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公开(公告)号：US20230364734A1
公开(公告)日：2023-11-16
申请号：US18359180
申请日：2023-07-26
发明人： Pin-Chuan Su , Jeng-Chi Lin , Guan-Yi Lee , Hui-Chi Huang , Kei-Wei Chen
IPC分类号： B24B37/20 , H01L21/306 , H01L21/321
CPC分类号： B24B37/20 , H01L21/30625 , H01L21/3212
摘要： An embodiment is a polishing pad including a top pad and a sub pad that is below and contacting the top pad. The top pad includes top grooves along a top surface and microchannels extending from the top grooves to a bottom surface of the top pad. The sub pad includes sub grooves along a top surface of the sub pad.
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公开(公告)号：US20230219188A1
公开(公告)日：2023-07-13
申请号：US18174125
申请日：2023-02-24
发明人： Chun-Hao Kung , Shang-Yu Wang , Ching-Hsiang Tsai , Hui-Chi Huang , Kei-Wei Chen
IPC分类号： B24B37/10 , B24B37/04 , H01L21/3105 , B24B37/32 , H01L21/321 , H01L21/768
CPC分类号： B24B37/105 , B24B37/042 , H01L21/31053 , B24B37/32 , H01L21/3212 , H01L21/7684
摘要： A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.
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公开(公告)号：US20220359191A1
公开(公告)日：2022-11-10
申请号：US17872620
申请日：2022-07-25
发明人： Hui-Chi Huang , Jeng-Chi Lin , Pin-Chuan Su , Chien-Ming Wang , Kei-Wei Chen
摘要： A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.
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公开(公告)号：US11145751B2
公开(公告)日：2021-10-12
申请号：US15939389
申请日：2018-03-29
发明人： Kuo-Ju Chen , Su-Hao Liu , Chun-Hao Kung , Liang-Yin Chen , Huicheng Chang , Kei-Wei Chen , Hui-Chi Huang , Kao-Feng Liao , Chih-Hung Chen , Jie-Huang Huang , Lun-Kuang Tan , Wei-Ming You
IPC分类号： H01L29/66 , H01L29/417 , H01L29/78
摘要： A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a source/drain structure, a dielectric layer, a contact plug. The gate structure is positioned over a fin structure. The source/drain structure is positioned in the fin structure and adjacent to the gate structure. The dielectric layer is positioned over the gate structure and the source/drain structure. The contact plug is positioned passing through the dielectric layer. The contact plug includes a first metal compound including one of group III elements, group IV elements, group V elements or a combination thereof.
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公开(公告)号：US20210205950A1
公开(公告)日：2021-07-08
申请号：US17206628
申请日：2021-03-19
发明人： Shang-Yu Wang , Chun-Hao Kung , Ching-Hsiang Tsai , Kei-Wei Chen , Hui-Chi Huang
IPC分类号： B24B37/10 , H01L21/306 , B24B37/04
摘要： A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
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公开(公告)号：US20200039022A1
公开(公告)日：2020-02-06
申请号：US16513664
申请日：2019-07-16
发明人： Chun-Hao Kung , Hui-Chi Huang , Kei-Wei Chen , Yen-Ting Chen
IPC分类号： B24B37/24 , H01L21/306
摘要： Provided herein are polishing pads in which microcapsules that include a polymer material and are dispersed, as well as methods of making and using the same. Such microcapsules are configured to break open (e.g., when the polishing pad is damaged during the dressing process), which releases the polymer material. When contacted with ultraviolet light the polymer material at least partially cures, healing the damage to the polishing pad. Such polishing pads have a longer lifetime and a more stable remove rate when compared to standard polishing pads.
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公开(公告)号：US09859165B1
公开(公告)日：2018-01-02
申请号：US15223068
申请日：2016-07-29
发明人： Li-Chieh Wu , Hui-Chi Huang
IPC分类号： H01L21/02 , H01L21/8234 , H01L21/3105 , H01L21/28 , H01L29/66 , H01L29/40 , H01L29/49
CPC分类号： H01L21/823437 , H01L21/02164 , H01L21/0217 , H01L21/28247 , H01L21/31053 , H01L29/401 , H01L29/4966 , H01L29/66545
摘要： A method for forming a semiconductor device structure is provided. The method includes receiving a structure having a first portion and a second portion, and a top surface of the first portion is higher than a top surface of the second portion. The method also includes forming a first material layer over the first portion and the second portion of the structure and forming a first material layer over the first portion and the second portion of the structure. The method further includes thinning the second material layer until the first material layer is exposed and removing a portion of the second material layer over the second portion of the structure to expose the first material layer thereunder. In addition, the method includes thinning the first material layer to expose the structure.
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