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125 条记录 (耗时 0.027 秒)

    Chip with internal signal routing in external element
    31.
    发明授权
    Chip with internal signal routing in external element 失效
    外部元件内部信号路由芯片

    公开(公告)号：US06365975B1

    公开(公告)日：2002-04-02

    申请号：US09053816

    申请日：1998-04-02

    申请人： Thomas H. DiStefano ,  John W. Smith

    发明人： Thomas H. DiStefano ,  John W. Smith

    IPC分类号： H01L2160

    CPC分类号： H01L23/52 ,  H01L23/498 ,  H01L23/538 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2924/1903 ,  H01L2924/3011 ,  H05K1/118

    摘要： A semiconductor chip is provided with a dielectric element having conductive features interconnecting electronic elements within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The conductive features on the dielectric element are connected to contacts on the chip by deformable conductive elements such as flexible leads so that the dielectric element remains movable with respect to the chip. The dielectric element may have a coefficient of expansion different from that of the chip itself.

    摘要翻译： 半导体芯片设置有具有将芯片内的电子元件彼此互连的导电特性的电介质元件。 导电特征取代内部导体，并且可以在芯片的元件之间提供增强的信号传播。 电介质元件上的导电特征通过诸如柔性引线的可变形导电元件连接到芯片上的触点，使得电介质元件能够相对于芯片保持可移动。 电介质元件可以具有与芯片本身的膨胀系数不同的膨胀系数。

    Bondable compliant pads for packaging of a semiconductor chip and method therefor
    35.
    发明授权
    Bondable compliant pads for packaging of a semiconductor chip and method therefor 失效
    用于封装半导体芯片的可焊接柔性焊盘及其方法

    公开(公告)号：US6030856A

    公开(公告)日：2000-02-29

    申请号：US872379

    申请日：1997-06-10

    申请人： Thomas H. DiStefano ,  Zlata Kovac ,  John W. Smith

    发明人： Thomas H. DiStefano ,  Zlata Kovac ,  John W. Smith

    IPC分类号： H01L21/58 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L24/32 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802

    摘要： A method of making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts and disposing a resilient element having one or more intermediary layers capable of being wetted by an adhesive between the microelectronic elements. The resilient element includes fibrous material, a fibrous matrix and/or voids formed at the intermediary layers thereof. An adhesive is provided between the intermediary layers and the microelectronic elements. The adhesive is then cured while it remains in contact with the intermediary layers for bonding the resilient element and the microelectronic elements. The electrically conductive parts are then bonded together to form electrical interconnections. A microelectronic package comprising a resilient element including one or more intermediary layers capable of being wetted by an adhesive is also provided.

    摘要翻译： 制造微电子封装的方法包括提供具有导电部件的第一和第二微电子元件，并且设置具有能够被微电子元件之间的粘合剂润湿的一个或多个中间层的弹性元件。 弹性元件包括在其中间层处形成的纤维材料，纤维基质和/或空隙。 在中间层和微电子元件之间提供粘合剂。 然后将粘合剂固化，同时粘合剂与中间层保持接触，用于粘合弹性元件和微电子元件。 然后将导电部件结合在一起以形成电互连。 还提供了包括能够被粘合剂润湿的一个或多个中间层的弹性元件的微电子封装。

    Connection component and method of making same
    39.
    发明授权
    Connection component and method of making same 有权
    连接组件及其制作方法

    公开(公告)号：US06306752B1

    公开(公告)日：2001-10-23

    申请号：US09396048

    申请日：1999-09-15

    申请人： Thomas H. DiStefano ,  Joseph Fjeslstad ,  John W. Smith

    发明人： Thomas H. DiStefano ,  Joseph Fjeslstad ,  John W. Smith

    IPC分类号： H01L214763

    CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/3114 ,  H01L2224/50

    摘要： A method of making a connection component for a microelectronic element includes providing a sheet comprising an electrically conductive layer, a photoresist layer overlying the conductive layer and a photoimageable dielectric layer disposed under the conductive layer. The method includes lithographically forming at least one opening in the photoresist layer to uncover a portion of the conductive layer, forming a plurality of circuit features from the conductive layer by removing the uncovered portion of the conductive layer, at least some of the circuit features being leads, and lithographically forming at least one aperture in the photoimageable dielectric layer.

    摘要翻译： 制造微电子元件的连接部件的方法包括提供包括导电层的片材，覆盖在导电层上的光致抗蚀剂层和设置在导电层下面的可光成像的电介质层。 该方法包括在光致抗蚀剂层中光刻形成至少一个开口以露出导电层的一部分，通过去除导电层的未覆盖部分从导电层形成多个电路特征，至少一些电路特征为 引线，并在光致成像介质层中光刻形成至少一个孔。