公开(公告)号：US20210243900A1

公开(公告)日：2021-08-05

申请号：US17237616

申请日：2021-04-22

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takahiro TAKANO ,  Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K3/10 ,  H05K1/02

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0

公开(公告)号：US20200288575A1

公开(公告)日：2020-09-10

申请号：US16649825

申请日：2018-09-06

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hayato TAKAKURA ,  Masaki ITO ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46

Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

公开(公告)号：US20210298175A1

公开(公告)日：2021-09-23

申请号：US17338130

申请日：2021-06-03

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hayato TAKAKURA ,  Masaki ITO ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

公开(公告)号：US20200077520A1

公开(公告)日：2020-03-05

申请号：US16607616

申请日：2018-04-25

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K1/18 ,  H05K3/28

Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 μm or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10−6/% RH or less.

公开(公告)号：US20210195070A1

公开(公告)日：2021-06-24

申请号：US16756253

申请日：2018-10-02

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Masaki ITO ,  Shuichi WAKAKI

IPC: H04N5/225 ,  H04N5/369 ,  H01L27/146

Abstract: An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.

公开(公告)号：US20200344888A1

公开(公告)日：2020-10-29

申请号：US16464422

申请日：2017-11-06

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takahiro TAKANO ,  Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K3/10 ,  H05K1/02

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0

公开(公告)号：US20210084750A1

公开(公告)日：2021-03-18

申请号：US16644781

申请日：2018-09-05

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshihiro KAWAMURA ,  Shusaku SHIBATA ,  Hayato TAKAKURA ,  Masaki ITO

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46

Abstract: A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.

公开(公告)号：US20200154016A1

公开(公告)日：2020-05-14

申请号：US16607580

申请日：2018-04-25

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI ,  Shusaku SHIBATA

IPC: H04N5/225 ,  H05K1/03

Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.

公开(公告)号：US20200075474A1

公开(公告)日：2020-03-05

申请号：US16607612

申请日：2018-04-23

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Shuichi WAKAKI ,  Shusaku SHIBATA ,  Yoshihiro KAWAMURA ,  Masaki ITO

IPC: H01L23/498 ,  H01L27/146 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H04N5/225

Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.