公开(公告)号：US11795314B2

公开(公告)日：2023-10-24

申请号：US16646522

申请日：2018-09-04

Applicant: LG CHEM, LTD.

Inventor： Seung Min Lee ,  So Young Kim ,  Se Woo Yang

IPC: C08L23/22 ,  C08F20/06 ,  C08K3/013 ,  C08K5/00 ,  C08K5/1515

CPC classification number: C08L23/22 ,  C08F20/06 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/1515 ,  C08K2201/006 ,  C08L2203/206

Abstract: Provided is a composition for encapsulating an organic electronic element, comprising an olefin-based resin having at least one reactive functional group, a multifunctional acrylic oligomer, and a monofunctional acrylic oligomer, wherein the monofunctional acrylic oligomer is present in an amount of 7 to 30 parts by weight relative to 100 parts by weight of the olefin-based resin. Also provided are an organic electronic device comprising the composition, and methods for preparing the organic electronic device.

公开(公告)号：US20230192980A1

公开(公告)日：2023-06-22

申请号：US17922757

申请日：2021-05-14

Applicant: LG CHEM, LTD.

Inventor： Seung Min Lee ,  Yeong Bong Mok ,  Sung Nam Moon ,  Sang Min Park ,  Hyun Suk Kim

IPC: C08J7/04 ,  C08J5/18 ,  C08L23/22 ,  C09D145/00 ,  C09D7/61 ,  H10K50/844

CPC classification number: C08J7/0427 ,  C08J5/18 ,  C08L23/22 ,  C09D145/00 ,  C09D7/61 ,  H10K50/844 ,  C08J2323/22 ,  C08J2423/22 ,  C08J2445/00 ,  C08J2435/02 ,  C08L2205/06 ,  C08L2203/16 ,  C08L2205/03

Abstract: The present application relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation film having excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending, while preventing generation of bright spots in the organic electronic device.

公开(公告)号：US11319468B2

公开(公告)日：2022-05-03

申请号：US15560870

申请日：2016-03-24

Applicant: LG CHEM, LTD.

Inventor： Seung Min Lee ,  So Young Kim ,  Jung Sup Shim ,  Se Woo Yang

IPC: C09J123/26 ,  B33Y70/00 ,  C08L33/04 ,  C08L75/04 ,  C08L63/00 ,  C08L101/02 ,  B32B37/12 ,  C09J123/22 ,  C08L33/08 ,  C08L33/10 ,  C08L75/14 ,  G01N25/48

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.

公开(公告)号：US11267995B2

公开(公告)日：2022-03-08

申请号：US15560042

申请日：2016-03-24

Applicant: LG CHEM, LTD.

Inventor： Seung Min Lee ,  So Young Kim ,  Jung Sup Shim ,  Se Woo Yang

IPC: C09J133/04 ,  C08L63/00 ,  C08L75/04 ,  C08L101/02 ,  C08L33/04 ,  C08L33/06 ,  C09J123/22 ,  H01L51/52

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

公开(公告)号：US10457842B2

公开(公告)日：2019-10-29

申请号：US14767182

申请日：2014-09-24

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Seung Min Lee ,  Suk Ky Chang ,  Jung Sup Shim

IPC: C09J163/00 ,  C08L63/00 ,  C08L101/02 ,  H01L51/52 ,  C08K5/5435 ,  H01L51/00 ,  C08G59/50 ,  C08L101/04

Abstract: The present invention relates to a curable composition and an adhesive film including the same, and provides a curable composition and an adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifespan and durability of an organic electronic device.

公开(公告)号：US10181577B1

公开(公告)日：2019-01-15

申请号：US16119600

申请日：2018-08-31

Applicant: LG CHEM, LTD.

Inventor： Ban Seok Choi ,  Hyun Jee Yoo ,  Hyun Suk Kim ,  Seung Min Lee ,  Jung Ok Moon ,  Se Woo Yang

IPC: H01L51/52 ,  H01L51/56 ,  C08J5/18 ,  C08L63/00 ,  H01L51/00 ,  H01L51/50

Abstract: Provided are an encapsulation film, an organic electronic device comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.

公开(公告)号：US20180273753A1

公开(公告)日：2018-09-27

申请号：US15546809

申请日：2017-02-22

Applicant: LG Chem, Ltd.

Inventor： Si Yeon Baek ,  Seung Min Lee ,  Min Soo Park ,  Se Woo Yang ,  So Young Kim

IPC: C08L75/16 ,  C08L83/06 ,  C08G18/61 ,  C08G18/24 ,  C08G18/75 ,  C08G18/34 ,  C08G18/65

CPC classification number: C08L75/16 ,  C08G18/242 ,  C08G18/348 ,  C08G18/61 ,  C08G18/6541 ,  C08G18/755 ,  C08L83/04 ,  C08L83/06

Abstract: The present application relates to a curable composition and a use thereof. The present application can provide a curable composition having excellent transparency, heat resistance and adhesion. Such a curable composition can be usefully used in direct bonding between a filler and an optical member of a display device.

公开(公告)号：US09923169B2

公开(公告)日：2018-03-20

申请号：US14899518

申请日：2014-06-19

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Seung Min Lee ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Jung Sup Shim ,  Suk Ky Chang ,  Hyun Suk Kim ,  Jung Ok Moon ,  Ban Seok Choi ,  Se Woo Yang

IPC: H01L51/00 ,  H01L51/54 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  H01L51/52 ,  C08J5/18 ,  G01N21/958

CPC classification number: H01L51/5259 ,  C08J5/18 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08L2203/206 ,  G01N21/958 ,  H01L51/0034 ,  H01L51/0043

Abstract: There are provided a film and an organic electronic device. The present application may provide a film that may be provided for an evaluation method in which reliability of an encapsulant film is simply and easily evaluated only by measuring a haze immediately before the encapsulant film is used, thereby a failure of a product is determined and reliability may be predicted.

公开(公告)号：US09806293B2

公开(公告)日：2017-10-31

申请号：US14244693

申请日：2014-04-03

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC: H01L23/29 ,  H01L51/52 ,  H01L21/56 ,  B32B27/08 ,  B32B27/18 ,  H05B33/04 ,  B32B43/00 ,  H01L51/56 ,  B32B37/14 ,  C09D123/22 ,  C09D163/00 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

CPC classification number: H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

Abstract: The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

公开(公告)号：US09698379B2

公开(公告)日：2017-07-04

申请号：US14323867

申请日：2014-07-03

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC: H01L51/52 ,  C09D163/00 ,  C09D123/22 ,  H01L23/29 ,  H01L21/56 ,  B32B27/08 ,  B32B27/18 ,  H05B33/04 ,  B32B43/00 ,  H01L51/56 ,  B32B37/14 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

CPC classification number: H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.