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公开(公告)号：US20240260177A1
公开(公告)日：2024-08-01
申请号：US18007388
申请日：2021-05-24
Applicant: NITTO DENKO CORPORATION
Inventor： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
CPC classification number: H05K1/0298 , H05K3/02
Abstract: Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.
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公开(公告)号：US20240114628A1
公开(公告)日：2024-04-04
申请号：US18471046
申请日：2023-09-20
Applicant: NITTO DENKO CORPORATION
Inventor： Kenta FUKUSHIMA , Hayato TAKAKURA , Naoki SHIBATA , Ryosuke SASAOKA
CPC classification number: H05K3/103 , H05K1/0296 , H05K3/0017 , H05K3/32 , H05K2201/10287
Abstract: A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.
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3.发明申请PLATING APPARATUS, PLATING METHOD, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD 审中-公开电镀设备，电镀方法，制造印刷电路板和印刷电路板的方法公开(公告)号：US20140311776A1
公开(公告)日：2014-10-23
申请号：US14230505
申请日：2014-03-31
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA
Abstract: A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless steel plate melts due to the reduction reaction and is removed. Thereafter, a voltage is applied between the stainless steel plate and the electrode such that the stainless steel plate is a cathode, whereby a plating underlayer is formed at the portion to be plated of the stainless steel plate from which the passive film is removed.
Abstract translation: 在不锈钢板和电极之间施加电压，使得不锈钢板是阳极，由此在不锈钢板的被镀部分形成的钝化膜由于还原反应而熔化并被除去。 此后，在不锈钢板和电极之间施加电压，使得不锈钢板是阴极，由此在去除钝化膜的不锈钢板的待镀层部分形成镀层底层。
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公开(公告)号：US20240284600A1
公开(公告)日：2024-08-22
申请号：US18569093
申请日：2022-05-24
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA , Naoki SHIBATA , Rei FUKUI , Tomoaki TANAKA
CPC classification number: H05K3/108 , C25D5/022 , H05K3/002 , H05K3/18 , H05K2203/0723
Abstract: A method for producing a wiring circuit board includes a first step of setting a pattern forming region and an opening forming region in a supporting layer; a second step of forming a base insulating layer on the supporting layer at least in the pattern forming region; a third step of forming, by electrolytic plating, a conductive pattern on the base insulating layer in the pattern forming region and a dummy pattern in the opening forming region; and a fourth step of etching at least a portion of the supporting layer in the opening forming region.
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公开(公告)号：US20240107683A1
公开(公告)日：2024-03-28
申请号：US18471033
申请日：2023-09-20
Applicant: NITTO DENKO CORPORATION
Inventor： Kenta FUKUSHIMA , Hayato TAKAKURA , Naoki SHIBATA , Ryosuke SASAOKA
CPC classification number: H05K3/4007 , H05K1/0298 , H05K3/062
Abstract: A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.
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Patent Agency Ranking
公开(公告)号：US20220386459A1
公开(公告)日：2022-12-01
申请号：US17775797
申请日：2020-10-13
Applicant: NITTO DENKO CORPORATION
Inventor： Rihito FUKUSHIMA , Hayato TAKAKURA , Naoki SHIBATA
Abstract: A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.
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公开(公告)号：US20220201871A1
公开(公告)日：2022-06-23
申请号：US17610060
申请日：2020-03-31
Applicant: NITTO DENKO CORPORATION
Inventor： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.
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公开(公告)号：US20210298175A1
公开(公告)日：2021-09-23
申请号：US17338130
申请日：2021-06-03
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku SHIBATA , Hayato TAKAKURA , Masaki ITO , Yoshihiro KAWAMURA , Shuichi WAKAKI
Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
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公开(公告)号：US20200077520A1
公开(公告)日：2020-03-05
申请号：US16607616
申请日：2018-04-25
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku SHIBATA , Hayato TAKAKURA , Yoshihiro KAWAMURA , Shuichi WAKAKI
Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 μm or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10−6/% RH or less.
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公开(公告)号：US20240107664A1
公开(公告)日：2024-03-28
申请号：US18471070
申请日：2023-09-20
Applicant: NITTO DENKO CORPORATION
Inventor： Kenta FUKUSHIMA , Hayato TAKAKURA , Naoki SHIBATA , Ryosuke SASAOKA
CPC classification number: H05K1/0296 , H05K3/0017 , H05K3/10
Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a first insulating layer on one side of the substrate in a thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of etching the substrate to form a first metal support layer on the other side of the first insulating layer in the thickness direction; and a step of depositing a metal on the other side of the first metal support layer in the thickness direction to form a second metal support layer. The second metal support layer has a terminal support portion supporting two terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.
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