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公开(公告)号：US10826153B2
公开(公告)日：2020-11-03
申请号：US16261489
申请日：2019-01-29
摘要： Systems and methods for forming a mm wave resonant filter include a lithographically fabricated high Q resonant structure. The resonant structure may include a plurality of cavities, each cavity having a characteristic frequency that defines its passband. A filter may include a plurality of resonant structures, and each resonant structure may include a plurality of cavities. These cavities and filters may be fabricated lithographically.
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公开(公告)号：US20190333728A1
公开(公告)日：2019-10-31
申请号：US16392662
申请日：2019-04-24
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The second substrate may have semiconductor integrated circuits formed thereon. The second substrate may also have a shielding layer formed thereon, such as to improve the impedance characteristics of the device.
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公开(公告)号：US10302871B2
公开(公告)日：2019-05-28
申请号：US15974516
申请日：2018-05-08
摘要： Described here is a platform for supporting a fiber optic cable. The platform may be made on a silicon wafer using silicon lithographic processing techniques. The platform may include a substrate having a top planar surface; a trench formed in the substrate in the top planar surface and dimensioned to accept a fiber optic cable carrying radiation; and a reflecting surface formed in the top planar surface, wherein this reflecting surface is configured to reflect the radiation by total internal reflection, wherein the reflecting surface is configured to direct radiation travelling in a first direction into a second direction, substantially orthogonal to the first direction.
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公开(公告)号：US20190064060A1
公开(公告)日：2019-02-28
申请号：US16105448
申请日：2018-08-20
IPC分类号： G01N21/25 , G01N21/3504 , G01N33/00
摘要： Systems and methods for forming a compact gas sensor include a multilayer etalon as a wavelength discriminating element. The position of the etalon may be adjusted to tune its transmission profile. And embodiment directed to carbon dioxide detection is described.
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公开(公告)号：US10050409B2
公开(公告)日：2018-08-14
申请号：US15894170
申请日：2018-02-12
IPC分类号： H04B10/00 , H01S5/02 , B81B7/00 , B81C1/00 , H01S5/022 , H01S5/40 , H04J14/02 , H04B10/40 , H01S5/00 , H04J14/00
CPC分类号： H01S5/0206 , B81B7/0067 , B81C1/00301 , H01S5/0064 , H01S5/02216 , H01S5/02248 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/4025 , H01S5/4087 , H04B10/40 , H04B10/506 , H04J14/02
摘要： A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.
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公开(公告)号：US09953787B2
公开(公告)日：2018-04-24
申请号：US15060630
申请日：2016-03-04
CPC分类号： H01H59/0009 , B81B7/00 , B81B2201/012 , B81C1/00341 , H01H49/00 , H01H2001/0084
摘要： Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.
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公开(公告)号：US20180079640A1
公开(公告)日：2018-03-22
申请号：US15700179
申请日：2017-09-11
CPC分类号： B81B3/0013 , B81B3/0086 , B81B7/0006 , B81B7/008 , B81C1/00206 , B81C1/00936 , H01H1/0036 , H01H59/0009 , H01H2001/0078
摘要： Systems and methods for forming an electrostatic MEMS switch that is used to switch a source of current or voltage. At least one surface of the MEMS switch may be rotated on approach to another substrate, such that when the surfaces are separated, the forces are shearing forces rather than static frictional forces.
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公开(公告)号：US20170283252A1
公开(公告)日：2017-10-05
申请号：US15477593
申请日：2017-04-03
发明人： Benedikt ZEYEN
CPC分类号： B81C1/00182 , B81B3/0018 , B81B2201/0264 , B81C2201/01 , G01L7/022 , G01L7/024 , G01L7/026 , G01L7/163 , G01L9/0001 , G01L9/0042 , G01L9/0054 , G01L9/0089
摘要： A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.
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公开(公告)号：US20170126323A1
公开(公告)日：2017-05-04
申请号：US15408956
申请日：2017-01-18
CPC分类号： H04B10/516 , B81B7/0067 , B81C1/00301 , G02B27/0955 , H01S5/0064 , H01S5/021 , H01S5/02216 , H01S5/02248 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/0607 , H01S5/4025 , H01S5/4031
摘要： A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.
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公开(公告)号：US20170062165A1
公开(公告)日：2017-03-02
申请号：US15232871
申请日：2016-08-10
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2059/0072
摘要： An MEMS device, having two substantially parallel surfaces are separated by an initial distance. At least one of the surfaces includes a raised feature that limits the gap between the surfaces to less than the initial distance when an actuating voltage is applied. In some embodiments, the raised feature limits the gap to about 66% of the initial distance.
摘要翻译： 具有两个基本上平行的表面的MEMS器件被分开初始距离。 至少一个表面包括凸起特征，其在施加致动电压时将表面之间的间隙限制为小于初始距离。 在一些实施例中，凸起特征将间隙限制为初始距离的约66％。
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