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公开(公告)号：US11305982B2
公开(公告)日：2022-04-19
申请号：US16515943
申请日：2019-07-18
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Paul Rubel
Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.
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公开(公告)号：US10804850B2
公开(公告)日：2020-10-13
申请号：US16104146
申请日：2018-08-17
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Abbaspour Tamijani
Abstract: Systems and methods for forming a compact gas sensor include using a lithographically fabricated high Q resonator coupled to at least one of a Gunn diode and an IMPATT diode. The resonator may include a plurality of cavities filled with a sample gas. A detector coupled to the resonator may measure the amplitude of the emitted mm wave radiation.
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公开(公告)号：US20190304794A1
公开(公告)日：2019-10-03
申请号：US16369140
申请日：2019-03-29
Applicant: Innovative Micro Technology
Inventor： Tao Gilbert , Sangwoo Kim
IPC: H01L21/308 , H01L33/58 , H01L31/0232
Abstract: The method described here uses gray scale lithography to form curve surfaces in photoresist. These surfaces can be of arbitrary shape since the remaining resist following exposure and develop is dependent on the exposure dose, which is controlled precisely by the opacity of the photo-mask. The process may include a silicon etch step, followed by a photoresist etch step to form an etching cycle. Each etch cycle may form a pair of substantially orthogonal stepped surfaces, with a characteristic “rise” and “run.”
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公开(公告)号：US10291332B2
公开(公告)日：2019-05-14
申请号：US15934450
申请日：2018-03-23
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman
Abstract: A transceiver and interconnect for connecting a plurality of optical cables. In one embodiment, optical sources are joined to a plurality of fiber optic output cables. The structures may use a plurality of ball lenses to collimate the diverging light from the source and launch it down one of the plurality of fibers. Through holes in a silicon substrate may allow the radiation to pass, and these features may be made very precisely.
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公开(公告)号：US20190137611A1
公开(公告)日：2019-05-09
申请号：US16164802
申请日：2018-10-19
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
Abstract: We describe here a scanning optical beam that is comprised of no moving parts The device includes a plurality of microfabricated beam shaping elements disposed in an array wherein each microfabricated beam shaping element is registered with a microfabricated light source but has an optical axis that is offset from the optical axis of the light source by a different amount, wherein the amount is a function of the distance from a center of the arrays. A method of operating the scanning optical beam is also described.
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Patent Agency Ranking
公开(公告)号：US20180335575A1
公开(公告)日：2018-11-22
申请号：US15974516
申请日：2018-05-08
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
CPC classification number: G02B6/3652 , G02B6/3596 , G02B6/3608 , G02B6/4471 , H01S5/0064 , H01S5/18366
Abstract: Described here is a platform for supporting a fiber optic cable. The platform may be made on a silicon wafer using silicon lithographic processing techniques. The platform may include a substrate having a top planar surface; a trench formed in the substrate in the top planar surface and dimensioned to accept a fiber optic cable carrying radiation; and a reflecting surface formed in the top planar surface, wherein this reflecting surface is configured to reflect the radiation by total internal reflection, wherein the reflecting surface is configured to direct radiation travelling in a first direction into a second direction, substantially orthogonal to the first direction.
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公开(公告)号：US10011478B2
公开(公告)日：2018-07-03
申请号：US15634230
申请日：2017-06-27
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Paul J. Rubel
CPC classification number: B81B7/0058 , B23K20/023 , B32B9/041 , B32B2457/00 , B81C1/00269 , B81C2203/0118 , B81C2203/037
Abstract: A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.
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公开(公告)号：US20180180829A1
公开(公告)日：2018-06-28
申请号：US15903066
申请日：2018-02-23
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
IPC: G02B6/42 , G02F1/095 , B81C1/00 , B81B7/00 , G02B27/09 , H01S5/183 , H01S5/02 , H01S5/022 , H04J14/02 , H04B10/40
CPC classification number: G02B6/4284 , B81B7/0067 , B81B7/007 , B81B7/02 , B81B2201/042 , B81B2201/047 , B81B2207/015 , B81B2207/096 , B81C1/00301 , G02B6/4213 , G02B6/4214 , G02B6/4246 , G02B6/4257 , G02B27/0955 , G02F1/0955 , H01S5/0064 , H01S5/021 , H01S5/02216 , H01S5/02248 , H01S5/02252 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/18361 , H01S5/4025 , H04B10/40 , H04B10/508 , H04J14/02
Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. An optical source may be attached to a carrier substrate with the TOSA by a flexible connector, in order to align the optical source before affixing it permanently.
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公开(公告)号：US20180175276A1
公开(公告)日：2018-06-21
申请号：US15382606
申请日：2016-12-17
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
IPC: H01L41/083 , H01L41/047 , H01L41/27
CPC classification number: G01L1/18 , H01L41/0815 , H01L41/09
Abstract: Described herein is a method and structure for fabricating a self-sensing piezoelectric actuator. In a single device, the actuator may be formed which is capable of movement, along with a sensor that may provide a signal indicative of the speed and/or magnitude of the movement. The actuator may be fabricated on one wafer, and the sensor fabricated on a second wafer, and the two wafers bonded together to form the device. The device may be appropriate for vibration devices such as ultrasound tranducers and the like. The structure may be fabricated using well known semiconductor techniques such as depositions, etching and ion implantation.
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公开(公告)号：US20180010589A1
公开(公告)日：2018-01-11
申请号：US15712458
申请日：2017-09-22
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
CPC classification number: F04B19/006 , B81B3/0021 , B81B2201/0264 , B81B2201/032 , B81B2201/036 , B81C1/00182 , F04B17/003 , F04B43/043 , G01L9/0042 , G01L9/0054
Abstract: A microfabricated fluid pump is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied. The force may be provided by an embedded layer of piezoelectric material. Embedded strain gauges may allow self-sensing and convenient, precise operational control.
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