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公开(公告)号：US20230357558A1
公开(公告)日：2023-11-09
申请号：US18026292
申请日：2021-09-10
Inventor： Yiqun WANG , Hirosuke SAITO , Hiroharu INOUE
CPC classification number: C08L53/00 , C08G65/485 , C08K5/14 , C08K7/18 , C08J5/244 , C08J7/0427 , H05K1/0353 , C08J2353/00 , C08L2203/16 , C08L2203/20
Abstract: A resin composition contains a styrenic block copolymer, a radical polymerizable compound, and at least one free radical compound selected from the group consisting of a compound (A) represented by Formula (1), a compound (B) represented by Formula (2), and a compound (C) having two or more of at least one group selected from groups represented by Formulas (3-1) and (3-2).
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2.发明公开公开(公告)号：US20230331944A1
公开(公告)日：2023-10-19
申请号：US18025141
申请日：2021-09-09
Inventor： Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE , Rihoko WATANABE
IPC: C08J5/24 , C08F257/02 , C08F290/06 , C08K3/36 , H05K1/03
CPC classification number: C08J5/244 , C08F257/02 , C08F290/062 , C08K3/36 , C08J5/249 , H05K1/0346 , H05K1/0366 , C08J2351/06 , C08J2351/08
Abstract: A resin composition contains a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.; and a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less.
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3.发明公开公开(公告)号：US20230323104A1
公开(公告)日：2023-10-12
申请号：US18025150
申请日：2021-09-09
Inventor： Rihoko WATANABE , Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08L53/00 , C08K5/3415 , C08K3/36 , C08L2203/16 , C08J7/0427 , H05K1/0353 , C08J2325/06 , C08J5/246
Abstract: A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.
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公开(公告)号：US20210061996A1
公开(公告)日：2021-03-04
申请号：US16957232
申请日：2018-10-16
Inventor： Hiroaki UMEHARA , Fumito SUZUKI , Jun YASUMOTO , Hiroharu INOUE
IPC: C08L71/12 , C08K5/00 , C08K5/3492 , C08J5/24
Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
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公开(公告)号：US20150282302A1
公开(公告)日：2015-10-01
申请号：US14668819
申请日：2015-03-25
Inventor： Takashi HOSHI , Hiroharu INOUE , Takeshi KITAMURA
CPC classification number: H05K1/0271 , B32B5/024 , B32B5/26 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/202 , B32B2307/51 , B32B2307/54 , B32B2457/08 , C08J5/24 , C08J2363/00 , C08J2433/00 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/0209 , H05K2201/029 , Y10T442/2361 , Y10T442/3455
Abstract: A prepreg containing: a resin composition; and a woven fabric base material. The resin composition contains: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic curing agent having a naphthalene skeleton; (B) a high molecular weight compound having at least structures represented by formulae (1) and (2 ) or at least a structure represented by the formula (2), no unsaturated bond between carbon atoms, and a weight-average molecular weight of 250,000 to 850,000; and (C) an inorganic filler. (C) The inorganic filler is subjected to surface treatment with a silane coupling agent represented by a formula (3).
Abstract translation: 一种预浸料，其包含：树脂组合物; 和织物基材。 树脂组合物含有：（A）具有萘骨架的环氧树脂和具有萘骨架的酚类固化剂中的至少一种; （B）至少具有由式（1）和（2）表示的结构或至少由式（2）表示的结构的高分子量化合物，碳原子之间不饱和键和重均分子量 25万至85万; 和（C）无机填料。 （C）用式（3）表示的硅烷偶联剂对无机填料进行表面处理。
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Patent Agency Ranking
公开(公告)号：US20240368323A1
公开(公告)日：2024-11-07
申请号：US18561098
申请日：2022-05-16
Inventor： Hirosuke SAITO , Yasunori NISHIGUCHI , Hiroaki UMEHARA , Hiroharu INOUE
IPC: C08F222/40 , C08F212/34 , C08J5/18 , C08J5/24 , H05K1/03
Abstract: One aspect of the present invention relates to a resin composition containing a maleimide compound (A) having a benzene ring in the molecule and a hydrocarbon-based compound (B) represented by the following Formula (1), in which the maleimide compound (A) contains a maleimide compound (A-1) having a maleimide group equivalent of 400 g/mol or less. In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group or an aliphatic cyclic group, and n represents an integer from 1 to 10.
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公开(公告)号：US20240239974A1
公开(公告)日：2024-07-18
申请号：US18290279
申请日：2022-05-12
Inventor： Hirosuke SAITO , Yiqun WANG , Hiroharu INOUE , Yasunori NISHIGUCHI
IPC: C08J5/18 , C08J5/24 , C08K5/5313 , H05K1/03
CPC classification number: C08J5/18 , C08J5/24 , C08K5/5313 , H05K1/0353
Abstract: A resin composition includes:
a compound (A) represented by the following formula
wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group;
and a thermosetting resin (B) containing at least one selected from among an epoxy resin, a polyphenylene ether resin, a cyanate ester resin, a phenol resin, an active ester resin, a benzoxazine resin, a maleimide resin, an acrylic resin, a methacrylic resin, a vinyl resin, an allyl resin, a propenyl resin, and a hydrocarbon-based resin having an unsaturated double bond.-
8.发明申请RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD 审中-公开树脂组合物，树脂变性，PREPREG，金属层压板和印刷线路板公开(公告)号：US20160143135A1
公开(公告)日：2016-05-19
申请号：US14988085
申请日：2016-01-05
Inventor： Hiroharu INOUE , Shingo YOSHIOKA
IPC: H05K1/03 , C08J5/24 , C09D163/00 , C09D179/08 , C08L63/00 , C08L79/08
CPC classification number: H05K1/0373 , B32B2311/00 , B32B2457/08 , C08G59/245 , C08G59/621 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08J2433/00 , C08L63/00 , C08L79/08 , C08L2203/20 , C08L2205/03 , C09D163/00 , C09D179/08 , H05K1/0346 , H05K1/0353 , H05K1/0366 , H05K2201/0162 , H05K2201/09136 , Y10T156/10 , Y10T428/31529 , C08L33/08
Abstract: A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
Abstract translation: 通过以999μm/分钟拉伸，当应变量从0％增加到0.3％时，成为表现出力响应性能使得由拉伸应力 - 应变曲线f1（x）包围的面积的固化产物的树脂组合物 而当x轴上的应变量和y轴上的拉伸应力也被x轴包围时，大于应变应变曲线f2（x）所包围的面积，当应变量减小时 0.3％，并且在施加拉伸应力之前和之后，由x轴包围，拉伸应力为0时的应变量的变化量为0.05％以下。
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公开(公告)号：US20150259489A1
公开(公告)日：2015-09-17
申请号：US14640507
申请日：2015-03-06
Inventor： Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08J5/24 , C08J2315/00 , C08J2333/00 , C08J2371/12 , C08J2433/00 , C08J2463/00 , C08J2471/12 , C08L71/12 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/0209 , H05K2201/029 , Y10T428/249921 , Y10T442/2951 , C08L33/06 , C08L33/20 , C08L63/00
Abstract: Provided is a prepreg that is formed by impregnating a fabric base material with a resin composition, then heating and drying. The resin composition includes (A) a polymer which has a specific structure, has no unsaturated bond between carbon atoms, has an epoxy number of from 0.2 to 0.8 eq/kg, and has a weight-average molecular weight of from 200,000 to 1,000,000; (B) a polyarylene-ether copolymer (PAE); and (C) an epoxy resin having two or more epoxy groups on a molecule. The component (B) is compatible with the component (A), and the component (C) is an epoxy resin that is incompatible with the component (A).
Abstract translation: 提供了通过用树脂组合物浸渍织物基材，然后加热和干燥而形成的预浸料。 树脂组合物包含（A）具有特定结构的聚合物，在碳原子之间不具有不饱和键，环氧基数为0.2〜0.8当量/ kg，重均分子量为20万〜100万。 （B）聚亚芳基醚共聚物（PAE）; 和（C）在分子上具有两个以上环氧基的环氧树脂。 组分（B）与组分（A）相容，组分（C）是与组分（A）不相容的环氧树脂。
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10.发明公开公开(公告)号：US20240190112A1
公开(公告)日：2024-06-13
申请号：US18283258
申请日：2022-03-09
Inventor： Kosuke TSUDA , Hirosuke SAITO , Yasunori NISHIGUCHI , Hiroharu INOUE
CPC classification number: B32B27/18 , B32B15/08 , B32B15/20 , B32B27/285 , C08J5/244 , C08K3/11 , B32B2264/1022 , B32B2307/204 , B32B2307/304 , B32B2371/00 , B32B2457/08 , C08J2371/12
Abstract: An aspect of the present invention is a resin composition containing at least one of a polyphenylene ether compound (A), having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, and a maleimide compound (B); and ceramic particles (C) including aluminum titanate particles (C1).
In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
In Formula (2), R4 represents a hydrogen atom or an alkyl group.
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