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公开(公告)号：US20160184593A1
公开(公告)日：2016-06-30
申请号：US14966279
申请日：2015-12-11
申请人： Medtronic, Inc.
发明人： David A. Ruben , Michael S. Sandlin
CPC分类号： A61N1/3754 , H05K3/32 , H05K3/42
摘要： Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.
摘要翻译： 公开了可植入医疗装置系统的各种实施例和形成这种系统的方法。 在一个或多个实施例中，可植入医疗装置系统包括壳体，设置在壳体内的电子装置，以及连接到壳体的侧壁并与电子装置电连接的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部接触电耦合到布置在通孔中的导电材料。 在一个或多个实施例中，通过围绕通孔的激光键将外部接触件气密地密封到非导电衬底的外表面。
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公开(公告)号：US20140171822A1
公开(公告)日：2014-06-19
申请号：US14186039
申请日：2014-02-21
申请人： Medtronic, Inc.
发明人： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
CPC分类号： H01L23/12 , A61B5/0031 , A61B5/01 , A61B5/03 , A61B5/11 , A61N1/37211 , A61N1/3758 , B81B2201/0214 , B81B2207/012 , B81C1/0023 , H01L23/58 , H01L25/0655 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2924/1461 , H01L2924/15153 , H01L2924/15192 , H01L2924/15313 , H01L2924/16195 , H01L2924/16251 , H01L2924/19105 , H01L2924/00
摘要： A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
摘要翻译： 医疗装置包括第一基板，第二基板，控制模块和能量存储装置。 第一基板包括第一半导体材料和第一绝缘材料中的至少一个。 第二基板包括第二半导体材料和第二绝缘材料中的至少一个。 第二基板被结合到第一基板，使得第一和第二基板在第一和第二基板之间限定封闭的空腔。 控制模块设置在封闭腔内。 控制模块被配置为至少确定患者的生理参数并向患者传递电刺激中的至少一个。 能量存储装置设置在空腔内并被配置为向控制模块供电。
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公开(公告)号：US12082354B2
公开(公告)日：2024-09-03
申请号：US17574362
申请日：2022-01-12
申请人： Medtronic, Inc.
CPC分类号： H05K5/0095 , A61N1/3787 , H02J50/10 , H05K1/181 , H05K5/0052 , H05K2201/10015
摘要： Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.
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公开(公告)号：US11950387B2
公开(公告)日：2024-04-02
申请号：US17074171
申请日：2020-10-19
申请人： Medtronic, Inc.
发明人： David A. Ruben
CPC分类号： H05K5/066 , A61N1/3754 , H05K3/38 , H05K5/06 , H05K7/06 , H05K2203/107
摘要： Methods of forming hermetically-sealed packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.
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公开(公告)号：US20230314340A1
公开(公告)日：2023-10-05
申请号：US17707241
申请日：2022-03-29
申请人： Medtronic, Inc.
发明人： Luling Wang , Anna M. Belle , Mohsen Askarinya , David A. Ruben , Omid Mahdavi , David A. Anderson , Shawn C. Kelley
IPC分类号： G01N21/93 , A61B5/1495 , A61B5/145
CPC分类号： G01N21/93 , A61B5/14865 , A61B5/14532 , A61B5/1495
摘要： An analyte sensor apparatus for detecting an analyte in a target environment includes a plurality of biotransducers and a controller. The plurality of biotransducers are configured to provide a baseline signal, one or more analyte signals, and at least one error condition signal. The plurality of biotransducers at least one reference biotransducer, one or more working biotransducers, and at least one working as reference biotransducer. The controller is operatively coupled to the plurality of biotransducers and is configured to receive the baseline signal, the one or more analyte signals, and the error correction signal. The controller is further configured to determine and/or output one or more adjusted analyte levels using the baseline signal, the one or more analyte signals, and the error correction signal.
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公开(公告)号：US20220378371A1
公开(公告)日：2022-12-01
申请号：US17884909
申请日：2022-08-10
申请人： Medtronic, Inc.
发明人： David A. Ruben , Craig L. Schmidt
IPC分类号： A61B5/00 , A61N1/05 , A61N1/372 , A61N1/375 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/32 , H05K3/40 , H05K5/02 , H05K5/03 , H05K5/06 , A61B5/0245
摘要： Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.
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公开(公告)号：US20220244123A1
公开(公告)日：2022-08-04
申请号：US17571825
申请日：2022-01-10
申请人： Medtronic, Inc.
发明人： Andreas Fenner , David A. Ruben , Andrew J. Ries , Chetan Patel
IPC分类号： G01L9/00 , B23K26/20 , H01L23/522 , H05K5/06 , H01L23/00
摘要： Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.
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公开(公告)号：US20210051812A1
公开(公告)日：2021-02-18
申请号：US17074171
申请日：2020-10-19
申请人： Medtronic, Inc.
发明人： David A. Ruben
摘要： Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.
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公开(公告)号：US10765372B2
公开(公告)日：2020-09-08
申请号：US16580657
申请日：2019-09-24
申请人： Medtronic, Inc.
发明人： David A. Ruben , Craig L. Schmidt
IPC分类号： H05K5/06 , H05K5/02 , A61B5/00 , A61N1/375 , A61N1/372 , A61B5/0245 , A61N1/05 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/32 , H05K3/40 , H05K5/03
摘要： Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.
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公开(公告)号：US20190255335A1
公开(公告)日：2019-08-22
申请号：US16405032
申请日：2019-05-07
申请人： Medtronic, Inc.
摘要： Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.
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