公开(公告)号：US5703740A

公开(公告)日：1997-12-30

申请号：US727694

申请日：1996-10-07

Applicant: Uri Cohen ,  Dennis R. Hollars

Inventor： Uri Cohen ,  Dennis R. Hollars

IPC: G11B5/17 ,  G11B5/31 ,  G11B5/39 ,  G11B5/147

CPC classification number: G11B5/3123 ,  G11B5/3113 ,  G11B5/313 ,  G11B5/3163 ,  G11B5/3183 ,  G11B5/3967 ,  G11B5/17

Abstract: A low-noise toroidal thin film head ("TFH") device has low coil resistance and inductance, especially suitable for very high magnetic recording areal densities and channel frequencies. The length of a toroidal coil turn is only about 20-30% that of the length of an average turn in the conventional planar spiral coil design. This allows either reduction of the device thermal noise (by about 6 dB) and/or increase of the device operational frequency bandwidth (by a factor of 3-5). The toroidal coil coupling efficiency between each turn and the magnetic core is practically 100%, thereby improving the write and read-back efficiencies. In one embodiment a non-via large back-closure contact area is provided between the bottom and top magnetic poles along their entire back-side width, and all other open branches and loose ends in the magnetic circuit are eliminated. The magnetic core has a gradual, smooth toroidal (or a horse-shoe) shape with no loose ends, nooks, crevices, or sharp corners. The larger back-closure contact area decreases the magnetic core reluctance and improves the device efficiency. Utilization of a soft non-magnetic seed-layer, such as gold, eliminates interference noise due to the conventional magnetic (NiFe) seed-layer. Slight mechanical texturing (scratching) of the seed-layer along the intended easy axis helps to define and induce strong magnetic uniaxial anisotropy in the plated magnetic poles. All these features facilitate significant reduction of Barkhausen and other sources of device noise. Embodiments include conventional TFH's, Planar TFH's, Pinched-Gap TFH's, and various versions of Magnetoresistive (MR) TFH's.

Abstract translation: 低噪声环形薄膜头（“TFH”）器件具有低线圈电阻和电感，特别适用于非常高的磁记录面积密度和通道频率。 环形线圈匝的长度在常规平面螺旋线圈设计中仅为平均匝长的20-30％。 这允许减少器件热噪声（约6dB）和/或器件工作频率带宽的增加（3-5倍）。 每转和磁芯之间的环形线圈耦合效率实际上为100％，从而提高写入和读回效率。 在一个实施例中，沿着它们的整个背面宽度在底部和顶部磁极之间提供非通孔大的后盖接触区域，并且消除了磁路中的所有其它开口分支和松散端。 磁芯具有逐渐平滑的环形（或马蹄）形状，没有松动的末端，角落，缝隙或尖角。 较大的后盖接触面积减小磁芯磁阻，提高器件效率。 使用诸如金的软非磁性种子层消除了由于常规的磁性（NiFe）种子层引起的干扰噪声。 沿着预期的容易轴的种子层的轻微的机械纹理（刮擦）有助于在电镀磁极中限定和诱导强的单轴各向异性。 所有这些功能都可以显着降低Barkhausen和其他设备噪音来源。 实施例包括传统的TFH，平面TFH，Pinched-Gap TFH以及各种版本的磁阻（MR）TFH。

公开(公告)号：US20110300661A1

公开(公告)日：2011-12-08

申请号：US12793617

申请日：2010-06-03

Applicant: David B. Pearce ,  Bruce D. Hachtmann ,  Liguang Gong ,  Thomas M. Valeri ,  Dennis R. Hollars

Inventor： David B. Pearce ,  Bruce D. Hachtmann ,  Liguang Gong ,  Thomas M. Valeri ,  Dennis R. Hollars

IPC: H01L31/18 ,  H01B5/00

CPC classification number: H01L31/188 ,  H01L31/022433 ,  H01L31/0465 ,  H01L31/048 ,  H01L31/0508 ,  Y02E10/50

Abstract: An improved method for interconnecting thin film solar cells to form solar cell modules is provided, the method comprising using a flat metallic mesh formed from a thin metallic strip to provide a current collection grid over a thin film solar cell. The method is particularly useful for forming interconnections between thin film solar cells deposited on flexible substrates. The rectangular cross sectional shape of the mesh elements provides an increased area of electrical contact to the solar cell compared to the small tangential area provided by elements of circular cross section. Mesh elements can be made higher rather than wider to improve conductivity without proportionally increasing shading loss. Various coatings can be applied to the mesh to improve its performance, provide corrosion resistance, and improve its cosmetic appearance.

Abstract translation: 提供了一种用于互连薄膜太阳能电池以形成太阳能电池模块的改进方法，该方法包括使用由薄金属带形成的扁平金属网，以在薄膜太阳能电池上提供集电栅格。 该方法对于在沉积在柔性基板上的薄膜太阳能电池之间形成互连特别有用。 与由圆形横截面的元件提供的小切向区域相比，网状元件的矩形截面形状提供了与太阳能电池的电接触面积的增加的面积。 网格元素可以更高而不是更宽以提高导电性，而不会成比例地增加阴影损失。 可以将各种涂层施加到网上以改善其性能，提供耐腐蚀性并改善其美观外观。

公开(公告)号：US20110259418A1

公开(公告)日：2011-10-27

申请号：US13173507

申请日：2011-06-30

Applicant: Dennis R. Hollars

Inventor： Dennis R. Hollars

IPC: H01L31/0224 ,  H01L31/18 ,  H01L31/0264

CPC classification number: H01L31/18 ,  C23C14/0057 ,  C23C14/3414 ,  C23C14/352 ,  C23C14/562 ,  H01L31/022425 ,  H01L31/0322 ,  H01L31/0336 ,  Y02E10/541 ,  Y02P70/521

Abstract: A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (Cu(InXGa1-X)Se2) absorber layer (X ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology. The band gap of the absorber layer can be graded by varying the gallium content, and by replacing the gallium partially or totally with aluminum. Alternately the absorber layer is reactively sputtered from metal alloy targets in the presence of hydrogen selenide gas. RF sputtering is used to deposit a non-cadmium containing window layer of ZnS. The top transparent electrode is reactively sputtered aluminum doped ZnO. A unique modular vacuum roll-to-roll sputtering machine is described. The machine is adapted to incorporate dual cylindrical rotary magnetron technology to manufacture the improved solar cell material in a single pass.

Abstract translation: 完全通过溅射制造改进的薄膜太阳能电池的方法包括含有由过渡金属氮化物组成的至少一个阻挡层的高效率背接触/反射多层。 使用双圆柱形旋转磁控管技术，由专门制备的导电靶共溅射铜铟镓二硒化物（Cu（In x Ga 1-x）Se 2）吸收层（X为1至约0.7）。 吸收层的带隙可以通过改变镓含量来分级，并且通过用铝部分或全部替换镓来分级。 或者，在硒化氢气体存在下，吸收层从金属合金靶反应溅射。 使用RF溅射沉积含有ZnS的不含镉的窗口层。 顶部透明电极是反应溅射的铝掺杂的ZnO。 描述了一种独特的模块化真空辊对辊溅射机。 该机器适用于采用双圆柱形旋转磁控管技术，以单程制造改进的太阳能电池材料。

公开(公告)号：US20100276282A1

公开(公告)日：2010-11-04

申请号：US12835562

申请日：2010-07-13

Applicant: Dennis R. Hollars

Inventor： Dennis R. Hollars

IPC: C23C14/34

CPC classification number: H01L31/18 ,  C23C14/0057 ,  C23C14/3414 ,  C23C14/352 ,  C23C14/562 ,  H01L31/022425 ,  H01L31/0322 ,  H01L31/0336 ,  Y02E10/541 ,  Y02P70/521

Abstract: A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (Cu(InXGa1-X)Se2) absorber layer (X ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology. The band gap of the absorber layer can be graded by varying the gallium content, and by replacing the gallium partially or totally with aluminum. Alternately the absorber layer is reactively sputtered from metal alloy targets in the presence of hydrogen selenide gas. RF sputtering is used to deposit a non-cadmium containing window layer of ZnS. The top transparent electrode is reactively sputtered aluminum doped ZnO. A unique modular vacuum roll-to-roll sputtering machine is described. The machine is adapted to incorporate dual cylindrical rotary magnetron technology to manufacture the improved solar cell material in a single pass.

Abstract translation: 完全通过溅射制造改进的薄膜太阳能电池的方法包括含有由过渡金属氮化物组成的至少一个阻挡层的高效率背接触/反射多层。 使用双圆柱形旋转磁控管技术，由专门制备的导电靶共溅射铜铟镓二硒化物（Cu（In x Ga 1-x）Se 2）吸收层（X为1至约0.7）。 吸收层的带隙可以通过改变镓含量来分级，并且通过用铝部分或全部替换镓来分级。 或者，在硒化氢气体存在下，吸收层从金属合金靶反应溅射。 使用RF溅射沉积含有ZnS的不含镉的窗口层。 顶部透明电极是反应溅射的铝掺杂的ZnO。 描述了一种独特的模块化真空辊对辊溅射机。 该机器适用于采用双圆柱形旋转磁控管技术，以单程制造改进的太阳能电池材料。

公开(公告)号：US06488824B1

公开(公告)日：2002-12-03

申请号：US09616489

申请日：2000-07-14

Applicant: Dennis R. Hollars ,  Martin P. Rosenblum ,  Carl T. Petersen

Inventor： Dennis R. Hollars ,  Martin P. Rosenblum ,  Carl T. Petersen

IPC: C23C1435

CPC classification number: C23C14/35 ,  C23C14/352 ,  C23C14/568 ,  H01J37/3405

Abstract: A sputtering apparatus and method for high rate deposition of electrically insulating and semiconducting coatings with substantially uniform stoichiometry. At least one set of vertically mounted, dual and triple rotatable cylindrical (or planar) magnetrons with associated vacuum pumps, form semi-isolated sputtering modules. The sputtering modules can be independently controlled for the sequential deposition of layers of similar or different materials. Constant voltage operation of AC power with an optional reactive gas flow feedback loop maintains constant coating stoichiometry during small changes in pumping speed caused by substrate motion. The coating method is extremely stable over long periods (days) of operation, with the film stoichiometry being selectable by the voltage control point. The apparatus may take the form of a circular arrangement of modules for batch coating of wafer-like substrates, or the modules may be arranged linearly for the coating of large planar substrates

Abstract translation: 一种溅射装置和方法，用于以基本上均匀化学计量的方式高速沉积电绝缘和半导体涂层。 至少有一组垂直安装的，双重和三重可旋转的圆柱形（或平面）磁控管与相关联的真空泵形成半隔离溅射模块。 可以独立地控制溅射模块以顺序沉积类似或不同材料的层。 使用可选的反应气体流量反馈回路的交流电源的恒定电压工作在基板运动引起的泵送速度的小变化期间保持恒定的涂层化学计量。 涂覆方法在长时间（天）的操作中非常稳定，膜的化学计量可以通过电压控制点来选择。 该装置可以采用圆形布置的模块的形式，用于批量涂覆晶片状衬底，或者模块可以线性布置以用于大平面衬底

公开(公告)号：US5995342A

公开(公告)日：1999-11-30

申请号：US882432

申请日：1997-06-24

Applicant: Uri Cohen ,  Dennis R. Hollars

Inventor： Uri Cohen ,  Dennis R. Hollars

IPC: G11B5/17 ,  G11B5/31 ,  G11B5/39 ,  G11B5/147

CPC classification number: G11B5/3123 ,  G11B5/3113 ,  G11B5/313 ,  G11B5/3163 ,  G11B5/3183 ,  G11B5/3967 ,  G11B5/17

Abstract: A low-noise toroidal thin film head ("TFH") device has low coil resistance and inductance, especially suitable for very high magnetic recording areal densities and channel frequencies. The length of a toroidal coil turn is only about 20-30% that of the length of an average turn in the conventional planar spiral coil design. This allows either reduction of the device thermal noise (by about 6 dB) and/or increase of the device operational frequency bandwidth (by a factor of 3-5). The toroidal coil coupling efficiency between each turn and the magnetic core is practically 100%, thereby improving the write and read-back efficiencies. In one embodiment a non-via large back-closure contact area is provided between the bottom and top magnetic poles along their entire back-side width, and all other open branches and loose ends in the magnetic circuit are eliminated. The magnetic core has a gradual, smooth toroidal (or a horse-shoe) shape with no loose ends, nooks, crevices, or sharp corners. The larger back-closure contact area decreases the magnetic core reluctance and improves the device efficiency. Utilization of a soft non-magnetic seed-layer, such as gold, eliminates interference noise due to the conventional magnetic (NiFe) seed-layer. Slight mechanical texturing (scratching) of the seed-layer along the intended easy axis helps to define and induce strong magnetic uniaxial anisotropy in the plated magnetic poles. All these features facilitate significant reduction of Barkhausen and other sources of device noise. Embodiments include conventional TFH's, Planar TFH's, Pinched-Gap TFH's, and various versions of Magnetoresistive (MR) TFH's.

Abstract translation: 低噪声环形薄膜头（“TFH”）器件具有低线圈电阻和电感，特别适用于非常高的磁记录面积密度和通道频率。 环形线圈匝的长度在常规平面螺旋线圈设计中仅为平均匝长的20-30％。 这允许减少器件热噪声（约6dB）和/或器件工作频率带宽的增加（3-5倍）。 每转和磁芯之间的环形线圈耦合效率实际上为100％，从而提高写入和读回效率。 在一个实施例中，沿着它们的整个背面宽度在底部和顶部磁极之间提供非通孔大的后盖接触区域，并且消除了磁路中的所有其它开口分支和松散端。 磁芯具有逐渐平滑的环形（或马蹄）形状，没有松动的末端，角落，缝隙或尖角。 较大的后盖接触面积减小磁芯磁阻，提高器件效率。 使用诸如金的软非磁性种子层消除了由于常规的磁性（NiFe）种子层引起的干扰噪声。 沿着预期的容易轴的种子层的轻微的机械纹理（刮擦）有助于在电镀磁极中限定和诱导强的单轴各向异性。 所有这些功能都可以显着降低Barkhausen和其他设备噪音来源。 实施例包括传统的TFH，平面TFH，Pinched-Gap TFH以及各种版本的磁阻（MR）TFH。

公开(公告)号：US5830331A

公开(公告)日：1998-11-03

申请号：US311529

申请日：1994-09-23

Applicant: Taesun E. Kim ,  Hyung J. Lee ,  Yao-Tzung R. Shih ,  John C. Bruno ,  Robert B. Zubeck ,  Dennis R. Hollars

Inventor： Taesun E. Kim ,  Hyung J. Lee ,  Yao-Tzung R. Shih ,  John C. Bruno ,  Robert B. Zubeck ,  Dennis R. Hollars

IPC: C23C14/34 ,  C23C14/06 ,  C23C14/35 ,  G11B5/84 ,  H01J37/34

CPC classification number: C23C14/0605 ,  G11B5/84 ,  G11B5/8408 ,  H01J37/3405

Abstract: A hydrogenated carbon film for magnetic thin film recording media is manufactured by alternating current magnetron sputtering in an atmosphere containing argon and a hydrocarbon gas. Targets mounted side-by-side cyclically sputter and discharge charge buildup according to an alternating current. Shielding between the targets directs electrons toward the anode at a given time.

Abstract translation: 用于磁性薄膜记录介质的氢化碳膜通过在含有氩气和烃气体的气氛中的交流磁控溅射来制造。 并排安装的目标根据交流电循环地周期性地溅射和放电电荷。 目标之间的屏蔽在给定的时间将电子引向阳极。

公开(公告)号：US5814196A

公开(公告)日：1998-09-29

申请号：US46215

申请日：1993-04-08

Applicant: Dennis R. Hollars ,  Delbert F. Waltrip ,  Robert B. Zubeck ,  Josef Bonigut ,  Robert M. Smith ,  Gary L. Payne

Inventor： Dennis R. Hollars ,  Delbert F. Waltrip ,  Robert B. Zubeck ,  Josef Bonigut ,  Robert M. Smith ,  Gary L. Payne

IPC: C23C14/02 ,  C23C14/34 ,  C23C14/35 ,  C23C14/50 ,  C23C14/54 ,  C23C14/56 ,  G05B19/05 ,  G05B19/418 ,  G11B5/85 ,  G11B5/851 ,  H01L21/00 ,  H01L21/677 ,  C23C14/00

CPC classification number: H01L21/6776 ,  C23C14/02 ,  C23C14/028 ,  C23C14/34 ,  C23C14/35 ,  C23C14/352 ,  C23C14/50 ,  C23C14/54 ,  C23C14/541 ,  C23C14/568 ,  G05B19/052 ,  G05B19/4189 ,  G11B5/851 ,  H01J37/32733 ,  H01J37/3405 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67207 ,  H01L21/67213 ,  H01L21/67236 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67276 ,  H01L21/67712 ,  H01L21/67721 ,  G05B2219/31225 ,  G05B2219/31237 ,  G05B2219/32413 ,  G05B2219/34029 ,  G05B2219/34279 ,  G05B2219/34287 ,  G05B2219/34304 ,  G05B2219/50363 ,  Y02P90/18 ,  Y02P90/28

Abstract: An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.

Abstract translation: 根据本发明的装置向多个基板的表面提供单层或多层涂层。 该装置可以包括多个缓冲和溅射室，以及输入端和输出端，其中所述基板以不同的速度传送通过所述装置的所述室，使得托盘从所述输入端的速度 对于所述多个托盘中的每一个，所述输出端为常数。 根据本发明的具有多个整体匹配部件的高通量溅射装置还可以包括用于以可变速度输送多个基板通过所述溅射室的装置; 用于将所述溅射室内的环境压力降低至足以实现溅射操作的压力范围内的真空度的装置; 用于将所述多个基板加热到有助于在其上溅射所述涂层的温度的装置，所述用于加热的装置在所述基板的表面上提供基本均匀的温度分布; 以及控制装置，用于向所述溅射室提供控制信号并从其接收反馈输入，用于传送装置，减少装置和加热装置，所述控制装置可编程以允许控制所述溅射装置， 减少和加热手段的手段。

公开(公告)号：US5753092A

公开(公告)日：1998-05-19

申请号：US703011

申请日：1996-08-26

Applicant: Dennis R. Hollars ,  Robert B. Zubeck

Inventor： Dennis R. Hollars ,  Robert B. Zubeck

IPC: C23C14/34 ,  C23C14/50 ,  C23C14/56

CPC classification number: C23C14/56 ,  C23C14/50

Abstract: A sputtering system comprising three concentric cylinders. The inner and outer cylinders, along with top and bottom sealing flanges, form an annular chamber with cylindrical walls. A central cylinder, disposed between the inner and outer cylinders, includes substrate-carrying openings and serves as a cylindrical carriage which substantially fills the annular chamber passageway and is rotatable in predetermined steps relative to the chamber. Substrate processing devices for deposition, etching, heating, and cooling arc attached around the circumference of the inner and/or outer cylinders. Vacuum pumps are located between substrate processing devices. The openings in the cylindrical carriage are each fitted with a substrate holder for supporting a multiplicity of substrates. Entrance and exit vacuum load-locks are provided for transferring substrates into and out of the system. The system is designed for substrate processing temperatures of 1000.degree. C. and above.

Abstract translation: 包括三个同心圆筒的溅射系统。 内筒和外筒以及顶部和底部密封凸缘形成具有圆柱形壁的环形室。 设置在内筒和外筒之间的中心筒包括基板承载开口，并且用作圆柱形托架，其基本上填充环形室通道并且可相对于室以预定步骤旋转。 用于沉积，蚀刻，加热和冷却的衬底处理装置围绕内部和/或外部圆柱体的圆周附着。 真空泵位于基板处理装置之间。 圆柱形托架中的开口各配有用于支撑多个基板的基板支架。 提供入口和出口真空负载锁，用于将基板传入和移出系统。 该系统设计用于1000℃及以上的基板加工温度。

公开(公告)号：US5683561A

公开(公告)日：1997-11-04

申请号：US552250

申请日：1995-11-02

Applicant: Dennis R. Hollars ,  Delbert F. Waltrip ,  Robert B. Zubeck ,  Josef Bonigut ,  Robert M. Smith ,  Gary L. Payne ,  Kenneth Lee ,  David B. Pearce

Inventor： Dennis R. Hollars ,  Delbert F. Waltrip ,  Robert B. Zubeck ,  Josef Bonigut ,  Robert M. Smith ,  Gary L. Payne ,  Kenneth Lee ,  David B. Pearce

IPC: C23C14/02 ,  C23C14/34 ,  C23C14/35 ,  C23C14/50 ,  C23C14/54 ,  C23C14/56 ,  G05B19/05 ,  G05B19/418 ,  G11B5/85 ,  G11B5/851 ,  H01L21/00 ,  H01L21/677

CPC classification number: H01L21/6776 ,  C23C14/02 ,  C23C14/028 ,  C23C14/34 ,  C23C14/35 ,  C23C14/352 ,  C23C14/50 ,  C23C14/54 ,  C23C14/541 ,  C23C14/568 ,  G05B19/052 ,  G05B19/4189 ,  G11B5/851 ,  H01J37/32733 ,  H01J37/3405 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67207 ,  H01L21/67213 ,  H01L21/67236 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67276 ,  H01L21/67712 ,  H01L21/67721 ,  G05B2219/31225 ,  G05B2219/31237 ,  G05B2219/32413 ,  G05B2219/34029 ,  G05B2219/34279 ,  G05B2219/34287 ,  G05B2219/34304 ,  G05B2219/50363 ,  Y02P90/18 ,  Y02P90/28

Abstract: An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.

Abstract translation: 根据本发明的装置向多个基板的表面提供单层或多层涂层。 该装置可以包括多个缓冲和溅射室，以及输入端和输出端，其中所述基板以不同的速度传送通过所述装置的所述室，使得托盘从所述输入端的速度 对于所述多个托盘中的每一个，所述输出端为常数。 根据本发明的具有多个整体匹配部件的高通量溅射装置还可以包括用于以可变速度输送多个基板通过所述溅射室的装置; 用于将所述溅射室内的环境压力降低至足以实现溅射操作的压力范围内的真空度的装置; 用于将所述多个基板加热到有助于在其上溅射所述涂层的温度的装置，所述用于加热的装置在所述基板的表面上提供基本均匀的温度分布; 以及控制装置，用于向所述溅射室提供控制信号并从其接收反馈输入，用于传送装置，减少装置和加热装置，所述控制装置可编程以允许控制所述溅射装置， 减少和加热手段的手段。