公开(公告)号：US20220299610A1

公开(公告)日：2022-09-22

申请号：US17304070

申请日：2021-06-14

Applicant: Lumentum Operations LLC

Inventor： Mikhail DOLGANOV ,  Lijun ZHU ,  Hao HUANG ,  Siu Kwan CHEUNG

IPC: G01S7/4865 ,  G01S17/10 ,  G01S7/484 ,  G01S17/89

Abstract: In some implementations, a driver circuit may include a source to provide an electrical input, and an array of optical emitters arranged in one or more rows and one or more columns. The array may include an optical emitter associated with a row and a column. The driver circuit may include a first switch having an open state and a closed state, and an inductive element connected to the row. The first switch in the closed state may cause current to charge the inductive element. The driver circuit may include a second switch having an open state and a closed state. The second switch in the closed state may select the column. The first switch transitioning from the closed state to the open state may cause the inductive element to discharge current through the row, and through the column when the second switch is in the closed state.

公开(公告)号：US20220085572A1

公开(公告)日：2022-03-17

申请号：US17247660

申请日：2020-12-18

Applicant: Lumentum Operations LLC

Inventor： John Michael MILLER ,  Lijun ZHU ,  Huanlin ZHU ,  Benjamin KESLER ,  Ajit Vijay BARVE

IPC: H01S5/183 ,  F21S8/00

Abstract: In some implementations, an emitter module may include an emitter layer including a first emitter array configured to produce a first beam that provides flood illumination, and a second emitter array configured to produce a second beam that provides spot illumination. The emitter module may include a first optics layer, positioned in front of the emitter layer, that includes a first collimating lens positioned in front of the first emitter array, and a second collimating lens positioned in front of the second emitter array. The emitter module may include a second optics layer, positioned in front of the first optics layer, that includes an optical diffuser positioned in front of the first collimating lens, and a beamsplitter grating positioned in front of the second collimating lens.

公开(公告)号：US20240396297A1

公开(公告)日：2024-11-28

申请号：US18362569

申请日：2023-07-31

Applicant: Lumentum Operations LLC

Inventor： Siu Kwan CHEUNG ,  Lijun ZHU ,  Qianhuan YU ,  Benjamin KESLER ,  Wei SHI ,  Joseph LEIGH

IPC: H01S5/042 ,  H01S5/42

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) device. The VCSEL device may include a substrate. The VCSEL device may include a plurality of VCSELs on the substrate. The VCSEL device may include at least one anode layer on the substrate and electrically connected to the plurality of VCSELs. The VCSEL device may include a cathode electrode over at least a portion of multiple VCSELs, of the plurality of VCSELs, and electrically connected to the multiple VCSELs. The cathode electrode may include multiple cathode electrode fingers. The emitter assembly may include a bridge element that electrically connects a first finger of the multiple cathode electrode fingers and a second finger of the multiple cathode electrode fingers.

公开(公告)号：US20240195153A1

公开(公告)日：2024-06-13

申请号：US18194156

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/024 ,  H01S5/183

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02469 ,  H01S5/18305

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs in a bottom-emitting configuration, and multiple VCSELs, of the plurality of VCSELs, may be grouped in a cluster. The emitter assembly may include a carrier, and the VCSEL chip may be in a flip chip configuration with the carrier. The emitter assembly may include a conductive pillar electrically connected to the multiple VCSELs grouped in the cluster.

公开(公告)号：US20240039637A1

公开(公告)日：2024-02-01

申请号：US18464591

申请日：2023-09-11

Applicant: Lumentum Operations LLC

Inventor： Mikhail DOLGANOV ,  Lijun ZHU ,  Hao HUANG

IPC: H04B10/564 ,  H04B10/50

CPC classification number: H04B10/564 ,  H04B10/504

Abstract: A shutdown circuit may include a filter, for receiving a laser trigger signal for a laser emitter, that is configured to output a filtered signal. The shutdown circuit may include a logic gate configured to receive the filtered signal and at least one of a first signal based on a signal from a photodiode or a second signal based on a signal from a conductive path. The shutdown circuit may include a flip-flop configured to receive an output of the logic gate and to output an enablement signal that is based on the output of the logic gate, and a driver circuit for a switch configured to control current flow to the laser emitter. The driver circuit may be configured to receive the enablement signal and the laser trigger signal and to output the laser trigger signal based on whether the enablement signal is a first or a second voltage.

公开(公告)号：US20230361096A1

公开(公告)日：2023-11-09

申请号：US18068252

申请日：2022-12-19

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Kevin WANG ,  Michael MILLER ,  Steve CHUENG ,  Mikhail DOLGANOV ,  Lijun ZHU

IPC: H01L25/16 ,  H01S5/183 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02315 ,  H01S5/0239 ,  H01S5/026

CPC classification number: H01L25/167 ,  H01L25/165 ,  H01S5/18388 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02315 ,  H01S5/0239 ,  H01S5/0261 ,  H01S5/02257

Abstract: An optical package may include a fan-out-wafer-level-packaging (FOWLP) sub-package including a redistribution layer (RDL) on a molded component including an electrical chip. The optical package may include an optical chip over the FOWLP sub-package. The optical chip may be electrically connected to the RDL. An area of a surface of the RDL may be larger than an area of a surface of the optical chip. The optical package may include a package housing over the optical chip such that light to be received or transmitted by the optical chip may is to pass through the package housing.

公开(公告)号：US20230352384A1

公开(公告)日：2023-11-02

申请号：US18188622

申请日：2023-03-23

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Mikhail DOLGANOV ,  Steve CHEUNG ,  Lijun ZHU

IPC: H01L23/498 ,  H05K3/46 ,  H05K1/11 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01L23/49822 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09563

Abstract: In some implementations, a substrate comprises a ceramic core, multiple metal-filled vias through the ceramic core, and a first metal layer, on a top side of the ceramic core, including metal traces, over respective metal-filled vias. The substrate comprises a second metal layer, including a first electrical contact over a first metal trace, a second electrical contact over a second metal trace, and a third electrical contact over a third metal trace, where the second metal trace is electrically isolated from the first and third metal traces. The substrate comprises a thin dielectric layer separating the first metal layer and the second metal layer. The dielectric layer between the first metal layer and the second layer provides the substrate with a low parasitic inductance and a low thermal resistance based on a thickness of the dielectric layer and/or a material used for the dielectric layer.

公开(公告)号：US20230115690A1

公开(公告)日：2023-04-13

申请号：US17644679

申请日：2021-12-16

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Kevin WANG ,  Hao HUANG ,  John Michael MILLER ,  Siu Kwan CHEUNG ,  Lijun ZHU

IPC: H01S5/42 ,  H01S5/042 ,  H01S5/183 ,  H01S5/026

Abstract: An optical assembly includes an integrated circuit (IC) driver chip; an optical subassembly disposed on the IC driver chip that includes: a vertical cavity surface emitting laser (VCSEL) device, an optical element disposed above a top surface of the VCSEL device, and two or more attachment structures disposed between the VCSEL device and the optical element; and two or more additional attachment structures disposed between the IC driver chip and the optical subassembly. The VCSEL device includes: a cathode contact disposed on the top surface of the VCSEL device, and an anode contact disposed on the top surface of the VCSEL device. The optical element includes two or more conductive traces on a bottom surface of the optical element. The two or more attachment structures are disposed between the two or more conductive traces of the optical element, and the cathode contact and the anode contact of the VCSEL device.

公开(公告)号：US20220209500A1

公开(公告)日：2022-06-30

申请号：US17305140

申请日：2021-06-30

Applicant: Lumentum Operations LLC

Inventor： Siu Kwan CHEUNG ,  Matthew Glenn PETERS ,  Mohammad Ali SHIRAZI HOSSEINI DOKHT ,  Hao HUANG ,  Lijun ZHU

IPC: H01S5/042 ,  H01S5/42

Abstract: An optical chip may include a vertical-cavity surface-emitting laser (VCSEL) structure. The optical chip may include a capacitor over at least a portion of an active layer of the VCSEL structure that is outside of an active region of the VCSEL structure. The capacitor may include a first metal layer over the portion of the active layer, a dielectric layer on the first metal layer, and a second metal layer on the dielectric layer. The optical chip may include an isolation region between a substrate of the VCSEL and a portion of the capacitor outside of the VCSEL.

公开(公告)号：US20220066036A1

公开(公告)日：2022-03-03

申请号：US17109943

申请日：2020-12-02

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Huanlin ZHU ,  Lijun ZHU ,  Raman SRINIVASAN ,  Ed Murphy

IPC: G01S17/89 ,  H01S5/183 ,  H05K9/00 ,  G01S7/4865 ,  G03B17/02

Abstract: In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.