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公开(公告)号：US5688716A
公开(公告)日：1997-11-18
申请号：US653016
申请日：1996-05-24
申请人： Thomas H. DiStefano , John W. Smith , Tony Faraci
发明人： Thomas H. DiStefano , John W. Smith , Tony Faraci
IPC分类号： H01L21/30 , H01L21/48 , H01L23/22 , H01L23/48 , H01L23/498 , H01L23/64 , H05K1/11 , H05K3/36 , H05K3/40 , H01L21/44 , H01L21/60
CPC分类号： H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/642 , H01L24/72 , H05K3/4084 , H01L2224/16225 , H01L2224/45124 , H01L2224/73253 , H01L2224/81904 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H05K3/361
摘要： A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques assembly may include additional circuit elements such as capacitors used in conjunction with the chip.
摘要翻译： 包括芯片的封装半导体芯片和诸如散热器的封装元件通过将芯片上的触点之间的柔性引线和诸如片材或板之类的电介质元件上的端子连接并将片或板远离芯片 并且注入液体材料以形成填充封装元件和电介质元件之间的空间并且围绕引线的柔性层。 介质元件和封装元件向外延伸超过芯片的边缘，并物理保护芯片。 组件可以通过传统的表面安装技术来处理和安装，组件可以包括附加电路元件，例如与芯片结合使用的电容器。
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公开(公告)号：US5798286A
公开(公告)日：1998-08-25
申请号：US532528
申请日：1995-09-22
申请人： Tony Faraci , Thomas H. DiStefano , John W. Smith
发明人： Tony Faraci , Thomas H. DiStefano , John W. Smith
CPC分类号： H01L24/86 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/7965 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351
摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.
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公开(公告)号：US06365436B1
公开(公告)日：2002-04-02
申请号：US09712631
申请日：2000-11-14
申请人： Tony Faraci , Thomas H. Distefano , John W. Smith
发明人： Tony Faraci , Thomas H. Distefano , John W. Smith
IPC分类号： H01L2144
CPC分类号： H01L24/86 , H01L24/45 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/7965 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2224/48
摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.
摘要翻译： 多个单独的半导体芯片（每个具有接触表面和在该表面上的接触）被布置成阵列，使得接触表面面对并限定阵列的第一表面。 具有端子的柔性介电片覆盖在半导体芯片的第一或接触支承表面上。 细长引线设置在电介质元件和半导体芯片之间。 每个引线具有连接到电介质元件上的端子的第一端，以及连接到阵列中的半导体芯片上的触点的第二端。 所有的引线通过相对于彼此移动介质元件和阵列而同时形成，以同时相对于所有第二端移位引线的所有第一端。 介电元件在形成步骤之后被细分，以便将电介质元件的一个区域连接到每个芯片，从而形成各自包括一个芯片或少量芯片的单元。
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公开(公告)号：US6147400A
公开(公告)日：2000-11-14
申请号：US95251
申请日：1998-06-10
申请人： Tony Faraci , Thomas H. DiStefano , John W. Smith
发明人： Tony Faraci , Thomas H. DiStefano , John W. Smith
CPC分类号： H01L24/86 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/7965 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351
摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.
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公开(公告)号：US07166914B2
公开(公告)日：2007-01-23
申请号：US10876897
申请日：2004-06-25
申请人： Thomas H. DiStefano , John W. Smith , Tony Faraci
发明人： Thomas H. DiStefano , John W. Smith , Tony Faraci
IPC分类号： H01L23/34 , H01L29/0623 , H01L23/495 , H01L23/06 , H01L23/10
CPC分类号： H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/642 , H01L24/72 , H01L2224/16225 , H01L2224/45124 , H01L2224/73253 , H01L2224/81904 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H01L2924/00 , H01L2224/48
摘要： A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.
摘要翻译： 包括芯片的封装半导体芯片和诸如散热器的封装元件通过将芯片上的触点之间的柔性引线和诸如片材或板之类的电介质元件上的端子连接并将片或板远离芯片 并且注入液体材料以形成填充封装元件和电介质元件之间的空间并且围绕引线的柔性层。 介质元件和封装元件向外延伸超过芯片的边缘，并物理保护芯片。 组件可以通过常规的表面安装技术来处理和安装。 组件可以包括附加电路元件，例如与芯片结合使用的电容器。
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公开(公告)号：US06265765B1
公开(公告)日：2001-07-24
申请号：US08935962
申请日：1997-09-23
申请人： Thomas H. DiStefano , John W. Smith , Tony Faraci
发明人： Thomas H. DiStefano , John W. Smith , Tony Faraci
IPC分类号： H01L2302
CPC分类号： H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/642 , H01L24/72 , H01L2224/16225 , H01L2224/45124 , H01L2224/73253 , H01L2224/81904 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H01L2924/00 , H01L2224/48
摘要： A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.
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