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公开(公告)号：US20240235056A1
公开(公告)日：2024-07-11
申请号：US18554196
申请日：2022-04-05
Applicant: RADSEE TECHNOLOGIES LTD.
Inventor： Dani Raphaeli , Gregory Lerner
CPC classification number: H01Q21/0093 , H01Q21/064 , H01Q21/28
Abstract: A radio frequency (RF) radar that consists essentially of a radome; a single bulk in which RF antenna arrays and portions of waveguides are formed, wherein the waveguides lead to the RF antenna arrays; a printed circuit board (PCB) that supports an RF circuitry; lower-than-RF-frequency circuitry; and a back portion.
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公开(公告)号：US20240047854A1
公开(公告)日：2024-02-08
申请号：US18266407
申请日：2021-12-03
Applicant: Teknologian tutkimuskeskus VTT Oy
Inventor： Vladimir ERMOLOV , Antti LAMMINEN
CPC classification number: H01Q1/2283 , H01Q21/0006 , H01Q21/0093 , H01Q3/26 , H01L23/66 , H01L2924/1423
Abstract: The present invention relates to a millimeter wave RF antenna array apparatus. The apparatus comprises a single-chip MMIC comprising active circuit elements of the antenna array apparatus. The active circuit elements comprise at least antenna feed circuitry configured to feed antenna elements of the antenna array. The apparatus comprises an interposer fabricated of low-loss RF material, such as glass, low-temperature co-fired ceramic, LTCC, or printed circuit board, PCB. The interposer comprises transmission lines of a RF distribution network and a plurality of antenna elements of the antenna array. The transmission lines of the interposer are coupled to the MMIC for providing RF connections for distributing RF signals to and from the antenna feed circuitry. Area of the interposer that comprises the transmission lines of the RF distribution network and the plurality of antenna elements is collocated with the area of the MMIC that comprises said antenna feed circuitry.
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公开(公告)号：US11831079B2
公开(公告)日：2023-11-28
申请号：US17272149
申请日：2019-09-20
Applicant: Robert Bosch GmbH
Inventor： Johannes Meyer , Juergen Seiz , Martin Nezadal , Maik Hansen
CPC classification number: H01Q21/0093 , H01Q1/3233 , H01Q21/065 , H01Q1/38
Abstract: A circuit board for radar sensors including a substrate having a topside and a lower surface. The circuit board has at least one antenna device, which is situated on the topside of the substrate and is developed out of a metal layer. In addition, the circuit board has a fill structure situated on the topside of the substrate, which is developed out of the metal layer. The fill structure is situated at a distance from the antenna device in a surface region of the topside of the substrate, the surface region not being taken up by the antenna device. The fill structure has no electrical connection to the antenna device. The surface utilization of the fill structure amounts to between 50% and 300% of that of a surface utilization of the antenna device.
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公开(公告)号：US10074900B2
公开(公告)日：2018-09-11
申请号：US15018747
申请日：2016-02-08
Applicant: The Boeing Company
Inventor： Julio A. Navarro , Douglas A. Pietila
CPC classification number: H01Q3/26 , H01P3/16 , H01Q1/02 , H01Q3/267 , H01Q13/06 , H01Q21/0006 , H01Q21/0025 , H01Q21/0093 , H05K3/30
Abstract: Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.
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公开(公告)号：US09972905B2
公开(公告)日：2018-05-15
申请号：US14617361
申请日：2015-02-09
Applicant: HRL LABORATORIES LLC
Inventor： James H. Schaffner , Hyok J. Song , Keyvan R. Sayyah , Pamela R. Patterson , Jeong-Sun Moon , Alan E. Reamon , Keerti S. Kona , Joseph S. Colburn
CPC classification number: H01Q3/01 , H01Q1/06 , H01Q3/2676 , H01Q3/46 , H01Q9/0407 , H01Q15/0026 , H01Q19/005 , H01Q21/0093 , H01Q21/065
Abstract: A reconfigurable electro-magnetic tile includes a laser layer including a plurality of lasers, and a pixelated surface comprising a plurality of metal patches and a plurality of switches, wherein each respective switch of the plurality of switches is in a gap between a first respective metal patch and a second respective metal patch, wherein each respective switch is optically coupled to at least one respective laser of the plurality of lasers, and wherein each switch of the plurality of switches comprises a phase change material.
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Patent Agency Ranking
公开(公告)号：US09921313B2
公开(公告)日：2018-03-20
申请号：US14302663
申请日：2014-06-12
Applicant: Northrop Grumman Systems Corporation
Inventor： Kiet D. Ngo , Edward V. Koretzky , Dennis M. Hall , Douglas S. Cockfield
CPC classification number: G01S19/02 , G01S1/042 , H01Q3/30 , H01Q21/0093
Abstract: An apparatus includes: a Global Positioning System (GPS) phased array comprising a plurality of digital beam forming elements (DBFEs), wherein at least one of the DBFEs includes: an antenna configured to transmit a GPS signal; a radio frequency (RF) electronics section operably connected to the antenna and digital electronics sections; and a digital electronics section operably connected to the RF electronics section. An apparatus includes: a GPS phased array comprising a plurality of DBFEs, wherein at least one of the DBFEs includes: an antenna configured to transmit a GPS signal; an RF electronics section operably connected to the antenna and digital electronics sections; and a digital electronics section operably connected an RF electronic section; a navigation encoder and frequency generator (NEFU) unit operably connected to the GPS phased array; and an atomic frequency standard operably connected to the NEFU unit.
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7.发明申请公开(公告)号：US20170229775A1
公开(公告)日：2017-08-10
申请号：US15018747
申请日：2016-02-08
Applicant: The Boeing Company
Inventor： Julio A. Navarro , Douglas A. Pietila
CPC classification number: H01Q3/26 , H01P3/16 , H01Q1/02 , H01Q3/267 , H01Q21/0006 , H01Q21/0025 , H01Q21/0093 , H05K3/30
Abstract: Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.
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公开(公告)号：US09659904B2
公开(公告)日：2017-05-23
申请号：US14104296
申请日：2013-12-12
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Adel Elsherbini
CPC classification number: H01Q21/22 , G06K19/077 , H01L24/20 , H01L24/82 , H01L2223/6677 , H01L2224/16227 , H01L2924/15153 , H01L2924/15321 , H01Q21/0025 , H01Q21/0087 , H01Q21/0093 , H01Q21/065 , H01Q23/00
Abstract: Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.
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公开(公告)号：US09614277B2
公开(公告)日：2017-04-04
申请号：US14431211
申请日：2013-09-26
Applicant: OMNIRADAR BV
IPC: H01Q1/48 , G01S7/03 , H01Q1/22 , H01Q1/38 , H01Q1/42 , H01Q15/08 , H01Q19/06 , H01Q19/10 , H01Q21/00 , H01Q21/06
CPC classification number: H01Q1/48 , G01S7/032 , G01S2007/027 , H01L2224/48227 , H01L2224/97 , H01L2924/181 , H01Q1/2283 , H01Q1/38 , H01Q1/42 , H01Q15/08 , H01Q19/06 , H01Q19/10 , H01Q21/0093 , H01Q21/061 , H01L2924/00012
Abstract: A radio frequency module comprises an antenna assembly on a semiconductor integrated circuit that can transmit an electromagnetic signal in a frequency band of interest, or receive an electromagnetic signal in a frequency band of interest, or both. In the radio frequency module, a conductive layer that forms a signal ground plane. At least one semiconductor layer of the semiconductor integrated circuit forms part of this dielectric spacing. The dielectric spacing is arranged so that an electromagnetic signal in the frequency band of interest that traverses through the dielectric spacing from the antenna assembly to the conductive layer that forms the signal ground plane experiences a phase shift comprised in the range between 60 and 120 degrees.
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公开(公告)号：US20160336654A1
公开(公告)日：2016-11-17
申请号：US15112998
申请日：2015-01-21
Applicant: DENSO CORPORATION
Inventor： Kazuhiro AOKI , Shinichiro MATSUZAWA
CPC classification number: H01Q5/55 , H01P3/121 , H01P3/16 , H01P5/087 , H01P5/107 , H01Q1/48 , H01Q9/0407 , H01Q9/045 , H01Q21/0093 , H05K1/0218 , H05K1/0239 , H05K1/115 , H05K2201/09363 , H05K2201/09618
Abstract: A collective lamination substrate N is provided with pattern layers having N number of layers, where N is an integer and 4 or more, a pseudo waveguide formed penetrating through the pattern layers in a lamination direction, a converter section formed in the pattern layers, mutually converting between an electrical signal and radio waves being transmitted and received via the pseudo waveguide, and ground patterns formed in the pattern layers, covering a periphery of a waveguide formation section. The collective lamination substrate further includes: antennas formed in the waveguide formation section; a first via group provided in a periphery of the waveguide formation section; and a second via group provided in a periphery of the waveguide formation section and positioned at a more outer portion than the first via group.
Abstract translation: 集体层叠基板N设置有N层数的图案层，其中N为整数且为4以上，形成在层叠方向上贯穿图案层的伪波导管，形成在图案层中的转换器部分相互 在电信号和经由伪波导发送和接收的无线电波之间进行转换，以及形成在图案层中的覆盖波导形成部分的周边的接地图案。 集体层叠基板还包括：形成在波导形成部中的天线; 设置在波导形成部的周围的第一通孔组; 以及第二通孔组，设置在波导形成部的周边并位于比第一通孔组更外侧的部分。
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