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公开(公告)号：US20210017317A1
公开(公告)日：2021-01-21
申请号：US16978564
申请日：2019-03-11
Inventor： Hiroaki UMEHARA , Yiqun WANG , Hiroharu INOUE
IPC: C08F290/06 , C08J5/24 , B32B15/08 , H05K1/05
Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
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22.发明申请公开(公告)号：US20200181403A1
公开(公告)日：2020-06-11
申请号：US16641928
申请日：2018-06-29
Inventor： Fumito SUZUKI , Hiroaki UMEHARA , Jun YASUMOTO , Hiroharu INOUE
IPC: C08L71/12 , C08K5/5399 , C08J5/24 , B32B15/08 , H05K1/03
Abstract: The present application relates to a polyphenylene ether resin composition containing (A) a modified polyphenylene ether compound having a terminal modified with a substituent having an unsaturated carbon-carbon double bond, (B) a crosslinking curing agent having an unsaturated carbon-carbon double bond in the molecule, and (C) a flame retardant. The flame retardant (C) contains at least a modified cyclic phenoxy phosphazene compound represented by formula (I).
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公开(公告)号：US20200087474A1
公开(公告)日：2020-03-19
申请号：US16466979
申请日：2017-12-07
Inventor： Keiko KASHIHARA , Rihoko WATANABE , Hiroharu INOUE
Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
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24.发明公开公开(公告)号：US20230257581A1
公开(公告)日：2023-08-17
申请号：US18012161
申请日：2021-06-14
Inventor： Jun YASUMOTO , Rihoko WATANABE , Teppei WASHIO , Hiroharu INOUE
CPC classification number: C08L79/085 , C08K5/521 , C08L25/08 , C08J5/24 , C08L2203/16 , C08L2203/20 , C08L2201/02
Abstract: A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1), where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R1 to R3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond.
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Patent Agency Ranking
公开(公告)号：US20220243013A1
公开(公告)日：2022-08-04
申请号：US17438207
申请日：2020-03-18
Inventor： Hiroaki UMEHARA , Yiqun WANG , Hiroharu INOUE
Abstract: A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.
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26.发明申请公开(公告)号：US20210092835A1
公开(公告)日：2021-03-25
申请号：US16954020
申请日：2018-12-04
Inventor： Rihoko WATANABE , Keiko KASHIHARA , Hiroharu INOUE
Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9≤X2/X1≤1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
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公开(公告)号：US20210032424A1
公开(公告)日：2021-02-04
申请号：US16978599
申请日：2019-03-11
Inventor： Hiroaki UMEHARA , Rihoko WATANABE , Hiroharu INOUE , Yiqun WANG
Abstract: A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
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28.发明申请公开(公告)号：US20200283615A1
公开(公告)日：2020-09-10
申请号：US16880593
申请日：2020-05-21
Inventor： Hiroaki UMEHARA , Hiroharu INOUE
IPC: C08L51/08 , C08J5/24 , B32B15/08 , C08L71/12 , C08L101/12 , C08F222/10 , C08L33/04 , H05K1/03 , C08L71/00 , C08F2/44 , C08G65/48 , C08F290/06 , H05K1/02
Abstract: A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.
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公开(公告)号：US20170196082A1
公开(公告)日：2017-07-06
申请号：US15468333
申请日：2017-03-24
Inventor： Hiroharu INOUE , Koji KISHINO
CPC classification number: H05K1/036 , B32B5/022 , B32B5/024 , B32B7/02 , B32B15/12 , B32B15/14 , B32B2255/06 , B32B2255/26 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/0269 , B32B2262/0276 , B32B2262/10 , B32B2307/30 , B32B2307/306 , B32B2457/08 , H05K1/00 , H05K3/022 , H05K3/025 , H05K2201/0212 , H05K2201/0275 , H05K2201/029 , H05K2201/068 , Y10T428/24942
Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.
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