公开(公告)号：US20170302782A1

公开(公告)日：2017-10-19

申请号：US15097429

申请日：2016-04-13

Applicant: MEDIATEK INC.

Inventor： Wei-Ting Wang ,  Han-Lin Li ,  Hong-Jie Huang

IPC: H04M1/725

CPC classification number: H04M1/72569 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296

Abstract: Methods and apparatus are provided for chip aware thermal policies. In one novel aspect, the thermal performance mapping information is generated. In one embodiment, the process obtains a set of process-dependent power data for each process corner of a semiconductor chip, profiles performance data, and selects an operating thermal policy based on the performance data. The thermal policy, based on the process-dependent power data is a mapping formula, or a combination of a mapping formula and a mapping table. In another novel aspect, chip aware thermal control is based on process-dependent power data of process corners. In one embodiment, the mapping information of process-dependent power data to a corresponding thermal policy is stored in a memory. A thermal policy is applied based on the stored mapping information and an obtained process corner information. The mapping information is applied every time the thermal policy is needed or at boot-up time.

公开(公告)号：US20170068261A1

公开(公告)日：2017-03-09

申请号：US15257022

申请日：2016-09-06

Applicant: MEDIATEK INC.

Inventor： Jih-Ming Hsu ,  Wei-Ting Wang ,  Tai-Yu Chen ,  Wen-Tsan Hsieh ,  Hong-Jie Huang ,  Pei-Yu Huang ,  Ming-Hsien Lee

IPC: G05D23/19 ,  G05B13/04

CPC classification number: G05D23/1917 ,  G06F1/206

Abstract: Methods and apparatus are provided for adaptive thermal slope control for dynamic thermal management. In one novel aspect, the device monitors and obtains sampling temperatures, calculates a thermal-slope index, determines whether the calculated thermal-slope index is greater than a predefined slope threshold, adjusts a power budget based on a thermal-slope algorithm, and applies the dynamic thermal management (DTM) adaptively based on the adjusted power budget. In one embodiment, fixed slope algorithm is used. The power budget is adjusted such that an adjusted slope of temperatures stays at a constant. In another embodiment, the time prediction algorithm is used. The power budget is adjusted such that a predicted time to reach a predefined thermal threshold stays a constant. In one embodiment, the time-prediction algorithm is a time-to-target-point (T2TP) algorithm. The T2TP is obtained using a linear equation or a LOG equation.

Abstract translation: 提供了用于动态热管理的自适应热边坡控制的方法和装置。 在一个新颖的方面，设备监测和获取采样温度，计算热斜率指数，确定计算的热斜率指数是否大于预定义的斜率阈值，基于热斜率算法调整功率预算，并应用 基于调整后的功率预算自动进行动态热管理（DTM）。 在一个实施例中，使用固定斜率算法。 调整功率预算，使得调整的温度斜率保持恒定。 在另一个实施例中，使用时间预测算法。 调整功率预算，使得达到预定义热阈值的预测时间保持不变。 在一个实施例中，时间预测算法是时间到目标点（T2TP）算法。 使用线性方程或LOG方程获得T2TP。

公开(公告)号：US09900424B2

公开(公告)日：2018-02-20

申请号：US15097429

申请日：2016-04-13

Applicant: MEDIATEK INC.

Inventor： Wei-Ting Wang ,  Han-Lin Li ,  Hong-Jie Huang

IPC: G08B17/00 ,  H04M1/725

CPC classification number: H04M1/72569 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296

Abstract: Methods and apparatus are provided for chip aware thermal policies. The thermal performance mapping information is generated. The process obtains a set of process-dependent power data for each process corner of a semiconductor chip, profiles performance data, and selects an operating thermal policy based on the performance data. The thermal policy, based on the process-dependent power data is a mapping formula, or a combination of a mapping formula and a mapping table. The chip aware thermal control is based on process-dependent power data of process corners. The mapping information of process-dependent power data to a corresponding thermal policy is stored in a memory. A thermal policy is applied based on the stored mapping information and an obtained process corner information. The mapping information is applied every time the thermal policy is needed or at boot-up time.