公开(公告)号：US20240284600A1

公开(公告)日：2024-08-22

申请号：US18569093

申请日：2022-05-24

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Naoki SHIBATA ,  Rei FUKUI ,  Tomoaki TANAKA

IPC: H05K3/10 ,  C25D5/02 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K3/108 ,  C25D5/022 ,  H05K3/002 ,  H05K3/18 ,  H05K2203/0723

Abstract: A method for producing a wiring circuit board includes a first step of setting a pattern forming region and an opening forming region in a supporting layer; a second step of forming a base insulating layer on the supporting layer at least in the pattern forming region; a third step of forming, by electrolytic plating, a conductive pattern on the base insulating layer in the pattern forming region and a dummy pattern in the opening forming region; and a fourth step of etching at least a portion of the supporting layer in the opening forming region.