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47 条记录 (耗时 0.023 秒)

    Illuminated indicator structures for electronic devices
    22.
    发明授权
    Illuminated indicator structures for electronic devices 有权

    公开(公告)号：US09945700B2

    公开(公告)日：2018-04-17

    申请号：US15082059

    申请日：2016-03-28

    申请人： TactoTek Oy

    发明人： Antti Keränen ,  Mikko Heikkinen

    IPC分类号： G01D11/28 ,  F21V23/04 ,  F21K9/60 ,  H01H13/83

    CPC分类号： G01D11/28 ,  F21K9/60 ,  F21V23/04 ,  H01H13/83 ,  H01H2219/028 ,  H01H2219/039 ,  H01H2219/056 ,  H01H2219/06

    摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

    Illuminated indicator structures for electronic devices
    23.
    发明授权
    Illuminated indicator structures for electronic devices 有权

    公开(公告)号：US09915556B2

    公开(公告)日：2018-03-13

    申请号：US15082059

    申请日：2016-03-28

    申请人： TactoTek Oy

    发明人： Antti Keränen ,  Mikko Heikkinen

    IPC分类号： G01D11/28 ,  F21V23/04 ,  F21K9/60 ,  H01H13/83

    摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

    SYSTEM FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE
    26.
    发明申请
    SYSTEM FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE 有权

    公开(公告)号：US20220117091A1

    公开(公告)日：2022-04-14

    申请号：US17557104

    申请日：2021-12-21

    申请人： TactoTek Oy

    发明人： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

    IPC分类号： H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03

    摘要： A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

    Illuminated multilayer structure with embedded light sources
    27.
    发明授权
    Illuminated multilayer structure with embedded light sources 有权

    公开(公告)号：US11287564B2

    公开(公告)日：2022-03-29

    申请号：US17152978

    申请日：2021-01-20

    申请人： TACTOTEK OY

    发明人： Antti Keränen ,  Mikko Heikkinen

    IPC分类号： G02B6/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

    摘要： An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

    Illuminated multilayer structure with embedded light sources
    29.
    发明授权
    Illuminated multilayer structure with embedded light sources 审中-公开

    公开(公告)号：US10670800B2

    公开(公告)日：2020-06-02

    申请号：US16155956

    申请日：2018-10-10

    申请人： TACTOTEK OY

    发明人： Antti Keränen ,  Mikko Heikkinen

    IPC分类号： F21S10/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

    摘要： An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

    Multilayer structure and related method of manufacture for electronics
    30.
    发明授权
    Multilayer structure and related method of manufacture for electronics 有权

    公开(公告)号：US10667401B2

    公开(公告)日：2020-05-26

    申请号：US16045009

    申请日：2018-07-25

    申请人： TactoTek Oy

    发明人： Mikko Heikkinen ,  Antti Keränen ,  Jarmo Sääski ,  Ronald H. Haag

    IPC分类号： H05K3/32 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

    摘要： A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.