-
公开(公告)号：US11901618B2
公开(公告)日：2024-02-13
申请号：US17929907
申请日：2022-09-06
申请人： InnoLux Corporation
发明人： Chia-Ping Tseng , Ker-Yih Kao , Chia-Chi Ho , Ming-Yen Weng , Hung-I Tseng , Shu-Ling Wu , Huei-Ying Chen
IPC分类号： H01Q1/38 , H01Q3/44 , H01Q9/04 , H01L27/12 , H01L21/04 , H01Q3/34 , G02F1/1343 , G02F1/1333
CPC分类号： H01Q1/38 , G02F1/13439 , H01L21/045 , H01L27/1237 , H01Q3/34 , H01Q3/44 , H01Q9/0407 , G02F1/133345 , G02F2201/07
摘要： An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.
-
公开(公告)号：US11688934B2
公开(公告)日：2023-06-27
申请号：US17462461
申请日：2021-08-31
申请人： InnoLux Corporation
发明人： Yi-Hung Lin , Tang-Chin Hung , Chia-Chi Ho , I-Yin Li
CPC分类号： H01Q1/36 , H01Q9/0407 , G09G2300/0876 , H01Q3/44
摘要： An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.
-
公开(公告)号：US20230187594A1
公开(公告)日：2023-06-15
申请号：US17991779
申请日：2022-11-21
申请人： Innolux Corporation
发明人： Chia-Ping Tseng , Chia-Chi Ho
摘要： The disclosure provides an electronic device including a substrate, at least one conductive composite structure, and an electronic element. The at least one conductive composite structure is disposed on the substrate. The at least one conductive composite structure includes a first metal layer, a second metal layer, and a third metal layer. The second metal layer is located between the first metal layer and the third metal layer, and the thickness of the second metal layer ranges from 0.5 μm to 12 μm. The electronic element is disposed on the at least one conductive composite structure and bonded to the at least one conductive composite structure.
-
公开(公告)号：US20230170603A1
公开(公告)日：2023-06-01
申请号：US17975566
申请日：2022-10-27
申请人： Innolux Corporation
发明人： Chung-Chun Cheng , Chia-Chi Ho , Chia-Ping Tseng , Yan-Zheng Wu , Yao-Wen Hsu
CPC分类号： H01Q1/2283 , H01Q1/38
摘要： An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.
-
公开(公告)号：US20230084360A1
公开(公告)日：2023-03-16
申请号：US17889361
申请日：2022-08-16
申请人： Innolux Corporation
发明人： Jen-Hai Chi , Chia-Chi Ho
摘要： An electronic device includes a substrate, a bump, a chip, and an adhesive layer. The substrate includes a first connection pad. The bump is disposed on the first connection pad. The chip includes a second connection pad. The bump is disposed between the first connection pad and the second connection pad. The adhesive layer is disposed between the substrate and the chip. A dissipation factor of the adhesive layer is less than or equal to 0.01 at a frequency of 10 GHz. A manufacturing method of an electronic device includes the following: providing a substrate, where the substrate includes a first connection pad; applying an adhesive layer on the substrate; patterning the adhesive layer, such that the adhesive layer produces an opening exposing the first connection pad; forming a bump on the first connection pad; and bonding the chip onto the bump through the second connection pad.
-
公开(公告)号：US20210119333A1
公开(公告)日：2021-04-22
申请号：US17035725
申请日：2020-09-29
申请人： Innolux Corporation
发明人： Hsiuyi Tsai , Yi Hung Lin , Chia-Chi Ho , Yan-Zheng Wu
摘要： An electromagnetic wave adjusting device includes a first substrate, a first conductive element, a first insulation layer, a second substrate, a second conductive element, a dielectric layer, and a conductive layer. The first conductive element is disposed on the first substrate. The first insulation layer is disposed on the first conductive element. The second conductive element is disposed on the second substrate. The dielectric layer is disposed between the first substrate and the second substrate. The first conductive layer is disposed on the first insulation layer and electrically connected to the first conductive element. The electromagnetic wave adjusting device includes an overlap area and a capacitance adjustable area. An overlap portion of the first conductive element and the second conductive element constitutes the overlap area, the capacitance adjustable area includes the overlap area, and at least part of the first conductive layer is disposed in the capacitance adjustable area.
-
公开(公告)号：US10651549B2
公开(公告)日：2020-05-12
申请号：US16026171
申请日：2018-07-03
申请人： InnoLux Corporation
发明人： I-Yin Li , Chin-Lung Ting , Chia-Chi Ho , Yi-Hung Lin
摘要： A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 μm, and less than the thickness of the sealing element.
-
公开(公告)号：US10249949B2
公开(公告)日：2019-04-02
申请号：US15869786
申请日：2018-01-12
申请人： InnoLux Corporation
发明人： I-Yin Li , Chia-Chi Ho , Chin-Lung Ting , Yan-Zheng Wu
摘要： A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.
-
公开(公告)号：US12095152B2
公开(公告)日：2024-09-17
申请号：US18315662
申请日：2023-05-11
申请人： InnoLux Corporation
发明人： Yi-Hung Lin , Tang-Chin Hung , Chia-Chi Ho , I-Yin Li
CPC分类号： H01Q1/36 , H01Q9/0407 , G09G2300/0876 , H01Q3/44
摘要： An electronic device is provided. The electronic device includes a substrate, a conductive layer, an insulating layer, and a modulating material. The conductive layer is disposed on the substrate and has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. The modulating material is disposed on the insulating layer.
-
公开(公告)号：US11817388B2
公开(公告)日：2023-11-14
申请号：US17851046
申请日：2022-06-28
申请人： Innolux Corporation
发明人： Tang Chin Hung , Chin-Lung Ting , Chung-Kuang Wei , Ker-Yih Kao , Tong-Jung Wang , Chih-Yung Hsieh , Hao Jung Huang , I-Yin Li , Chia-Chi Ho , Yi Hung Lin , Cheng-Hsu Chou , Chia-Ping Tseng
IPC分类号： H01L23/528 , H01L27/06 , H01L23/522 , H01L21/8234 , H01L29/93 , H01L23/538 , H01L21/60
CPC分类号： H01L23/5283 , H01L21/823475 , H01L23/5223 , H01L23/5226 , H01L27/0629 , H01L29/93 , H01L23/5385 , H01L27/0694 , H01L2021/6006
摘要： The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.
-
-
-
-
-
-
-
-
-
搜索结果
38 条记录 (耗时 0.019 秒)
