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公开(公告)号：US20170149404A1
公开(公告)日：2017-05-25
申请号：US14948477
申请日：2015-11-23
发明人： Ming Hsien Tsai , Chien-Min Lin , Fu-Lung Hsueh , Han-Ping Pu , Sa-Lly Liu , Sen-Kuei Hsu
IPC分类号： H03H1/00 , H03H7/01 , H01L29/93 , H01L23/528 , H01L23/522
CPC分类号： H03H1/0007 , H01L23/5223 , H01L23/5225 , H01L23/5227 , H01L23/5286 , H01L29/93 , H03H7/0115
摘要： An integrated circuit (IC) die for electromagnetic band gap (EBG) noise suppression is provided. A power mesh and a ground mesh are stacked within a back end of line (BEOL) region overlying a semiconductor substrate, and an inductor is arranged over the power and ground meshes. The inductor comprises a plurality of inductor segments stacked upon one another and connected end to end to define a length of the inductor. A capacitor underlies the power and ground meshes, and is connected in series with the inductor. Respective terminals of the capacitor and the inductor are respectively coupled to the power and ground meshes. A method for manufacturing the IC die is also provided.
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公开(公告)号：US20150241507A1
公开(公告)日：2015-08-27
申请号：US14189112
申请日：2014-02-25
发明人： Mill-Jer Wang , Ching-Nen Peng , Hung-Chih Lin , Sen-Kuei Hsu , Chuan-Ching Wang , Hao Chen
IPC分类号： G01R31/265 , G01R1/073 , G01R31/26
CPC分类号： G01R31/265 , G01R31/3025
摘要： A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas.
摘要翻译： 公开了一种包括以下概述的操作的方法。 对于测试夹具上的多个管芯，确定一个管芯的每个第一天线与另一个管芯的每个第一天线之间的天线距离。 模具被分类为管芯组，其中一个管芯组中的一个管芯中的一个管芯的每个第一个天线之间的天线距离和另一个管芯组中的另一个管芯的每个第一个天线之间的天线距离较大 比干扰阈值。 在模具组上依次执行测试过程。 每个测试过程根据第一天线与被测设备的第二天线之间的信号传输进行，每个位置上对应于第一天线之一。
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公开(公告)号：US11322453B2
公开(公告)日：2022-05-03
申请号：US16697133
申请日：2019-11-26
发明人： Sen-Kuei Hsu
IPC分类号： H01L23/552 , H01L23/538 , H01L23/31 , H01L23/66 , H01L23/00 , H01L21/56 , H01L21/48 , H01L23/29 , H01L23/498 , H01L21/683
摘要： A semiconductor package includes a die, through insulator vias, an encapsulant, and a pair of metallization layers. The through insulator vias are disposed beside the die. The encapsulant wraps the die and the through insulator vias. The pair of metallization layers is disposed on opposite sides of the encapsulant. One end of each through insulator via contacts one of the metallization layers and the other end of each through insulator via contacts the other metallization layer. The through insulator vias form at least one photonic crystal structure. A pair of the through insulator vias is separated along a first direction by a channel filled by the encapsulant. A width of the channel along the first direction is larger than a pitch of the photonic crystal structure along the first direction.
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公开(公告)号：US20200273773A1
公开(公告)日：2020-08-27
申请号：US16283852
申请日：2019-02-25
发明人： Albert Wan , Chen-Hua Yu , Chung-Shi Liu , Chao-Wen Shih , Han-Ping Pu , Hsin-Yu Pan , Sen-Kuei Hsu
IPC分类号： H01L23/373 , H01L23/31 , H01L23/538 , H01L23/66 , H01L23/00 , H01L21/48 , H01L21/56 , H01Q1/22 , H01Q1/02
摘要： A semiconductor device including a chip package and an antenna package disposed on the chip package is provided. The chip package includes a semiconductor chip, an encapsulation enclosing the semiconductor chip, and a redistribution structure disposed on the semiconductor chip and the encapsulation and electrically coupled to the semiconductor chip. The antenna package includes an antenna pattern electrically coupled to the chip package, and an intermediate structure disposed between the antenna pattern and the chip package, wherein the intermediate structure comprises a ceramic element in contact with the redistribution structure and thermally dissipating a heat generated from the semiconductor chip.
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公开(公告)号：US10725090B2
公开(公告)日：2020-07-28
申请号：US15893466
申请日：2018-02-09
发明人： Mill-Jer Wang , Ching-Nen Peng , Hung-Chih Lin , Sen-Kuei Hsu , Chuan-Ching Wang , Hao Chen
IPC分类号： G01R31/265 , G01R31/302
摘要： A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.
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26.发明授权公开(公告)号：US11631993B2
公开(公告)日：2023-04-18
申请号：US16933415
申请日：2020-07-20
发明人： Chen-Hua Yu , Chita Chuang , Chen-Shien Chen , Ming Hung Tseng , Sen-Kuei Hsu , Yu-Feng Chen , Yen-Liang Lin
IPC分类号： H02J50/10 , H02J50/00 , H01F27/28 , H01F41/04 , H01F38/14 , H02J50/40 , H02J7/00 , H02J7/04 , H01L21/768
摘要： Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.
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公开(公告)号：US11508666B2
公开(公告)日：2022-11-22
申请号：US16914480
申请日：2020-06-29
发明人： Sen-Kuei Hsu , Hsin-Yu Pan , Chien-Chang Lin
IPC分类号： H01L29/00 , H01L23/538 , H03H7/01 , H01L23/66 , H01P3/08
摘要： A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.
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公开(公告)号：US20210407914A1
公开(公告)日：2021-12-30
申请号：US16914480
申请日：2020-06-29
发明人： Sen-Kuei Hsu , Hsin-Yu Pan , Chien-Chang Lin
IPC分类号： H01L23/538 , H03H7/01 , H01L23/66 , H01P3/08
摘要： A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.
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公开(公告)号：US20210183760A1
公开(公告)日：2021-06-17
申请号：US17188787
申请日：2021-03-01
发明人： Chao-Wen Shih , Chen-Hua Yu , Han-Ping Pu , Hsin-Yu Pan , Hao-Yi Tsai , Sen-Kuei Hsu
IPC分类号： H01L23/525 , H01L23/552 , H01L23/00 , H01L23/522 , H01L23/532 , H01L23/29 , H01L23/31 , H01L21/56
摘要： A method includes forming a dielectric layer over a contact pad of a device, forming a first polymer layer over the dielectric layer, forming a first conductive line and a first portion of a second conductive line over the first polymer layer, patterning a photoresist to form an opening over the first portion of the second conductive feature, wherein after patterning the photoresist the first conductive line remains covered by photoresist, forming a second portion of the second conductive line in the opening, wherein the second portion of the second conductive line physically contacts the first portion of the second conductive line, and forming a second polymer layer extending completely over the first conductive line and the second portion of the second conductive line.
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公开(公告)号：US10748831B2
公开(公告)日：2020-08-18
申请号：US15992196
申请日：2018-05-30
发明人： Sen-Kuei Hsu , Ching-Feng Yang , Hsin-Yu Pan , Kai-Chiang Wu , Yi-Che Chiang
IPC分类号： H01L23/36 , H01L23/52 , H01L23/538 , H01L23/367 , H01L23/00 , H01L21/768 , H01L23/522
摘要： Semiconductor packages and methods of forming the same are provided. One of the semiconductor package includes a first die, a dummy die, a first redistribution layer structure, an insulating layer and an insulating layer. The dummy die is disposed aside the first die. The first redistribution layer structure is electrically connected to the first die and having connectors thereover. The insulating layer is disposed over the first die and the dummy die and opposite to the first redistribution layer structure. The insulating layer penetrates through the insulating layer.
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