公开(公告)号：US20090322643A1

公开(公告)日：2009-12-31

申请号：US12215990

申请日：2008-06-30

Applicant: Debabani Choudhury

Inventor： Debabani Choudhury

IPC: H01Q1/52

CPC classification number: H01Q21/0093 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01Q1/2291 ,  H01Q1/526 ,  H01Q21/0025 ,  H01Q21/0075 ,  H01Q23/00

Abstract: Embodiments of integrated high performance package systems for millimeter-wave array applications are described herein. Other embodiments may be described and claimed.

Abstract translation: 本文描述了用于毫米波阵列应用的集成高性能封装系统的实施例。 可以描述和要求保护其他实施例。

公开(公告)号：US07423607B2

公开(公告)日：2008-09-09

申请号：US11834530

申请日：2007-08-06

Applicant: Farrokh Mohamadi

Inventor： Farrokh Mohamadi

IPC: H01Q21/00

CPC classification number: H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q3/26 ,  H01Q3/30 ,  H01Q21/0093 ,  H01Q21/062 ,  H01Q21/065 ,  H01L2924/00

Abstract: In one embodiment, an integrated circuit antenna array is provided that includes: a low-voltage substrate; a high-voltage substrate; a digital-to-analog converter (DAC) integrated with the low-voltage substrate, the DAC being operable to receive a digital command and convert it into an analog voltage; a voltage-controlled oscillator (VCO) integrated with the low-voltage substrate, the VCO providing an RF signal having an output frequency responsive to the analog voltage; a plurality of switching power amplifiers integrated with the high-voltage substrate, each switching power amplifier receiving an RF signal from the low-voltage substrate and providing an amplified RF output signal; and a plurality of antennas adjacent the high-power substrate, each antenna associating with a corresponding one of the switching power amplifier so as to transmit the amplified RF output signal from the corresponding switching power amplifier.

Abstract translation: 在一个实施例中，提供集成电路天线阵列，其包括：低电压基板; 高压基板; 与低电压基板集成的数模转换器（DAC），DAC可操作以接收数字命令并将其转换为模拟电压; 与低电压基板集成的压控振荡器（VCO），VCO提供具有响应于模拟电压的输出频率的RF信号; 多个与高电压基板集成的开关功率放大器，每个开关功率放大器从低电压基板接收RF信号并提供放大的RF输出信号; 以及与所述大功率基板相邻的多个天线，每个天线与所述开关功率放大器中的对应的一个相关联，以便从相应的开关功率放大器发射放大的RF输出信号。

公开(公告)号：US20080079649A1

公开(公告)日：2008-04-03

申请号：US11622813

申请日：2007-01-12

Applicant: Farrokh Mohamadi

Inventor： Farrokh Mohamadi

IPC: H01Q21/00

CPC classification number: H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/184 ,  H01Q21/0093 ,  H01Q21/062 ,  H01Q21/065 ,  H03B5/18 ,  H03B5/1841 ,  H03F1/223 ,  H03F3/604 ,  H03F2200/108 ,  H03F2200/495 ,  H01L2924/00

Abstract: In one embodiment, an integrated circuit antenna array is provided that includes: a first substrate, a plurality of antennas adjacent the first substrate; an RF network adjacent the first substrate, and a plurality of distributed amplifiers integrated with the first substrate and coupled to the RF network, each distributed amplifier including a varactor configured to load the RF network with a variable capacitance responsive to a control signal, wherein the RF network and the distributed plurality of amplifiers are configured to form a resonant network such that if a timing signal is injected into an input port of the RF network, the resonant network oscillates to provide a globally synchronized RF signal to each of the antennas, and wherein a resonant oscillation of the resonant network is tunable responsive to the control signal.

Abstract translation: 在一个实施例中，提供集成电路天线阵列，其包括：第一基板，与第一基板相邻的多个天线; 与第一衬底相邻的RF网络以及与第一衬底集成并耦合到RF网络的多个分布式放大器，每个分布式放大器包括变容二极管，其被配置为响应于控制信号而以可变电容加载RF网络，其中， RF网络并且分布式多个放大器被配置为形成谐振网络，使得如果定时信号被注入到RF网络的输入端口中，则谐振网络振荡以向每个天线提供全局同步的RF信号，以及 其中所述谐振网络的谐振振荡是响应于所述控制信号而可调谐的。

公开(公告)号：US20080079636A1

公开(公告)日：2008-04-03

申请号：US11616235

申请日：2006-12-26

Applicant: Farrokh Mohamadi

Inventor： Farrokh Mohamadi

IPC: H01Q1/38

CPC classification number: H01Q3/30 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q3/26 ,  H01Q21/0093 ,  H01Q21/062 ,  H01Q21/065 ,  H01L2924/00

Abstract: In one embodiment, an integrated circuit antenna array is provided that includes: a low voltage substrate supporting an RF transmission network, and a high voltage substrate bonded to the low voltage substrate, the high voltage substrate supporting a plurality of antennas coupled to the RF transmission network through power amplifiers integrated into a surface of the high voltage substrate.

Abstract translation: 在一个实施例中，提供一种集成电路天线阵列，其包括：支撑RF传输网络的低电压基板和接合到所述低电压基板的高压基板，所述高压基板支撑耦合到所述RF传输的多个天线 网络通过功率放大器集成到高压基板的表面。

公开(公告)号：US20070103380A1

公开(公告)日：2007-05-10

申请号：US11539112

申请日：2006-10-05

Applicant: Neil Weste

Inventor： Neil Weste

IPC: H01Q1/00 ,  H01P11/00

CPC classification number: H01Q21/0093 ,  H01L23/48 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/49171 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q9/18 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad that is intended to be an antenna connection to be elongated compared to other bonds, and arranged in an approximately perpendicular direction to the plane of the integrated circuit; encapsulating the top of the integrated circuit package with a dielectric material at a height grater than a desired antenna length; and milling the dielectric encapsulation down to a pre-selected and calibrated height, such that the elongated bond wire to/from the integrated circuit pad that is intended to be an antenna connection is severed, such that the approximately vertical bond wire to/from the integrated circuit pad that is intended to be an antenna connection forms a quarter wave monopole.

Abstract translation: 具有天线的集成电路和形成集成电路的方法。 该方法包括在集成电路封装中形成与要与其他接合相比较长的天线连接的集成电路焊盘的每个接合，并且与集成电路的平面大致垂直的方向 ; 在比所期望的天线长度更高的高度上用介电材料封装集成电路封装的顶部; 并将电介质封装铣削到预选和校准的高度，使得去往/来自集成电路焊盘的用于天线连接的细长接合线被切断，使得大致垂直的接合线到/ 旨在成为天线连接的集成电路板形成四分之一波长单极。

公开(公告)号：US07034751B2

公开(公告)日：2006-04-25

申请号：US10734445

申请日：2003-12-12

Applicant: Kenneth W. Brown ,  James R. Gallivan

Inventor： Kenneth W. Brown ,  James R. Gallivan

IPC: H01Q1/38

CPC classification number: H01Q3/46 ,  H01Q21/0018 ,  H01Q21/0093 ,  H01Q21/061 ,  H01Q21/065 ,  H01Q23/00

Abstract: An amplifier including a monolithic semiconductor substrate and an array disposed on said substrate for coherently receiving and retransmitting electromagnetic energy. The array is implemented with a plurality of cells. Each of the cells includes a dual polarization antenna structure for receiving electromagnetic energy and an amplifier connected thereto. The amplifier may include an ortho-mode feed and a reflective amplifier array adapted to be illuminated by the feed with an input wavefront with a first polarization and to return thereto an amplified wavefront with a second polarization orthogonal to the first wavefront. First and second shaped mirrors may be incorporated for illuminating the array with a planar wavefront and converting the reflected planar wavefront to a spherical wavefront.

Abstract translation: 一种放大器，包括单片半导体衬底和布置在所述衬底上的阵列，用于相干地接收和重传电磁能。 阵列用多个单元实现。 每个单元包括用于接收电磁能的双极化天线结构和与其连接的放大器。 放大器可以包括正射模式馈送和反射放大器阵列，该阵列适于由具有第一偏振的输入波前的馈源照亮，并且以与第一波前正交的第二偏振返回放大的波前。 可以并入第一和第二形状的反射镜以用平面波前照射阵列，并将反射的平面波前转换成球面波前。

公开(公告)号：US06975276B2

公开(公告)日：2005-12-13

申请号：US10796927

申请日：2004-03-10

Applicant: Kenneth W. Brown

Inventor： Kenneth W. Brown

IPC: F42B10/18 ,  H01Q1/42 ,  H01Q3/46 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/28 ,  H01Q13/10 ,  H01Q13/18 ,  H01Q21/00 ,  H01Q23/00

CPC classification number: H01Q9/0407 ,  H01Q3/46 ,  H01Q9/0457 ,  H01Q9/16 ,  H01Q9/285 ,  H01Q13/18 ,  H01Q21/0018 ,  H01Q21/0093 ,  H01Q23/00

Abstract: A cavity backed millimeter-wave antenna comprises a dielectric cavity within a semiconductor substrate having walls defined by a plurality of vias through the substrate, and a gas cavity external to the substrate aligned with the dielectric cavity. A ground plane side of the substrate may be devoid of ground plane conductive material substantially between the walls of the dielectric cavity. In a slot-antenna embodiment, a microstrip feed line may be disposed on the substrate across a slot over the cavities. The slot may be a rectangular region without conductive material on a circuit side of the substrate over the dielectric cavity. In a dipole embodiment, a first pole comprising conductive material may be disposed on a ground plane side of the substrate over the cavities, and a second pole comprising conductive material may be disposed on a circuit side of the substrate over the cavities.

Abstract translation: 空腔背面毫米波天线包括在半导体衬底内的介电腔，其具有由穿过衬底的多个通孔限定的壁以及与电介质对准的衬底外部的气体腔。 衬底的接地平面侧基本上不存在介电腔的壁之间的接地平面导电材料。 在狭缝天线实施例中，微带馈电线可以跨越空腔上的狭槽设置在衬底上。 槽可以是在电介质腔上的衬底的电路侧上没有导电材料的矩形区域。 在偶极实施例中，包括导电材料的第一极可以设置在空腔的基板的接地平面侧上，并且包括导电材料的第二极可以设置在空腔的基板的电路侧上。

公开(公告)号：US06965349B2

公开(公告)日：2005-11-15

申请号：US10239346

申请日：2002-02-06

Applicant: Stan W. Livingston ,  Jar J. Lee ,  James H. Schaffner ,  Robert Y. Loo

Inventor： Stan W. Livingston ,  Jar J. Lee ,  James H. Schaffner ,  Robert Y. Loo

IPC: H01Q1/42 ,  H01Q21/00 ,  H01Q21/06 ,  H01O13/10

CPC classification number: H01Q1/422 ,  H01Q21/0093 ,  H01Q21/064

Abstract: A reconfigurable wide band phased array antenna for generating multiple antenna beams for multiple transmit and receive functions. The antenna array comprises multiple long non-resonant TEM slot antenna apertures with RF MEMS switches disposed within the slots. The RF MEMS switches are positioned directly within the feed lines across the slots to directly control the coupling of RF energy to the slots. Multiple RF MEMS switches are used within each slot, which allows multiple transmit/receive functions and/or multiple frequencies to be supported by each slot. The frequency coverage provided by the slot antenna has a greater than 10:1 frequency range.

公开(公告)号：US20030011515A1

公开(公告)日：2003-01-16

申请号：US09905115

申请日：2001-07-16

Applicant: MOTOROLA, INC.

Inventor： Keith V. Warble ,  John Wesley Locke

IPC: H01Q003/22

CPC classification number: H01L21/8258 ,  H01L21/02381 ,  H01L21/02488 ,  H01L21/02505 ,  H01L21/02507 ,  H01L21/02513 ,  H01L21/02521 ,  H01L21/02546 ,  H01L21/02557 ,  H01L21/0256 ,  H01L27/0605 ,  H01Q3/36 ,  H01Q21/0093 ,  H01Q25/00

Abstract: An apparatus for effecting transfer of electromagnetic signals intermediate a host device and a medium adjacent to the antenna includes: (a) a plurality of antenna elements arranged in an array in facing relation with a target sector; (b) a phase adjusting unit coupled with selected antenna elements and with the host unit for transferring internal signals intermediate the host device and the antenna elements; and (c) a control unit coupled with the phase adjusting unit. The phase adjusting unit cooperates with the control unit to adjust at least one parameter relating to the electromagnetic signals intermediate the host device and the antenna elements. The adjusting is carried out to cause the antenna elements to address the sector in a timed space-sharing pattern. At least two of the plurality of antenna array, the phase adjusting unit and the control unit are implemented in a unitary structure borne upon a single silicon substrate.

Abstract translation: 用于实现主机设备和与天线相邻的介质之间的电磁信号的传送的装置包括：（a）多个天线元件，其排列成与目标扇区面对关系; （b）与所选择的天线元件和主机单元耦合的相位调整单元，用于传送主机设备和天线元件之间的内部信号; 和（c）与所述相位调整单元耦合的控制单元。 相位调整单元与控制单元协调以调整与主机设备和天线元件之间的电磁信号有关的至少一个参数。 执行调整以使得天线元件以定时的空间共享模式寻址扇区。 多个天线阵列，相位调整单元和控制单元中的至少两个以承载在单个硅衬底上的整体结构实现。

公开(公告)号：US6061026A

公开(公告)日：2000-05-09

申请号：US21172

申请日：1998-02-10

Applicant: Masanori Ochi ,  Souichi Imamura ,  Shigehiro Hosoi ,  Yutaka Ueno

Inventor： Masanori Ochi ,  Souichi Imamura ,  Shigehiro Hosoi ,  Yutaka Ueno

IPC: H01P11/00 ,  H01Q9/16 ,  H01Q9/28 ,  H01Q13/02 ,  H01Q13/08 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q23/00 ,  H01Q1/38

CPC classification number: H01Q23/00 ,  H01Q21/0093 ,  H01Q21/064 ,  H01Q9/285

Abstract: A high-gain monolithic antenna with high freedom of design has a signal circuit and a stripline dipole antenna which are provided on a substrate. A dielectric film and a conductor cover covering the dielectric film are provided on the upper surface of the substrate, in addition to a hole extending vertically downward to the underside of the substrate, a conductor wall being provided on the surface thereof. Furthermore, a metallic film is evaporated so as to contact both a metallic cover and a conductor wall. A first grounding conductor and a dielectric are provided on the lower surface of the substrate, and a second grounding conductor is provided on the upper surface of the substrate. A horn, which is tapered into the dielectric and the first grounding conductor thereby forming the shape of a quadrangular pyramid, is provided so as to overlap a hole etched into the substrate. Microwaves or milliwaves are radiated to/from the horn to/from the underside of the substrate.

Abstract translation: 具有高自由度的高增益单片天线具有设置在基板上的信号电路和带状线偶极子天线。 除了垂直向下延伸到基板的下侧的孔之外，还在基板的上表面上设置覆盖电介质膜的绝缘膜和导体盖，在其表面上设置有导体壁。 此外，金属膜被蒸发以与金属盖和导体壁接触。 第一接地导体和电介质设置在基板的下表面上，第二接地导体设置在基板的上表面上。 提供了锥形到电介质中的喇叭和第一接地导体，从而形成四角锥形的形状，以便与蚀刻到衬底中的孔重叠。 微波或毫瓦辐射到/从喇叭到基底的下面。