Invention Application
- Patent Title: PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
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Application No.: US16466979Application Date: 2017-12-07
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Publication No.: US20200087474A1Publication Date: 2020-03-19
- Inventor: Keiko KASHIHARA , Rihoko WATANABE , Hiroharu INOUE
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Priority: JP2016-239719 20161209
- International Application: PCT/JP2017/043979 WO 20171207
- Main IPC: C08J5/24
- IPC: C08J5/24 ; C08K3/013 ; H05K1/03 ; H05K3/02
Abstract:
Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
Public/Granted literature
- US11407869B2 Prepreg, metal-clad laminate and printed wiring board Public/Granted day:2022-08-09
Information query
