Molded portion-equipped electric wire

    公开(公告)号:US10122097B2

    公开(公告)日:2018-11-06

    申请号:US15559973

    申请日:2016-03-27

    摘要: A molded portion-equipped electric wire includes an insulated electric wire, a terminal connected to a core wire at an end of the insulated electric wire, a first molded portion covering a portion at which the terminal and the core wire of the insulated electric wire are connected to each other, a second molded portion that is formed integrally with the first molded portion, that is softer than the first molded portion, and that protrudes from the first molded portion toward the side opposite to the terminal side while being in contact with an outer circumferential surface of the insulating coating, and a fixing member that has an annular shape surrounding the second molded portion and that is attached to the first molded portion and the second molded portion in a state in which the fixing member presses the second molded portion against the outer circumferential surface of the insulating coating.

    Deformable elastomeric conductors and differential electronic signal transmission

    公开(公告)号:US10032538B2

    公开(公告)日:2018-07-24

    申请号:US14163016

    申请日:2014-01-24

    摘要: This application generally relates to deformable elastomeric conductors and differential signaling transmission techniques. According to one embodiment, a deformable elastomeric conductor is configured to transmit electrical signals. It comprises: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically conductive. The conductive filler material may include substantially non-entangled particles having an aspect ratio sufficiently large to enable the particles to substantially remain in contact and/or in close proximity with adjacent particles so as to maintain conductive pathways in the material when the material is subjected to deformation up to and exceeding 10% strain. Thus, over a transmission distance of an electrical signal through the conductor, the transmission does not suffer greater than about 3 dB of signal attenuation when subjected to the deformation.

    SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

    公开(公告)号:US20180151268A1

    公开(公告)日:2018-05-31

    申请号:US15567166

    申请日:2016-03-24

    摘要: There is provided a copper foil having a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board. A surface-treated copper foil according to the present invention includes a copper foil and a silicon-based surface coating layer provided on at least one surface of the copper foil, the silicon-based surface coating layer being mainly composed of silicon (Si). The silicon-based surface coating layer has a carbon content of 1.0 to 35.0 atomic % and an oxygen content of 12.0 to 40.0 atomic % relative to a total content in 100 atomic % of carbon (C), oxygen (O) and silicon (Si) elements as measured by X-ray photoelectron spectroscopy (XPS).