公开(公告)号：US20200058999A1

公开(公告)日：2020-02-20

申请号：US16344595

申请日：2017-10-23

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Antti LAMMINEN

IPC: H01Q9/38 ,  H01Q1/48 ,  H01Q9/06 ,  H01Q9/28 ,  H01Q1/42 ,  H01Q1/22 ,  H01Q5/49

Abstract: A dipole antenna, comprising: a radiating element comprising two elliptical electrically conductive patterns arranged on a first plane, a ground plane element comprising a coupling aperture, the ground plane element arranged on a second plane spaced apart from the first plane, a feed element, said radiating element being electromagnetically coupled to the feed element via said via said coupling aperture in the ground plane element.

公开(公告)号：US20240405444A1

公开(公告)日：2024-12-05

申请号：US18686353

申请日：2022-08-25

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Mikko VARONEN ,  Dristy PARVEG ,  Pekka RANTAKARI ,  Antti LAMMINEN ,  Vladimir ERMOLOV ,  Jussi SÄILY ,  Timo KARTTAAVI

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q3/36 ,  H04B7/06

Abstract: The present invention relates to a modular architecture for transmitting and/or receiving radio frequency (RF) signals using a phased antenna array. A first portion of the RF signal is transmitted/received by a master IC (21) and a second portion of the RF signal is transmitted/received by a plurality of satellite ICs (22). RF distribution between the master IC (21) and the satellite ICs (22) occur over a low-RF-loss interposer (51). The master IC (21) performs upconversion/downconversion between RF signal and a baseband or intermediate frequency signal.

公开(公告)号：US20240047854A1

公开(公告)日：2024-02-08

申请号：US18266407

申请日：2021-12-03

Applicant: Teknologian tutkimuskeskus VTT Oy

Inventor： Vladimir ERMOLOV ,  Antti LAMMINEN

IPC: H01Q1/22 ,  H01Q21/00 ,  H01Q3/26 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01Q21/0006 ,  H01Q21/0093 ,  H01Q3/26 ,  H01L23/66 ,  H01L2924/1423

Abstract: The present invention relates to a millimeter wave RF antenna array apparatus. The apparatus comprises a single-chip MMIC comprising active circuit elements of the antenna array apparatus. The active circuit elements comprise at least antenna feed circuitry configured to feed antenna elements of the antenna array. The apparatus comprises an interposer fabricated of low-loss RF material, such as glass, low-temperature co-fired ceramic, LTCC, or printed circuit board, PCB. The interposer comprises transmission lines of a RF distribution network and a plurality of antenna elements of the antenna array. The transmission lines of the interposer are coupled to the MMIC for providing RF connections for distributing RF signals to and from the antenna feed circuitry. Area of the interposer that comprises the transmission lines of the RF distribution network and the plurality of antenna elements is collocated with the area of the MMIC that comprises said antenna feed circuitry.

公开(公告)号：US20220166122A1

公开(公告)日：2022-05-26

申请号：US17440523

申请日：2020-03-17

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Mikko VARONEN ,  Antti LAMMINEN

IPC: H01P5/16 ,  H01L23/66

Abstract: A hybrid millimeter-wave Wilkinson divider comprises an input port (1), a first output port (2), a second output port (3), and transmission lines connecting the input port (1) to the first and second output ports (2, 3) implemented by transmission lines in a carrier substrate (PCB, 31). An isolation resistor of the Wilkinson divider connected between the first and second output ports (2, 3) is integrated in a monolithic micro-wave integrated circuit (MMIC) chip (40) installed on the carrier substrate. On the MMIC chip the isolation resistor is connected between RF input metal pads. A compensation circuit for parasitic capacitances caused by the RF input metal pads is provided on the MMIC chip (40) so that the on-chip resistor appears as a pure resistance to the output ports (2, 3) of the Wilkinson divider on the carrier substrate (PCB, 31).

公开(公告)号：US20200158757A1

公开(公告)日：2020-05-21

申请号：US16615239

申请日：2018-05-22

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Vladimir ERMOLOV ,  Antti LAMMINEN ,  Jussi SÄILY ,  Tauno VÄHÄ-HEIKKILÄ ,  Pekka RANTAKARI

IPC: G01R1/24 ,  G01R1/067 ,  G01R21/01 ,  H01P5/107 ,  H01P5/12

Abstract: A probe apparatus of a millimeter or submillimeter radio frequency band comprises transition layers having outermost layers on opposite surfaces of the probe apparatus. An internal transition cavity extends through the transition layers for guiding electromagnetic radiation within the probe apparatus. A probe layer disposed between the transition layers, the probe layer having a lateral transmission line for interacting with the electromagnetic radiation guided by the internal transmission cavity.