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公开(公告)号：US20230073563A1
公开(公告)日：2023-03-09
申请号：US17900406
申请日：2022-08-31
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA , Yasunari OYABU , Naoki SHIBATA
Abstract: Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer; and a patterning step of forming a conductive pattern on the other surface of the insulating layer are carried out.
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公开(公告)号：US20220007507A1
公开(公告)日：2022-01-06
申请号：US17296805
申请日：2019-10-28
Applicant: NITTO DENKO CORPORATION
Inventor： Rihito FUKUSHIMA , Hayato TAKAKURA , Shuichi WAKAKI
Abstract: A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.
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公开(公告)号：US20210195070A1
公开(公告)日：2021-06-24
申请号：US16756253
申请日：2018-10-02
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku SHIBATA , Hayato TAKAKURA , Yoshihiro KAWAMURA , Masaki ITO , Shuichi WAKAKI
IPC: H04N5/225 , H04N5/369 , H01L27/146
Abstract: An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.
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公开(公告)号：US20200344888A1
公开(公告)日：2020-10-29
申请号：US16464422
申请日：2017-11-06
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku SHIBATA , Takahiro TAKANO , Hayato TAKAKURA , Yoshihiro KAWAMURA , Shuichi WAKAKI
Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0
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公开(公告)号：US20150027752A1
公开(公告)日：2015-01-29
申请号：US14332486
申请日：2014-07-16
Applicant: Nitto Denko Corporation
Inventor： Hayato TAKAKURA
CPC classification number: H05K3/243 , H05K1/0393 , H05K1/056 , H05K1/117 , H05K1/118 , H05K3/002 , H05K3/244 , H05K3/287 , H05K2203/0323 , H05K2203/0514 , H05K2203/1184
Abstract: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer.
Abstract translation: 布线覆盖层形成在基底绝缘层上，导体迹线夹在其间。 在绝缘绝缘层上形成覆盖绝缘层以覆盖布线覆盖层。 端子覆盖层形成为覆盖导体迹线的端部。 布线覆盖层的突起从布线部的上表面突出到端子部的上方。 突起的端面从盖绝缘层的端部向内定位。 端子覆盖层的插入部分形成在端子部分的上表面和覆盖绝缘层的端部的下表面之间。 端子覆盖层的突起形成在端子部分的上表面和布线覆盖层的突起的下表面之间。
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Patent Agency Ranking
公开(公告)号：US20240244742A1
公开(公告)日：2024-07-18
申请号：US18559498
申请日：2022-01-28
Applicant: NITTO DENKO CORPORATION
Inventor： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
CPC classification number: H05K1/0296 , H05K1/05 , H05K2201/09927
Abstract: A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.
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公开(公告)号：US20240224435A1
公开(公告)日：2024-07-04
申请号：US18550252
申请日：2022-01-25
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA , Naoki SHIBATA , Makoto TSUNEKAWA
IPC: H05K3/46
CPC classification number: H05K3/4644
Abstract: A method for producing a wiring circuit board includes a step of forming an insulating layer on one surface in a thickness direction of a substrate, a step of forming a plurality of wirings on one surface in the thickness direction of the insulating layer, a step of forming an opening portion including the plurality of wirings when projected in the thickness direction in the substrate, a step of forming a resist pattern having an opening portion having a pattern shape along the plurality of wirings on the other surface in the thickness direction of the insulating layer, a step of forming a metal support portion by depositing a metal material on the insulating layer inside the opening portion, and a step of removing the resist pattern.
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公开(公告)号：US20240107667A1
公开(公告)日：2024-03-28
申请号：US18471063
申请日：2023-09-20
Applicant: NITTO DENKO CORPORATION
Inventor： Kenta FUKUSHIMA , Hayato TAKAKURA , Naoki SHIBATA , Ryosuke SASAOKA
CPC classification number: H05K1/05 , H05K3/0017 , H05K2203/0121 , H05K2203/0353
Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a metal layer on one side of the substrate in a thickness direction; a step of forming a first insulating layer on one side of the metal layer in the thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of removing the substrate and exposing the metal layer; and a step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer. The first metal support layer has a terminal support portion supporting two terminals of a conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.
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公开(公告)号：US20230254971A1
公开(公告)日：2023-08-10
申请号：US18163071
申请日：2023-02-01
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA , Naoki SHIBATA , Kenya TAKIMOTO , Chihiro WATANABE
IPC: H05K1/05
CPC classification number: H05K1/05 , H05K2201/09036
Abstract: Provided is a wiring circuit board and a wiring circuit board assembly that allow suppression of the recognition error of the dot pattern. The wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.
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公开(公告)号：US20230137656A1
公开(公告)日：2023-05-04
申请号：US17973180
申请日：2022-10-25
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA , Naoki SHIBATA , Ryosuke SASAOKA
Abstract: Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.
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