公开(公告)号：US20220344909A1

公开(公告)日：2022-10-27

申请号：US17538592

申请日：2021-11-30

Applicant: Lumentum Operations LLC

Inventor： Yeyu ZHU ,  Eric R. HEGBLOM ,  Yuefa LI

IPC: H01S5/42 ,  H01S5/042 ,  H01S5/183

Abstract: In some implementations, a vertical cavity surface emitting laser (VCSEL) array may include a substrate. In some implementations, the VCSEL array may include a set of cathodes disposed on the substrate in a first direction, wherein a cathode, of the set of cathodes, is defined by a serpentine shape. In some implementations, the VCSEL array may include a set of anodes disposed on the substrate in a second direction, wherein an anode, of the set of anodes, is defined by the serpentine shape.

公开(公告)号：US20240195152A1

公开(公告)日：2024-06-13

申请号：US18194143

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip, and a conductive pillar, of the plurality of conductive pillars, may have a solder cap at an end of the conductive pillar. The emitter assembly may include a pin extending into the solder cap.

公开(公告)号：US20240195153A1

公开(公告)日：2024-06-13

申请号：US18194156

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/024 ,  H01S5/183

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02469 ,  H01S5/18305

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs in a bottom-emitting configuration, and multiple VCSELs, of the plurality of VCSELs, may be grouped in a cluster. The emitter assembly may include a carrier, and the VCSEL chip may be in a flip chip configuration with the carrier. The emitter assembly may include a conductive pillar electrically connected to the multiple VCSELs grouped in the cluster.

公开(公告)号：US20250149852A1

公开(公告)日：2025-05-08

申请号：US18398522

申请日：2023-12-28

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Yuefa LI ,  Kevin WANG ,  Siu Kwan CHEUNG ,  Lijun ZHU ,  Yeyu ZHU

IPC: H01S5/0239 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/042 ,  H01S5/183 ,  H01S5/42

Abstract: A package assembly includes a circuit substrate, a top-emitting (TE) vertical cavity surface emitting laser (VCSEL) die having a two-dimensional (2D) matrix addressable emitter array, and a driver integrated circuit (IC) having a flip-chip interconnect configuration. The TE-VCSEL die and the driver IC are coupled together to form a die stack that is mounted to the circuit substrate, with the TE-VCSEL die arranged between the driver IC and the circuit substrate. TE-VCSEL die comprises an optical output arranged at a main surface coupled to the driver IC. The optical output is configured to output light generated by one or more emitters of the emitter array. Thus, the TE-VCSEL die is configured to emit light away from the circuit substrate.

公开(公告)号：US20250125586A1

公开(公告)日：2025-04-17

申请号：US18536467

申请日：2023-12-12

Applicant: Lumentum Operations LLC

Inventor： Jun YANG ,  Guowei ZHAO ,  Eric R. HEGBLOM ,  Yeyu ZHU ,  Yuefa LI ,  Matthew Glenn PETERS

IPC: H01S5/183 ,  H01S5/30 ,  H01S5/42

Abstract: An emitter includes a substrate; a current-blocking distributed Bragg reflector (DBR) arranged on the substrate, wherein the current-blocking DBR includes a plurality of p-n junctions connected vertically in series to form a bidirectional current-blocking structure; a bottom contact layer arranged on the current-blocking DBR; a bottom DBR arranged on the bottom contact layer; a top DBR arranged on the bottom DBR; an active region configured to generate a laser light, wherein the active region is arranged between the bottom DBR and the top DBR; a top contact layer arranged on the top DBR; and an optical output arranged over the top DBR, wherein the emitter is configured to emit the laser light via the optical output.

公开(公告)号：US20240195151A1

公开(公告)日：2024-06-13

申请号：US18194133

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.

公开(公告)号：US20240195145A1

公开(公告)日：2024-06-13

申请号：US18194123

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Eric R. HEGBLOM ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/183 ,  H01S5/42

CPC classification number: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/18305 ,  H01S5/423

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs respectively associated with a plurality of first electrical contacts. A first spacing of the plurality of first electrical contacts may define a first pitch. The emitter assembly may include a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts. The emitter assembly may include a carrier having a plurality of second electrical contacts. A second spacing of the plurality of second electrical contacts may define a second pitch greater than the first pitch. The emitter assembly may include a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer. The plurality of conductive pillars may be arranged according to the second spacing.