发明授权
US07491068B2 Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
失效
使用金属弹性体半环和其他多点接触几何的不同高度的土地栅格阵列(LGA)中介层组
- 专利标题: Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
- 专利标题(中): 使用金属弹性体半环和其他多点接触几何的不同高度的土地栅格阵列(LGA)中介层组
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申请号: US11865436申请日: 2007-10-01
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公开(公告)号: US07491068B2公开(公告)日: 2009-02-17
- 发明人: Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
- 申请人: Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Murphy & Presser, P.C.
- 代理商 Daniel P. Morris, Esq.
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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