公开(公告)号：US09391293B2

公开(公告)日：2016-07-12

申请号：US14142347

申请日：2013-12-27

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Seung Min Lee ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： H01L51/52 ,  C09J7/02 ,  C09J7/00 ,  C08K3/22 ,  C08K3/00 ,  C08K3/24 ,  C08K3/32

CPC分类号： H01L51/5246 ,  C08K3/013 ,  C08K3/22 ,  C08K3/24 ,  C08K3/32 ,  C08K2003/2227 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J11/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5259 ,  Y10T428/24942 ,  Y10T428/24959

摘要： An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process.

摘要翻译： 提供了用于封装有机电子二极管（OED）的粘合膜。 当封装有机电子二极管时，粘合膜可有效地防止湿气渗透到有机电子二极管的封装结构中，并且在适度条件下有效地执行封装工艺，而不会在封装过程中对有机电子二极管造成损害 。

公开(公告)号：US11370942B2

公开(公告)日：2022-06-28

申请号：US16547344

申请日：2019-08-21

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Kyung Yul Bae ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： H01L51/54 ,  C09J7/10 ,  C09J123/20 ,  C08K3/34 ,  H01L51/00 ,  C09J11/02 ,  H01L51/52 ,  H01L51/56

摘要： The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

公开(公告)号：US11091673B2

公开(公告)日：2021-08-17

申请号：US16432619

申请日：2019-06-05

申请人： LG CHEM, LTD.

发明人： So Young Kim ,  Seung Min Lee ,  Jung Sup Shim ,  Se Woo Yang

IPC分类号： C09J11/06 ,  C09J9/00 ,  C09J11/04 ,  C09J123/00 ,  C09J123/22 ,  C09J7/35 ,  C09J5/06

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

公开(公告)号：US20190382632A1

公开(公告)日：2019-12-19

申请号：US16547344

申请日：2019-08-21

申请人： LG CHEM, LTD.

发明人： Yoon Gyung CHO ,  Hyun Jee Yoo ,  Kyung Yul Bae ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： C09J123/20 ,  C08K3/34 ,  H01L51/00

摘要： The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

公开(公告)号：US20190359863A1

公开(公告)日：2019-11-28

申请号：US16533207

申请日：2019-08-06

申请人： LG CHEM, LTD.

发明人： So Young Kim ,  Seung Min Lee ,  Jung Sup Shim ,  Se Woo Yang

IPC分类号： C09J123/22 ,  H01L51/00 ,  B33Y70/00 ,  C08L33/04 ,  C08L75/04 ,  C08L63/00 ,  C08L101/02

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and excellent reliability at high temperature and high humidity, and an OED including the same.

公开(公告)号：US10421887B2

公开(公告)日：2019-09-24

申请号：US15560025

申请日：2016-03-24

申请人： LG CHEM, LTD.

发明人： So Young Kim ,  Seung Min Lee ,  Jung Sup Shim ,  Se Woo Yang

IPC分类号： H01L29/40 ,  H01L21/00 ,  C09J123/22 ,  C08L33/04 ,  C08L63/00 ,  C08L75/04 ,  C08L101/02 ,  B33Y70/00 ,  H01L51/00

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and excellent reliability at high temperature and high humidity, and an OED including the same.

公开(公告)号：US10227514B2

公开(公告)日：2019-03-12

申请号：US13899386

申请日：2013-05-21

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： H05B33/10 ,  C09J163/00 ,  C09J9/00 ,  C09J11/04 ,  C09J7/10 ,  C09J133/08 ,  C08K3/013 ,  C08K3/22 ,  C08K3/36 ,  C08K3/34

摘要： The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

公开(公告)号：US10141543B2

公开(公告)日：2018-11-27

申请号：US14323827

申请日：2014-07-03

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC分类号： B32B37/00 ,  H01L51/52 ,  H01L23/29 ,  H01L21/56 ,  B32B27/08 ,  B32B27/18 ,  H05B33/04 ,  B32B43/00 ,  H01L51/56 ,  B32B37/14 ,  C09D123/22 ,  C09D163/00 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

摘要： Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.

公开(公告)号：US10062855B2

公开(公告)日：2018-08-28

申请号：US14740006

申请日：2015-06-15

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong

IPC分类号： H01L33/00 ,  H01L29/08 ,  H01L51/00 ,  H01L21/00 ,  H01L51/52 ,  H05B33/04 ,  H01L51/56 ,  C09J7/00 ,  C09J163/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/00 ,  C09J9/00 ,  C09J11/04 ,  C09J7/35 ,  C09J7/10 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K3/16

CPC分类号： H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

摘要： An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

公开(公告)号：US09768386B2

公开(公告)日：2017-09-19

申请号：US14899978

申请日：2014-06-18

申请人： LG CHEM, LTD.

发明人： Jung Sup Shim ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Hyun Jee Yoo ,  Seung Min Lee ,  Kyung Yul Bae

IPC分类号： C08J5/18 ,  C08L23/22 ,  H01L51/00 ,  H01L51/52 ,  C08L101/02 ,  H01L23/29

CPC分类号： H01L51/004 ,  C08J5/18 ,  C08J2323/22 ,  C08J2423/30 ,  C08L23/22 ,  C08L101/02 ,  C08L2203/206 ,  C08L2205/02 ,  C08L2205/08 ,  H01L23/293 ,  H01L51/0043 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are provided a composition for encapsulation film, an encapsulation film, and an electronic device having the same. The present application may provide an encapsulation film having an excellent moisture barrier property, operability, workability, and durability and a structure including an element encapsulated by the encapsulation film.