公开(公告)号：US08037600B2

公开(公告)日：2011-10-18

申请号：US12061774

申请日：2008-04-03

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01R43/00

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and mounting at least one interposer on a first surface of the carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. The method includes arranging a plurality of electrically conductive elements about the surface of the at least one hemi-toroidal interposer and extending radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

摘要翻译： 一种制造包括电绝缘载体平面并在载体平面的第一表面上安装至少一个插入件的焊盘格栅阵列（LGA）插入器结构的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 该方法包括围绕至少一个半环形插入器的表面布置多个导电元件，并从其最上端向内和向下自由地延伸，与位于电绝缘的相对侧上的至少一个部件电接触 载体飞机

公开(公告)号：US07836585B2

公开(公告)日：2010-11-23

申请号：US12106462

申请日：2008-04-21

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01K3/00 ,  H01R12/00

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A method of operatively combining a plurality of components to form a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

公开(公告)号：US20100173505A1

公开(公告)日：2010-07-08

申请号：US12462985

申请日：2009-08-11

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  John S. Corbin ,  Paul Coteus ,  Shawn A. Hall ,  Kathleen C. Hinge ,  Theron L. Lewis ,  Frank R. Libsch ,  Amanda E. E. Mikhail

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  John S. Corbin ,  Paul Coteus ,  Shawn A. Hall ,  Kathleen C. Hinge ,  Theron L. Lewis ,  Frank R. Libsch ,  Amanda E. E. Mikhail

IPC分类号： H01R12/14 ,  H01R13/22 ,  H01R43/00

CPC分类号： H05K3/368 ,  H01R12/52 ,  H01R12/714 ,  H05K1/0269 ,  H05K3/325 ,  H05K2201/10378 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography.

摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。 这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的配合表面相接触。 对于通过成型技术（例如，Tyco Electronics MPI或Shin Etsu RP）或Metal-on-Elastomer型（IBM）的成型技术制造的LGA类型，使用具有所需形貌的模具提供所需的 LGA地形。 对于由金属弹簧，悬臂，电枢等制成的那些LGAs，通过使用具有所需形状的尺寸模具在制造期间或之后使按钮成形来施加所需的形状。

公开(公告)号：US07491068B2

公开(公告)日：2009-02-17

申请号：US11865436

申请日：2007-10-01

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01R12/00

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

摘要翻译： 包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机 还提供了一种制造焊盘栅格阵列中介层结构的方法。

公开(公告)号：US20090013528A1

公开(公告)日：2009-01-15

申请号：US12212927

申请日：2008-09-18

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01R43/16

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cros s-section and is constituted of a dielectric elastomeric material. At least one sidewall of the interposer is slitted to facilitate the venting of gases and pressure therethrough. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

摘要翻译： 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横向横截面中具有半环形结构，并由介电弹性体材料构成。 插入器的至少一个侧壁被切割以便于气体的排出和通过其中的压力。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机

公开(公告)号：US20090007427A1

公开(公告)日：2009-01-08

申请号：US12207713

申请日：2008-09-10

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01R43/20

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

公开(公告)号：US20080176418A1

公开(公告)日：2008-07-24

申请号：US11865396

申请日：2007-10-01

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01R12/00

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

摘要翻译： 包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机 还提供了一种制造焊盘栅格阵列中介层结构的方法。

公开(公告)号：US07377790B2

公开(公告)日：2008-05-27

申请号：US11865231

申请日：2007-10-01

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01R12/00

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

摘要翻译： 包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入件的表面布置，并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机 还提供了一种制造焊盘栅格阵列中介层结构的方法。

公开(公告)号：US5441690A

公开(公告)日：1995-08-15

申请号：US88016

申请日：1993-07-06

申请人： Juan Ayala-Esquilin ,  Brian S. Beaman ,  Rudolf A. Haring ,  James L. Hedrick ,  Da-Yuan Shih ,  George F. Walker

发明人： Juan Ayala-Esquilin ,  Brian S. Beaman ,  Rudolf A. Haring ,  James L. Hedrick ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01R11/01 ,  H01B3/46 ,  H01B5/16 ,  H01L23/14 ,  H01L23/538 ,  H01R43/00 ,  B29C33/42 ,  B32B15/02

CPC分类号： H01B3/46 ,  H01L23/145 ,  H01L23/5384 ,  H01L2924/0002 ,  Y10T428/31663

摘要： The present invention relates to an improved pinless connector for use in microelectronics comprising an improved elastomer resin of polysiloxane and filler.

摘要翻译： 本发明涉及用于微电子学的改进的无针连接器，其包括改进的聚硅氧烷和填料的弹性体树脂。

公开(公告)号：US4975079A

公开(公告)日：1990-12-04

申请号：US485016

申请日：1990-02-23

申请人： Brian S. Beaman ,  Keith E. Fogel ,  Jungihl Kim ,  Wolfgang Mayr ,  Jane M. Shaw ,  George F. Walker

发明人： Brian S. Beaman ,  Keith E. Fogel ,  Jungihl Kim ,  Wolfgang Mayr ,  Jane M. Shaw ,  George F. Walker

IPC分类号： G01R1/067 ,  G01R1/04 ,  G01R1/073 ,  G01R31/26 ,  H01R4/26 ,  H01R13/24

CPC分类号： G01R1/0483 ,  G01R1/07314 ,  H01R12/714 ,  H01R13/2485 ,  H01L2224/13021 ,  H01R2201/20

摘要： An electrical connector is described for making contact with a plurality of convex and deformable contacts on an electronic device. The electrical connector comprises a substrate having a plurality of conductors which extend above its surface. A polymeric material is disposed on the surface of the substrate and has openings which expose the conductors, each opening sized to receive one of the convex, deformable contacts, and to enable electrical connection between the exposed conductors and the deformable contacts. A mechanism is provided for urging the deformable contacts on the electronic device against the exposed conductors. The mechanism exerts sufficient force between the device and the conductors to cause some deformation of the convex contact areas by the conductors.