公开(公告)号：US12119541B2

公开(公告)日：2024-10-15

申请号：US17848508

申请日：2022-06-24

申请人： InnoLux Corporation

发明人： I-Yin Li ,  Tang-Chin Hung

IPC分类号： H01Q1/22 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66

CPC分类号： H01Q1/2283 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677

摘要： An antenna device is provided. The antenna device includes a first substrate and a second substrate facing the first substrate. The first substrate includes an inner surface and an outer surface opposite the inner surface of the first substrate. The second substrate includes an inner surface and an outer surface opposite the inner surface of the second substrate. The antenna device also includes a die disposed between the first substrate and the second substrate, a redistribution layer disposed between the die and the inner surface of the second substrate, and an antenna unit electrically connected to the die via the redistribution layer. The antenna unit is arranged on at least one of the inner surface of the first substrate, the outer surface of the first substrate, the inner surface of the second substrate, and the outer surface of the second substrate.

公开(公告)号：US20240312983A1

公开(公告)日：2024-09-19

申请号：US18671908

申请日：2024-05-22

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC分类号： H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

摘要： The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, a PN junction assembly, and a transistor circuit. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer is formed above the second surface. The second metal layer is formed on the second surface. The PN junction assembly is disposed on the first surface and electrically connected with the first metal layer and the second metal layer. The PN junction assembly includes a variable capacitor. The transistor circuit is electrically connecting with the second metal layer.

公开(公告)号：US11688934B2

公开(公告)日：2023-06-27

申请号：US17462461

申请日：2021-08-31

申请人： InnoLux Corporation

发明人： Yi-Hung Lin ,  Tang-Chin Hung ,  Chia-Chi Ho ,  I-Yin Li

IPC分类号： H01Q1/38 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q3/44

CPC分类号： H01Q1/36 ,  H01Q9/0407 ,  G09G2300/0876 ,  H01Q3/44

摘要： An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US10651549B2

公开(公告)日：2020-05-12

申请号：US16026171

申请日：2018-07-03

申请人： InnoLux Corporation

发明人： I-Yin Li ,  Chin-Lung Ting ,  Chia-Chi Ho ,  Yi-Hung Lin

IPC分类号： H01Q1/40 ,  H01Q3/44 ,  H01Q1/36

摘要： A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 μm, and less than the thickness of the sealing element.

公开(公告)号：US10249949B2

公开(公告)日：2019-04-02

申请号：US15869786

申请日：2018-01-12

申请人： InnoLux Corporation

发明人： I-Yin Li ,  Chia-Chi Ho ,  Chin-Lung Ting ,  Yan-Zheng Wu

IPC分类号： H04B1/04 ,  H01Q3/44 ,  H01Q9/16 ,  H01Q7/00 ,  H01Q9/27 ,  H04B1/034 ,  H04B13/00 ,  H04B7/0404

摘要： A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.

公开(公告)号：US12015027B2

公开(公告)日：2024-06-18

申请号：US17851047

申请日：2022-06-28

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L29/93 ,  H01L23/538

CPC分类号： H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

摘要： The disclosure provides an electromagnetic wave adjustment apparatus includes a control circuit, a transistor circuit die and an electronic assembly. The transistor circuit die receives a control signal from the control circuit and drives the electronic assembly.

公开(公告)号：US20220181257A1

公开(公告)日：2022-06-09

申请号：US17678040

申请日：2022-02-23

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

摘要： The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US20210050657A1

公开(公告)日：2021-02-18

申请号：US16932862

申请日：2020-07-20

申请人： Innolux Corporation

发明人： Yi Hung Lin ,  Chung-Kuang Wei ,  Tang Chin Hung ,  I-Yin Li ,  Chia-Chi Ho

IPC分类号： H01Q1/38 ,  H01Q1/40

摘要： An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.

公开(公告)号：US10709012B2

公开(公告)日：2020-07-07

申请号：US15858004

申请日：2017-12-29

申请人： Innolux Corporation

发明人： Yan-Syun Wang ,  Chi-Che Tsai ,  Wei-Yen Wu ,  I-Yin Li

IPC分类号： H05K1/02 ,  H05K3/10 ,  H01P3/08 ,  H05K3/22

摘要： A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

公开(公告)号：US10707152B2

公开(公告)日：2020-07-07

申请号：US15844907

申请日：2017-12-18

申请人： InnoLux Corporation

发明人： Ming-Yen Weng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Tsutomu Shinozaki ,  Cheng-Chi Wang ,  I-Yin Li

IPC分类号： H01L23/66 ,  H01L21/48 ,  H01L23/485 ,  H01L21/311 ,  H01L25/065 ,  H01Q1/38

摘要： A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 μm to 10 μm. A high-frequency device is also provided.