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公开(公告)号：US10573579B2
公开(公告)日：2020-02-25
申请号：US15863984
申请日：2018-01-08
Applicant: MEDIATEK INC.
Inventor： Tai-Yu Chen , Wen-Sung Hsu , Sheng-Liang Kuo , Chi-Wen Pan , Jen-Chuan Chen
IPC: H01L23/433 , H01L25/18 , H01L23/367 , H01L23/16 , H01L23/36 , H01L23/00 , H01L25/065 , H01L23/538 , H01L23/373 , H01L23/498
Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.
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公开(公告)号：US12087664B2
公开(公告)日：2024-09-10
申请号：US18129061
申请日：2023-03-30
Applicant: MEDIATEK INC.
Inventor： Chia-Hao Hsu , Tai-Yu Chen , Sheng-Liang Kuo , Bo-Jiun Yang
IPC: H01L23/473 , H01L23/00 , H01L23/16
CPC classification number: H01L23/473 , H01L23/16 , H01L23/562 , H01L24/16 , H01L2224/16227 , H01L2924/3511
Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.
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公开(公告)号：US10739206B2
公开(公告)日：2020-08-11
申请号：US15859518
申请日：2017-12-30
Applicant: MediaTek Inc.
Inventor： Chi-Wen Pan , Pei-Yu Huang , Sheng-Liang Kuo , Jih-Ming Hsu , Tai-Yu Chen , Yun-Ching Li , Wei-Ting Wang
Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.
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公开(公告)号：US11640930B2
公开(公告)日：2023-05-02
申请号：US16989919
申请日：2020-08-11
Applicant: MEDIATEK INC.
Inventor： Chia-Hao Hsu , Tai-Yu Chen , Sheng-Liang Kuo , Bo-Jiun Yang
IPC: H01L23/473 , H01L23/16 , H01L23/00
Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.
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公开(公告)号：US10942067B2
公开(公告)日：2021-03-09
申请号：US16920583
申请日：2020-07-03
Applicant: MediaTek Inc.
Inventor： Chi-Wen Pan , Pei-Yu Huang , Sheng-Liang Kuo , Jih-Ming Hsu , Tai-Yu Chen , Yun-Ching Li , Wei-Ting Wang
Abstract: The surface temperature of a portable device is estimated. The portable device includes a sensor for detecting the internal temperature of the portable device. The portable device also includes circuitry for estimating the surface temperature, using the internal temperature and an ambient temperature of the portable device as input to a circuit model. The circuit model describes thermal behaviors of the portable device. The circuitry is operative to identify a scenario in which the portable device operates, and determine the ambient temperature using the scenario and at least the internal temperature.
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Patent Agency Ranking
公开(公告)号：US20190115269A1
公开(公告)日：2019-04-18
申请号：US16217016
申请日：2018-12-11
Applicant: MEDIATEK INC.
Inventor： Chi-Wen Pan , I-Hsuan Peng , Sheng-Liang Kuo , Yi-Jou Lin , Tai-Yu Chen
IPC: H01L23/16 , H01L23/367 , H01L23/538 , H01L23/00 , H01L25/065
Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.
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7.发明申请公开(公告)号：US20180245986A1
公开(公告)日：2018-08-30
申请号：US15859518
申请日：2017-12-30
Applicant: MediaTek Inc.
Inventor： Chi-Wen Pan , Pei-Yu Huang , Sheng-Liang Kuo , Jih-Ming Hsu , Tai-Yu Chen , Yun-Ching Li , Wei-Ting Wang
Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.
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公开(公告)号：US20180261528A1
公开(公告)日：2018-09-13
申请号：US15863984
申请日：2018-01-08
Applicant: MEDIATEK INC.
Inventor： Tai-Yu Chen , Wen-Sung Hsu , Sheng-Liang Kuo , Chi-Wen Pan , Jen-Chuan Chen
IPC: H01L23/433 , H01L25/18 , H01L23/367
Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.
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公开(公告)号：US20230238302A1
公开(公告)日：2023-07-27
申请号：US18129061
申请日：2023-03-30
Applicant: MEDIATEK INC.
Inventor： Chia-Hao Hsu , Tai-Yu Chen , Sheng-Liang Kuo , Bo-Jiun Yang
IPC: H01L23/473 , H01L23/16 , H01L23/00
CPC classification number: H01L23/473 , H01L23/16 , H01L23/562 , H01L24/16 , H01L2224/16227 , H01L2924/3511
Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.
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公开(公告)号：US11302592B2
公开(公告)日：2022-04-12
申请号：US16217016
申请日：2018-12-11
Applicant: MEDIATEK INC.
Inventor： Chi-Wen Pan , I-Hsuan Peng , Sheng-Liang Kuo , Yi-Jou Lin , Tai-Yu Chen
IPC: H01L23/16 , H01L23/367 , H01L25/065 , H01L23/00 , H01L25/10 , H01L25/03 , H01L23/04 , H01L25/00 , H01L25/18 , H01L23/538 , H01L23/498
Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.
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