公开(公告)号：US20230361096A1

公开(公告)日：2023-11-09

申请号：US18068252

申请日：2022-12-19

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Kevin WANG ,  Michael MILLER ,  Steve CHUENG ,  Mikhail DOLGANOV ,  Lijun ZHU

IPC: H01L25/16 ,  H01S5/183 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02315 ,  H01S5/0239 ,  H01S5/026

CPC classification number: H01L25/167 ,  H01L25/165 ,  H01S5/18388 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02315 ,  H01S5/0239 ,  H01S5/0261 ,  H01S5/02257

Abstract: An optical package may include a fan-out-wafer-level-packaging (FOWLP) sub-package including a redistribution layer (RDL) on a molded component including an electrical chip. The optical package may include an optical chip over the FOWLP sub-package. The optical chip may be electrically connected to the RDL. An area of a surface of the RDL may be larger than an area of a surface of the optical chip. The optical package may include a package housing over the optical chip such that light to be received or transmitted by the optical chip may is to pass through the package housing.