公开(公告)号：US08912094B2

公开(公告)日：2014-12-16

申请号：US13846437

申请日：2013-03-18

Applicant: Electronics and Telecommunications Research Institute

Inventor： Jae Bon Koo ,  Chan Woo Park ,  Soon-Won Jung ,  Sang Chul Lim ,  Ji-Young Oh ,  Bock Soon Na ,  Hye Yong Chu

IPC: H01L21/44 ,  H01L21/768

CPC classification number: H01L29/78603 ,  H01L27/1218 ,  H01L27/1262

Abstract: Provided is a method for manufacturing a stretchable thin film transistor. The method for manufacturing a stretchable thin film transistor includes forming a mold substrate, forming a stretchable insulator on the mold substrate, forming a flat substrate on the stretchable insulator, removing the mold substrate, forming discontinuous and corrugated wires on the stretchable insulator, forming a thin film transistor connected between the wires, and removing the flat substrate.

Abstract translation: 提供一种制造可拉伸薄膜晶体管的方法。 制造可伸缩薄膜晶体管的方法包括：在模具基板上形成模具基板，形成可拉伸绝缘体，在可伸缩绝缘体上形成平坦的基板，去除模具基板，在可拉伸的绝缘体上形成不连续的和波纹的导线， 连接在电线之间的薄膜晶体管，以及去除平坦的基板。

公开(公告)号：US12211630B2

公开(公告)日：2025-01-28

申请号：US17889204

申请日：2022-08-16

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Ji Hun Choi ,  Chan Woo Park ,  Ji-Young Oh ,  Seung Youl Kang ,  Yong Hae Kim ,  Hee-ok Kim ,  Jeho Na ,  Jaehyun Moon ,  Jong-Heon Yang ,  Himchan Oh ,  Seong-Mok Cho ,  Sung Haeng Cho ,  Jae-Eun Pi ,  Chi-Sun Hwang

IPC: H01B3/30 ,  H01B7/06 ,  H01B13/008 ,  H05K7/06 ,  H01B3/46

Abstract: Provided are stretchable electronics and a method for manufacturing the same. The stretchable electronics may include a substrate, a plurality of electronic elements disposed to be spaced apart from each other on the substrate, and a wire structure disposed on the substrate to connect the plurality of electronic elements to each other. The wire structure may include an insulator extending from one of the electronic elements to the other of the adjacent electronic elements and a metal wire configured to cover a top surface and side surfaces of the insulator. The insulator may include at least one bent part in a plan view.

公开(公告)号：US12201026B2

公开(公告)日：2025-01-14

申请号：US17493120

申请日：2021-10-04

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kang-Ho Park ,  Jong Tae Lim ,  Seung Youl Kang ,  Bock Soon Na ,  Chan Woo Park ,  Wooseup Youm ,  Ji-Young Oh

IPC: H10N30/20 ,  H10N30/00 ,  H02N2/00

Abstract: Provided is a low frequency vibrating actuator device including an actuator configured to generate a vibration by receiving a voltage, a spring structure disposed on the actuator, and a vibrating mass part disposed on the spring structure. Here, the spring structure includes a first thin-film, a first spacer disposed between the first thin-film and the actuator, and a second spacer disposed between the first thin-film and the vibrating mass part. Also, the first spacer and the second spacer are horizontally offset from each other.

公开(公告)号：US20210126182A1

公开(公告)日：2021-04-29

申请号：US17023730

申请日：2020-09-17

Applicant: Electronics And Telecommunications Research Institute

Inventor： Kang-Ho Park ,  Seongdeok Ahn ,  Jong Tae Lim ,  Chan Woo Park ,  Ji-Young Oh

IPC: H01L41/047 ,  H01L41/053 ,  H01L41/083

Abstract: Provided is a low frequency vibrating actuator device. The low frequency vibrating actuator device includes a substrate including a pair of connection electrodes, an actuator provided on the pair of connection electrodes to generate vibration, a support provided on the actuator, a vibration membrane provided on the support to vibrate according to the actuator, and a vibrating mass provided on the vibration membrane to vibrate according to the vibration membrane. The actuator includes a plurality of laminated insulating layers and internal electrodes that are alternately laminated between the insulating layers adjacent to each other, and a top surface of the support, which contacts the vibration membrane, has an area that is equal to or less than that of a bottom surface of the support, which contacts the actuator.

公开(公告)号：US09952460B2

公开(公告)日：2018-04-24

申请号：US15010968

申请日：2016-01-29

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Jong-Heon Yang ,  Jae Bon Koo ,  Byoung-Hwa Kwon ,  Gi Heon Kim ,  Yong Hae Kim ,  Hojun Ryu ,  Chan Woo Park ,  Chunwon Byun ,  Hyunkoo Lee ,  Jong Tae Lim ,  Kyoung Ik Cho ,  Seong-Mok Cho ,  Hye Yong Chu ,  Chi-Sun Hwang

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133616 ,  G02F2201/44

Abstract: Provided is a display device. The display device includes a lower display element where a substrate, a first lower electrode, a liquid crystal part, and a second lower electrode are sequentially stacked, an upper display element stacked vertical to the lower display element, where a first upper electrode, a light emitting part, a second upper electrode, and a protective part are sequentially stacked, and a middle part configured to deliver a driving signal to the lower and upper display elements, between the lower and upper display elements.

公开(公告)号：US09177821B2

公开(公告)日：2015-11-03

申请号：US14259042

申请日：2014-04-22

Applicant: Electronics and Telecommunications Research Institute

Inventor： Soon-Won Jung ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Chul Lim ,  Sang Seok Lee ,  Kyoung Ik Cho ,  Hye Yong Chu

IPC: H01L21/338 ,  H01L21/311 ,  H01L29/66

CPC classification number: H01L21/311 ,  G09F9/301 ,  H01L29/66477 ,  H01L51/0023 ,  H01L51/0055 ,  H01L51/0525 ,  H01L51/102 ,  H05K1/0283 ,  H05K1/0333 ,  H05K1/16 ,  H05K3/0017 ,  H05K3/007 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/308

Abstract: Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.

Abstract translation: 提供一种制造电子电路的方法。 该方法包括制备基底，在基底上形成聚合物膜，图案化聚合物膜以形成聚合物图案，并在聚合物图案上形成电子器件。