrically connected to a gate electrode of the fourth transistor. The pull down stage includes a fifth transistor having a gate electrode electrically connected to a drain electrode of the first transistor, and a sixth transistor having a gate electrode electrically connected to the gate electrode of the fourth transistor. The pull up transistor has a gate electrode electrically connected to a drain electrode of the fifth transistor. The first capacitor has a first terminal electrically connected to the gate electrode of the first transistor.
Abstract:
A device includes an amplifier stage, a source follower, a resistive device, and a transistor. The source follower has an input terminal electrically coupled to an internal node of the amplifier stage, and an output terminal electrically coupled to an input terminal of the amplifier stage and an output terminal of the device. The resistive device has a first terminal electrically coupled to the output terminal of the device. The transistor is electrically coupled to a second terminal of the resistive device and the amplifier stage.
Abstract:
A device includes a memory bit cell, a first current source, and a current comparator electrically connected to the memory bit cell and the first current source. A first transistor has a first terminal electrically connected to a first voltage supply node, a control terminal electrically connected to a controller, and a second terminal electrically connected to the memory bit cell and the current comparator. A sense amplifier is electrically connected to the current comparator and a reference current generator.
Abstract:
A device includes a memory bit cell, a first current source, and a current comparator electrically connected to the memory bit cell and the first current source. A first transistor has a first terminal electrically connected to a first voltage supply node, a control terminal electrically connected to a controller, and a second terminal electrically connected to the memory bit cell and the current comparator. A sense amplifier is electrically connected to the current comparator and a reference current generator.
Abstract:
A memory including a capacitor coupled to a write bit line or a word line and an initializer configured to initialize a voltage level at a first node between the capacitor and the write bit line or the word line. The memory further includes a controllable initial level adjuster configured to adjust a voltage level of a second node at one terminal of the capacitor in response to a pulse. The capacitor is configured to receive a boost signal at a third node at a terminal opposite the first node. The boost signal configured to change a voltage level of the write bit line or the word line in response to the boost signal.
Abstract:
A voltage regulator circuit is provided. The voltage regulator circuit includes a voltage regulator configured to provide an output voltage at an output terminal. A plurality of macros are connectable at a plurality of connection nodes of a connector connected to the output terminal of the voltage regulator. A feedback circuit having a plurality of feedback loops is connectable to the plurality of connection nodes. The feedback loop of the plurality of feedback loops, when connected to a connection node of the plurality of connection nodes, is configured to provide an instantaneous voltage of the connection node as a feedback to the voltage regulator. The voltage regulator is configured, in response to the instantaneous voltage, regulate the output voltage to maintain the instantaneous voltage of the connection node approximately equal to a reference voltage.