公开(公告)号：US20160176755A1

公开(公告)日：2016-06-23

申请号：US14971163

申请日：2015-12-16

Applicant: CORNING INCORPORATED

Inventor： Benedict Yorke Johnson ,  Xinyuan Liu ,  Prantik Mazumder ,  Kamal Kishore Soni

IPC: C03C15/00 ,  C03C17/00

CPC classification number: C03C15/00 ,  C01B32/194 ,  C03C17/002 ,  C03C17/22 ,  C03C2218/31

Abstract: Described herein are methods for improved transfer of graphene from formation substrates to target substrates. In particular, the methods described herein are useful in the transfer of high-quality chemical vapor deposition-grown monolayers of graphene from metal, e.g., copper, formation substrates to ultrathin, flexible glass targets. The improved processes provide graphene materials with less defects in the structure.

Abstract translation: 这里描述的是用于改善石墨烯从地层衬底转移到目标衬底的方法。 特别地，本文描述的方法可用于将高质量化学气相沉积生长的石墨烯单层从金属例如铜，地层衬底转移到超薄，柔性玻璃靶。 改进的工艺为石墨烯材料提供了较少的结构缺陷。

公开(公告)号：US09340443B2

公开(公告)日：2016-05-17

申请号：US14047251

申请日：2013-10-07

Applicant: Corning Incorporated

Inventor： Robert Alan Bellman ,  Dana Craig Bookbinder ,  Robert George Manley ,  Prantik Mazumder ,  Theresa Chang ,  Jeffrey John Domey ,  Alan Thomas Stephens, II

IPC: B32B7/06 ,  C03B35/14 ,  B32B17/06 ,  C03B40/00 ,  C03C1/00 ,  G02F1/1333

CPC classification number: C03B25/025 ,  B05D1/60 ,  B32B7/06 ,  B32B17/06 ,  C03B35/14 ,  C03B40/005 ,  C03C1/00 ,  C03C17/328 ,  G02F2001/133302

Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract translation: 可以在片材，载体或两者上提供表面改性层和相关的热处理，以控制薄板和载体之间的室温范德华（和/或氢）键合和高温共价键合。 例如，在真空处理，湿法处理和/或超声波清洗处理中，室温粘合被控制为足以将薄片和载体保持在一起。 同时控制高温共价键，以防止在高温加工过程中薄片和载体之间的永久性结合，并且保持足够的粘结以防止在高温加工过程中的分层。

公开(公告)号：US20160002096A1

公开(公告)日：2016-01-07

申请号：US14750047

申请日：2015-06-25

Applicant: Corning Incorporated ,  ICFO

Inventor： Albert Carrilero ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C03C15/00 ,  C01B33/12

CPC classification number: C03C15/00 ,  C01B33/12 ,  C01P2004/13 ,  C30B11/12 ,  C30B29/06 ,  C30B29/18 ,  C30B29/60 ,  C30B29/602

Abstract: Provided herein are methods for forming one or more silicon nanostructures, such as silicon nanotubes, and a silica-containing glass substrate. As a result of the process used to prepare the silicon nanostructures, the silica-containing glass substrate comprises one or more nanopillars and the one or more silicon nanostructures extend from the nanopillars of the silica-containing glass substrate. The silicon nanostructures include nanotubes and optionally nanowires. A further aspect is a method for preparing silicon nanostructures on a silica-containing glass substrate. The method includes providing one or more metal nanoparticles on a silica-containing glass substrate and then performing reactive ion etching of the silica-containing glass substrate under conditions that are suitable for the formation of one or more silicon nanostructures.

Abstract translation: 本文提供了形成一个或多个硅纳米结构的方法，例如硅纳米管和含二氧化硅的玻璃基板。 作为用于制备硅纳米结构的方法的结果，含二氧化硅的玻璃基底包括一个或多个纳米柱，并且一个或多个硅纳米结构从含二氧化硅玻璃基底的纳米柱延伸。 硅纳米结构包括纳米管和任选的纳米线。 另一方面是在含二氧化硅的玻璃基板上制备硅纳米结构的方法。 该方法包括在含二氧化硅的玻璃衬底上提供一种或多种金属纳米颗粒，然后在适合于形成一种或多种硅纳米结构的条件下进行含二氧化硅的玻璃衬底的反应离子蚀刻。

公开(公告)号：US20140097432A1

公开(公告)日：2014-04-10

申请号：US13842113

申请日：2013-03-15

Applicant: Corning Incorporated

Inventor： Samir Biswas ,  Douglass Lane Blanding ,  Glen Bennett Cook ,  Prantik Mazumder ,  Kamal Kishore Soni ,  Balram Suman

IPC: H01L21/02

CPC classification number: H01L21/02422 ,  H01L31/02363 ,  H01L31/03921 ,  H01L31/0682 ,  H01L31/182 ,  Y02E10/546 ,  Y02E10/547 ,  Y02P70/521

Abstract: Methods of forming a laminate comprising a sheet of semiconductor material utilize a system. The system comprises a fibrous sheet, a guide member for guiding the fibrous sheet, and a melt of a semiconductor material. The sheet of semiconductor material and a laminate comprising the fibrous sheet and the sheet of semiconductor material are also included.

Abstract translation: 形成包含半导体材料片的层压体的方法利用系统。 该系统包括纤维片，用于引导纤维片的引导部件和半导体材料的熔体。 还包括半导体材料片和包含纤维片和半导体材料片的层压体。

公开(公告)号：US20240327275A1

公开(公告)日：2024-10-03

申请号：US18293463

申请日：2022-07-29

Applicant: CORNING INCORPORATED ,  Fundació Institut de Ciències Fotòniques (ICFO) ,  Institució Catalana de Recerca i Estudis Avançats (ICREA)

Inventor： Indrani Bhattacharyya ,  Miriam Marchena Martín-Francés ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C03C17/34 ,  C03C21/00

CPC classification number: C03C17/3441 ,  C03C21/002 ,  C03C2217/28

Abstract: Provided herein is a glass article comprising: an ion-exchanged glass layer comprising a first major surface and a second major surface; and at least one negatively doped graphene layer having a first major surface and a second major surface; the negatively doped graphene layer first major surface located opposite at least a portion of at least one of the first major surface and the second major surface of the ion-exchanged glass layer, the negatively doped graphene layer having a carrier density of at least about 1013 cm−2. Also provided herein are devices comprising the glass article and methods of making the glass article.

公开(公告)号：US11859064B2

公开(公告)日：2024-01-02

申请号：US17056950

申请日：2019-05-23

Applicant: CORNING INCORPORATED

Inventor： Prantik Mazumder ,  Wageesha Senaratne

IPC: B32B41/00 ,  C08J7/02 ,  B32B17/10 ,  B29C71/00 ,  C08J5/12 ,  C08J7/06

CPC classification number: C08J7/02 ,  B29C71/0009 ,  B32B17/10 ,  C08J5/12 ,  C08J7/06 ,  C08J2383/07

Abstract: A method of modifying a deformable substrate that includes depositing a sessile liquid droplet on a first surface of a deformable substrate, the sessile liquid droplet forming a deformed region in the first surface of the deformable substrate, the deformed region having a recess and a perimeter rim, the recess extending toward a second surface of the deformable substrate, and the perimeter rim extending away from the second surface of the deformable substrate and curing the deformable substrate, thereby increasing an elastic modulus of the deformable substrate such that upon removal of the sessile liquid droplet, the deformed region remains in the first surface of the deformable substrate.

公开(公告)号：US11756847B2

公开(公告)日：2023-09-12

申请号：US17846320

申请日：2022-06-22

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/15 ,  C23C26/00 ,  H01L21/481 ,  H01L23/49827 ,  H01L23/49894

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US11629096B2

公开(公告)日：2023-04-18

申请号：US16764120

申请日：2018-11-20

Applicant: CORNING INCORPORATED

Inventor： Daniel Florian Acquard ,  Indrani Bhattacharyya ,  Sushmit Sunil Kumar Goyal ,  Prantik Mazumder ,  Pei-Lien Tseng

IPC: B32B7/06 ,  C03C27/10 ,  C03C23/00 ,  B32B17/06

Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a coating layer comprising a cationic surfactant or a coating layer comprising an organic salt, and associated deposition methods. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (? 500° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.

公开(公告)号：US20210347689A1

公开(公告)日：2021-11-11

申请号：US17285322

申请日：2019-10-09

Applicant: CORNING INCORPORATED ,  THE INSTITUTE OF PHOTONIC SCIENCES

Inventor： Miriam Marchena Martín-Francés ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C03C23/00 ,  C01B32/194

Abstract: A method of forming a graphene device includes: providing a glass substrate with a blocking layer disposed thereon to form a stack; providing a first electrode and a second electrode; increasing the temperature of the stack to at least 100° C.; applying an external electric field (VP) to the first electrode such that at least one metal ion of the glass substrate migrates toward the first electrode to create a depletion region in the glass substrate adjacent the second electrode; decreasing the temperature of the stack to room temperature while applying the external electric field to the first electrode; and after reaching room temperature, setting the external electric field to zero to create a frozen voltage region adjacent the second electrode.

公开(公告)号：US20210095371A1

公开(公告)日：2021-04-01

申请号：US17038991

申请日：2020-09-30

Applicant: Corning Incorporated ,  ICFO - The Institute of Photonic Sciences ,  INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS

Inventor： Rinu Maniyara ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C23C14/58 ,  H01B1/08 ,  C23C14/08 ,  C23C14/35

Abstract: A method is provided for manufacturing an article comprising a transparent conductive material, wherein a transparent conductive material (e.g., indium tin oxide) is deposited onto a substrate (e.g., fused silica) by physical vapor deposition, then annealed at high temperature (i.e., at least 450° C.) in a nitrogen atmosphere. The resulting article comprises a transparent conductive material that reduces the trade-off between low resistivity (or sheet resistance) and high near infrared transmission. For example, the transparent conductive material thus obtained may possess a transmission of at least 80% at 1550 nm while having a resistivity of less than or equal to about 5×10−4 Ohm-cm and a Haacke figure of merit of at least about 40×10−4Ω−1. Also provided is a method for modulating the resistivity and/or the near infrared transmission of a transparent conductive material by annealing the transparent conductive material at a high temperature under nitrogen atmosphere.