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1.发明授权Adhesive and method of encapsulating organic electronic device using the same 有权粘合剂和使用其的封装有机电子器件的方法公开(公告)号：US09105648B2
公开(公告)日：2015-08-11
申请号：US14289212
申请日：2014-05-28
申请人： LG Chem, Ltd.
发明人： Hyun Jee Yoo , Yoon Gyung Cho , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong , Suk Ky Chang
IPC分类号： H01L29/08 , H01L35/24 , H01L51/00 , H01L23/00 , H01L51/52 , H05B33/04 , H01L51/56 , C09J7/00 , C09J7/02 , H01L21/56 , H01L23/28 , H01L23/29 , C08K3/22 , C08K3/34 , C08K3/36 , C09J163/00 , C08K3/16
CPC分类号： H01L51/0094 , C08K3/16 , C08K3/22 , C08K3/346 , C08K3/36 , C08K2003/162 , C08K2003/166 , C08K2003/2206 , C09J7/00 , C09J7/10 , C09J7/35 , C09J9/00 , C09J11/04 , C09J163/00 , C09J2201/134 , C09J2201/36 , C09J2201/61 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L21/56 , H01L23/28 , H01L23/295 , H01L23/564 , H01L51/0034 , H01L51/0035 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2924/0002 , H05B33/04 , H01L2924/00
摘要： An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
摘要翻译： 提供了一种粘合剂，以及使用其的封装产品和封装有机电子器件（OED）的方法。 粘合膜用于包封OED并且包括可固化树脂和吸湿剂，并且粘合剂包括在封装OED时与OED接触的第一区域和不与OED接触的第二区域。 此外，基于粘合剂中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。
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2.发明授权Adhesive film and method of encapsulating organic electrode device using the same 有权粘合膜和使用其的包封有机电极装置的方法公开(公告)号：US08742411B2
公开(公告)日：2014-06-03
申请号：US13886098
申请日：2013-05-02
申请人： LG Chem, Ltd.
发明人： Hyun Jee Yoo , Yoon Gyung Cho , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong , Suk Ky Chang
CPC分类号： H01L51/0094 , C08K3/16 , C08K3/22 , C08K3/346 , C08K3/36 , C08K2003/162 , C08K2003/166 , C08K2003/2206 , C09J7/00 , C09J7/10 , C09J7/35 , C09J9/00 , C09J11/04 , C09J163/00 , C09J2201/134 , C09J2201/36 , C09J2201/61 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L21/56 , H01L23/28 , H01L23/295 , H01L23/564 , H01L51/0034 , H01L51/0035 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2924/0002 , H05B33/04 , H01L2924/00
摘要： An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.
摘要翻译： 提供了一种粘合膜，以及使用其的封装有机电子器件（OED）的产品和方法。 粘合膜用于包封OED并且包括可固化的热熔粘合剂层，其包括可固化树脂和吸湿剂，并且可固化热熔粘合剂层包括在封装OED时与OED接触的第一区域，以及 第二个区域不与OED接触。 此外，基于粘合剂层中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。
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公开(公告)号：US11426678B2
公开(公告)日：2022-08-30
申请号：US16968365
申请日：2019-08-06
申请人： LG CHEM, LTD.
摘要： A sublimation purification apparatus that includes a vacuum chamber; a tube housing positioned in the vacuum chamber; a boat in close contact with the tube housing; and heating units positioned adjacent to an outer surface of the boat and an outer surface of the tube housing, respectively, wherein a sublimation purification target material is contained in the boat, and at least one of the boat and the tube housing is formed of a metal.
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公开(公告)号：US11142669B2
公开(公告)日：2021-10-12
申请号：US16809310
申请日：2020-03-04
申请人： LG CHEM, LTD.
发明人： Hyun Jee Yoo , Yoon Gyung Cho , Suk Ky Chang , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong
IPC分类号： H01L51/52 , H01L23/29 , C09J7/10 , C09J163/00 , H05B33/04 , C09J7/35 , C09J7/00 , H01L51/56 , H01L21/56 , H01L23/28 , H01L23/00 , C09J9/00 , C09J11/04 , H01L51/00 , C08K3/22 , C08K3/34 , C08K3/36 , C08K3/16
摘要： An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
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公开(公告)号：US10062855B2
公开(公告)日：2018-08-28
申请号：US14740006
申请日：2015-06-15
申请人： LG CHEM, LTD.
发明人： Hyun Jee Yoo , Yoon Gyung Cho , Suk Ky Chang , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong
IPC分类号： H01L33/00 , H01L29/08 , H01L51/00 , H01L21/00 , H01L51/52 , H05B33/04 , H01L51/56 , C09J7/00 , C09J163/00 , H01L21/56 , H01L23/28 , H01L23/29 , H01L23/00 , C09J9/00 , C09J11/04 , C09J7/35 , C09J7/10 , C08K3/22 , C08K3/34 , C08K3/36 , C08K3/16
CPC分类号： H01L51/0094 , C08K3/16 , C08K3/22 , C08K3/346 , C08K3/36 , C08K2003/162 , C08K2003/166 , C08K2003/2206 , C09J7/00 , C09J7/10 , C09J7/35 , C09J9/00 , C09J11/04 , C09J163/00 , C09J2201/134 , C09J2201/36 , C09J2201/61 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L21/56 , H01L23/28 , H01L23/295 , H01L23/564 , H01L51/0034 , H01L51/0035 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2924/0002 , H05B33/04 , H01L2924/00
摘要： An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
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6.发明申请公开(公告)号：US20130240862A1
公开(公告)日：2013-09-19
申请号：US13886098
申请日：2013-05-02
申请人： LG CHEM, LTD.
发明人： Hyun Jee Yoo , Yoon Gyung Cho , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong , Suk Ky Chang
CPC分类号： H01L51/0094 , C08K3/16 , C08K3/22 , C08K3/346 , C08K3/36 , C08K2003/162 , C08K2003/166 , C08K2003/2206 , C09J7/00 , C09J7/10 , C09J7/35 , C09J9/00 , C09J11/04 , C09J163/00 , C09J2201/134 , C09J2201/36 , C09J2201/61 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L21/56 , H01L23/28 , H01L23/295 , H01L23/564 , H01L51/0034 , H01L51/0035 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2924/0002 , H05B33/04 , H01L2924/00
摘要： An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.
摘要翻译： 提供了一种粘合膜，以及使用其的封装有机电子器件（OED）的产品和方法。 粘合膜用于包封OED并且包括可固化的热熔粘合剂层，其包括可固化树脂和吸湿剂，并且可固化热熔粘合剂层包括在封装OED时与OED接触的第一区域，以及 第二个区域不与OED接触。 此外，基于粘合剂层中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。
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