公开(公告)号：US11267996B2

公开(公告)日：2022-03-08

申请号：US15931323

申请日：2020-05-13

申请人： LG CHEM, LTD.

发明人： Seung Min Lee ,  So Young Kim ,  Jung Sup Shim ,  Se Woo Yang

IPC分类号： C09J133/04 ,  C08L63/00 ,  C08L75/04 ,  C08L101/02 ,  C08L33/04 ,  C08L33/06 ,  C09J123/22 ,  H01L51/52

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

公开(公告)号：US10308842B2

公开(公告)日：2019-06-04

申请号：US14765482

申请日：2014-08-05

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Kyung Yul Bae ,  Min Soo Park ,  Jung Sup Shim ,  Hyun Jee Yoo

IPC分类号： C09J123/22 ,  C09J109/00 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  C09J9/00 ,  C09J4/00 ,  C09J7/00 ,  C09J133/08 ,  C09J145/00 ,  C09J7/20 ,  C09J7/10

摘要： Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

公开(公告)号：US10202525B2

公开(公告)日：2019-02-12

申请号：US14647365

申请日：2014-08-05

申请人： LG CHEM, LTD.

发明人： Sang Min Park ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Hyun Jee Yoo ,  Jung Sup Shim ,  Min Soo Park

IPC分类号： H01L51/00 ,  C09J109/00 ,  H01L51/56 ,  H01L51/52 ,  C09J9/00 ,  C09J4/00 ,  C09J7/00 ,  C09J123/22 ,  C09J133/08 ,  C09J145/00 ,  C09J7/20 ,  C09J7/10

摘要： Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

公开(公告)号：US10093785B2

公开(公告)日：2018-10-09

申请号：US14527182

申请日：2014-10-29

申请人： LG CHEM, LTD.

发明人： Seung Min Lee ,  Suk Ky Chang ,  Hyun Jee Yoo ,  Jung Sup Shim ,  Yoon Gyung Cho ,  Kyung Yul Bae

IPC分类号： H01L21/56 ,  C08K3/22 ,  C09J163/00 ,  C08G59/50 ,  C08L63/00 ,  H01L51/52 ,  C08K3/01

摘要： Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.

公开(公告)号：US09548473B2

公开(公告)日：2017-01-17

申请号：US14897208

申请日：2014-06-19

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Seung Min Lee ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Jung Sup Shim ,  Suk Ky Chang ,  Hyun Suk Kim ,  Jung Ok Moon ,  Ban Seok Choi ,  Se Woo Yang

IPC分类号： G01N21/958 ,  C08J5/18 ,  H01L51/52 ,  H01L51/00

CPC分类号： H01L51/5259 ,  C08J5/18 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08L2203/206 ,  G01N21/958 ,  H01L51/0034 ,  H01L51/0043

摘要： There are provided a method of evaluating a reliable lifespan of an encapsulant film and a device for evaluating reliability of the film. The present application may provide a film that may be provided for an evaluation method in which reliability of an encapsulant film is simply and easily evaluated only by measuring a haze immediately before the encapsulant film is used, a failure of a product is determined and reliability may be predicted.

摘要翻译： 提供了一种评估密封剂膜的可靠寿命的方法和用于评估膜的可靠性的装置。 本申请可以提供一种膜，其可以用于评估方法，其中密封剂膜的可靠性简单且容易地仅通过测量在使用密封剂膜之前的雾度来评估，产品的故障被确定并且可靠性可以 被预测。

公开(公告)号：US09343702B2

公开(公告)日：2016-05-17

申请号：US14609172

申请日：2015-01-29

申请人： LG Chem, Ltd.

发明人： Kyung Yul Bae ,  Hyun Jee Yoo ,  Seung Min Lee ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： H01L51/52 ,  C09J163/00 ,  C09J7/00 ,  B32B37/00 ,  B32B37/12

CPC分类号： H01L51/5253 ,  B32B37/025 ,  B32B37/12 ,  B32B2310/0806 ,  B32B2457/206 ,  C09J7/00 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2463/00 ,  Y10T428/1471

摘要： The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.

摘要翻译： 本发明涉及一种粘合膜，涉及使用其的有机电子器件的封装产品以及使用该有机电子器件封装的方法。 更具体地，用于封装有机电子器件的粘合膜包括：顺序地布置保护膜层，第一粘合层，第二粘合层和剥离膜层。 第一粘合层和保护膜层之间的剥离强度（A）低于第二粘合层和剥离膜层之间的剥离强度（B），第二粘合层与剥离膜层之间的剥离强度（B） 剥离膜层比第一粘合层和封装基板的剥离强度（C）低，从而改善剥离过程中的缺陷。

公开(公告)号：US10800953B2

公开(公告)日：2020-10-13

申请号：US16533207

申请日：2019-08-06

申请人： LG CHEM, LTD.

发明人： So Young Kim ,  Seung Min Lee ,  Jung Sup Shim ,  Se Woo Yang

IPC分类号： H01L21/00 ,  H01L31/111 ,  C09J123/22 ,  B33Y70/00 ,  C08L33/04 ,  C08L63/00 ,  C08L75/04 ,  C08L101/02 ,  H01L51/00

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and excellent reliability at high temperature and high humidity, and an OED including the same.

公开(公告)号：US20200277520A1

公开(公告)日：2020-09-03

申请号：US15931323

申请日：2020-05-13

申请人： LG CHEM, LTD.

发明人： Seung Min Lee ,  So Young Kim ,  Jung Sup Shim ,  Se Woo Yang

IPC分类号： C09J133/04 ,  C08L63/00 ,  C08L75/04 ,  C08L101/02 ,  C08L33/04 ,  C08L33/06

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

公开(公告)号：US10351736B2

公开(公告)日：2019-07-16

申请号：US15560444

申请日：2016-03-24

申请人： LG CHEM, LTD.

发明人： So Young Kim ,  Seung Min Lee ,  Jung Sup Shim ,  Se Woo Yang

IPC分类号： C09J9/00 ,  C09J11/06 ,  C09J11/04 ,  C09J123/00 ,  C09J123/22 ,  C09J5/06 ,  C09J7/35

摘要： Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

公开(公告)号：US10050204B2

公开(公告)日：2018-08-14

申请号：US14762399

申请日：2014-07-21

申请人： LG CHEM, LTD.

发明人： Seung Min Lee ,  Suk Ky Chang ,  Min Soo Park ,  Hyun Jee Yoo ,  Jung Sup Shim ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Hyun Suk Kim ,  Jung Ok Moon

IPC分类号： C08L23/22 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56 ,  C09J133/06 ,  C09J123/22 ,  C08L101/00 ,  C08F220/18

摘要： An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.