公开(公告)号：US11302592B2

公开(公告)日：2022-04-12

申请号：US16217016

申请日：2018-12-11

Applicant: MEDIATEK INC.

Inventor： Chi-Wen Pan ,  I-Hsuan Peng ,  Sheng-Liang Kuo ,  Yi-Jou Lin ,  Tai-Yu Chen

IPC: H01L23/16 ,  H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L25/03 ,  H01L23/04 ,  H01L25/00 ,  H01L25/18 ,  H01L23/538 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.

公开(公告)号：US20210074608A1

公开(公告)日：2021-03-11

申请号：US16989919

申请日：2020-08-11

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/16

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

公开(公告)号：US20200333193A1

公开(公告)日：2020-10-22

申请号：US16920583

申请日：2020-07-03

Applicant: MediaTek Inc.

Inventor： Chi-Wen Pan ,  Pei-Yu Huang ,  Sheng-Liang Kuo ,  Jih-Ming Hsu ,  Tai-Yu Chen ,  Yun-Ching Li ,  Wei-Ting Wang

IPC: G01K1/20 ,  G06F1/20 ,  G01K7/42 ,  G01K7/16 ,  G01K13/00

Abstract: The surface temperature of a portable device is estimated. The portable device includes a sensor for detecting the internal temperature of the portable device. The portable device also includes circuitry for estimating the surface temperature, using the internal temperature and an ambient temperature of the portable device as input to a circuit model. The circuit model describes thermal behaviors of the portable device. The circuitry is operative to identify a scenario in which the portable device operates, and determine the ambient temperature using the scenario and at least the internal temperature.

公开(公告)号：US09837595B2

公开(公告)日：2017-12-05

申请号：US14717159

申请日：2015-05-20

Applicant: MediaTek Inc.

Inventor： Long-Kun Yu ,  Chin-Chiang Chang ,  Chia-Wei Chi ,  Chia-Feng Yeh ,  Tai-Yu Chen

IPC: H02J7/04 ,  H02J7/16 ,  H01L35/32 ,  H01L23/498 ,  H01L35/28 ,  H01L21/66 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/00 ,  H01L25/04 ,  H02J7/00 ,  H01L23/38

CPC classification number: H01L35/32 ,  H01L22/34 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/38 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L25/04 ,  H01L35/28 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/18161 ,  H02J7/0052 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

公开(公告)号：US20170068261A1

公开(公告)日：2017-03-09

申请号：US15257022

申请日：2016-09-06

Applicant: MEDIATEK INC.

Inventor： Jih-Ming Hsu ,  Wei-Ting Wang ,  Tai-Yu Chen ,  Wen-Tsan Hsieh ,  Hong-Jie Huang ,  Pei-Yu Huang ,  Ming-Hsien Lee

IPC: G05D23/19 ,  G05B13/04

CPC classification number: G05D23/1917 ,  G06F1/206

Abstract: Methods and apparatus are provided for adaptive thermal slope control for dynamic thermal management. In one novel aspect, the device monitors and obtains sampling temperatures, calculates a thermal-slope index, determines whether the calculated thermal-slope index is greater than a predefined slope threshold, adjusts a power budget based on a thermal-slope algorithm, and applies the dynamic thermal management (DTM) adaptively based on the adjusted power budget. In one embodiment, fixed slope algorithm is used. The power budget is adjusted such that an adjusted slope of temperatures stays at a constant. In another embodiment, the time prediction algorithm is used. The power budget is adjusted such that a predicted time to reach a predefined thermal threshold stays a constant. In one embodiment, the time-prediction algorithm is a time-to-target-point (T2TP) algorithm. The T2TP is obtained using a linear equation or a LOG equation.

Abstract translation: 提供了用于动态热管理的自适应热边坡控制的方法和装置。 在一个新颖的方面，设备监测和获取采样温度，计算热斜率指数，确定计算的热斜率指数是否大于预定义的斜率阈值，基于热斜率算法调整功率预算，并应用 基于调整后的功率预算自动进行动态热管理（DTM）。 在一个实施例中，使用固定斜率算法。 调整功率预算，使得调整的温度斜率保持恒定。 在另一个实施例中，使用时间预测算法。 调整功率预算，使得达到预定义热阈值的预测时间保持不变。 在一个实施例中，时间预测算法是时间到目标点（T2TP）算法。 使用线性方程或LOG方程获得T2TP。

公开(公告)号：US11967570B2

公开(公告)日：2024-04-23

申请号：US17687350

申请日：2022-03-04

Applicant: MediaTek Inc.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01Q1/02 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L23/3672 ,  H01L23/3733 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/02 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/18161

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

公开(公告)号：US11640930B2

公开(公告)日：2023-05-02

申请号：US16989919

申请日：2020-08-11

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/16 ,  H01L23/00

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

公开(公告)号：US20220285297A1

公开(公告)日：2022-09-08

申请号：US17687350

申请日：2022-03-04

Applicant: MediaTek Inc.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/02 ,  H01Q1/22

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

公开(公告)号：US20220199593A1

公开(公告)日：2022-06-23

申请号：US17492693

申请日：2021-10-04

Applicant: MEDIATEK INC.

Inventor： Bo-Jiun Yang ,  Wen-Sung Hsu ,  Tai-Yu Chen ,  Shih-Chin Lin ,  Kun-Ting Hung

IPC: H01L25/10 ,  H01L25/065

Abstract: A semiconductor device includes a bottom package, a top package stacked on the bottom package, and an interposer disposed between the bottom package and the top package. The top package is electrically connected to the interposer through a plurality of peripheral solder balls. At least a dummy thermal feature is disposed on the interposer and surrounded by the plurality of peripheral solder balls.

公开(公告)号：US11302657B2

公开(公告)日：2022-04-12

申请号：US16802576

申请日：2020-02-27

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L27/14 ,  H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/02 ,  H01Q1/22

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.