公开(公告)号：US11678530B2

公开(公告)日：2023-06-13

申请号：US17359675

申请日：2021-06-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu Liu ,  Qi Yao ,  Detian Meng ,  Feng Zhang ,  Zhao Cui ,  Liwen Dong ,  Xiaoxin Song ,  Dongfei Hou ,  Libo Wang ,  Zhijun Lv

IPC: H01L29/32 ,  H10K59/126 ,  H01L29/786 ,  H10K71/00

CPC classification number: H10K59/126 ,  H01L29/7869 ,  H01L29/78672 ,  H10K71/00

Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a substrate, an active structure layer disposed on the substrate, a first source-drain structure layer disposed on a side of the active structure layer away from the substrate, and a second source-drain structure layer disposed on a side of the first source-drain structure layer away from the substrate. The active structure layer includes a first active layer and a second active layer. The first source-drain structure layer includes a first active via and a first source-drain electrode, and the first source-drain electrode is connected to the first active layer through the first active via; and the second source-drain structure layer includes a second active via and a second source-drain electrode, and the second source-drain electrode is connected to the second active layer through the second active via.

公开(公告)号：US11442583B2

公开(公告)日：2022-09-13

申请号：US16966394

申请日：2020-01-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wenqu Liu ,  Xiufeng Li ,  Qi Yao ,  Feng Zhang ,  Liwen Dong ,  Zhao Cui ,  Chuanxiang Xu ,  Detian Meng ,  Xiaoxin Song ,  Libo Wang ,  Yang Yue ,  Dongfei Hou ,  Zhijun Lv

IPC: G06F3/043 ,  H01L41/04 ,  H01L41/047 ,  H01L41/083 ,  H01L41/113 ,  H01L41/27 ,  G06F3/044 ,  G06F3/041 ,  G06V40/13 ,  G06V40/12

Abstract: A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. In the fingerprint identification module, an auxiliary structure is at least partially located on a functional substrate, and a plurality of first driving electrodes are on a side, away from the functional substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer.

公开(公告)号：US11296165B2

公开(公告)日：2022-04-05

申请号：US16755643

申请日：2019-05-20

Applicant: BOE Technology Group Co., Ltd.

Inventor： Feng Zhang ,  Zhijun Lv ,  Wenqu Liu ,  Liwen Dong ,  Xiaoxin Song ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Chuanxiang Xu

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56

Abstract: An array substrate includes a flexible base substrate; a buffer layer on the flexible base substrate and continuously extending from a display area into a peripheral area, including a first portion substantially extending throughout the display area and a second portion in the peripheral area, the first portion and the second portion being parts of an integral layer, an organic insulating layer substantially extending throughout but limited in the display area and on a side of the buffer layer away from the flexible base substrate; an inorganic insulating layer limited in the peripheral area and on a side of the buffer layer away from the flexible base substrate; a planarization layer on a side of the organic insulating layer away from the buffer layer, and a plurality of light emitting elements on a side of the planarization layer away from the organic insulating layer.

公开(公告)号：US12033994B2

公开(公告)日：2024-07-09

申请号：US17204562

申请日：2021-03-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhijun Lv ,  Feng Zhang ,  Liwen Dong ,  Wenqu Liu ,  Xiaoxin Song ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Dongfei Hou ,  Qi Yao

IPC: H01L25/16 ,  H01L23/00 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L24/32 ,  H01L24/83 ,  H01L24/98 ,  H01L27/1262 ,  H01L33/62 ,  H01L2224/32145 ,  H01L2224/83005 ,  H01L2224/83048 ,  H01L2224/838 ,  H01L2924/12041 ,  H01L2933/0066

Abstract: The present application discloses a display panel and a preparation method thereof. The display panel includes a base substrate provided with a circuit area and a light-emitting area; a driving circuit located in the circuit area of the base substrate; an organic insulating layer covering the light-emitting area of the base substrate; a light-emitting element embedded in the organic insulating layer, where an overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0; and a first lapping electrode located on the side, facing away from the base substrate, of the light-emitting element, where the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.

公开(公告)号：US11869897B2

公开(公告)日：2024-01-09

申请号：US17057546

申请日：2020-03-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/127 ,  H01L27/1251

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11759778B2

公开(公告)日：2023-09-19

申请号：US16763838

申请日：2019-12-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaoxin Song ,  Feng Zhang ,  Wenqu Liu ,  Zhijun Lv ,  Zhao Cui ,  Qi Yao

IPC: B01L3/00 ,  B05D7/00 ,  C23C14/08

CPC classification number: B01L3/502715 ,  B01L3/50273 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/165 ,  B01L2300/166 ,  B01L2400/022 ,  B01L2400/088 ,  B05D7/56 ,  C23C14/086

Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.

公开(公告)号：US20220373840A1

公开(公告)日：2022-11-24

申请号：US17770205

申请日：2021-06-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xiaoxin Song ,  Feng Zhang ,  Wenqu Liu ,  Zhijun Lv ,  Liwen Dong ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Dongfei Hou ,  Qi Yao ,  Xue Dong

IPC: G02F1/13357 ,  G02F1/1335

Abstract: The present disclosure relates to a backlight module, a method for designing the same, and a display device. The backlight module includes: a first substrate; a plurality of LED chips on the first substrate; and a light control structure on the first substrate. The backlight module includes a plurality of light control region groups in one-to-one correspondence with the plurality of light-emitting diode chips, each light control region group includes at least a first light control region and a second light control region. The light control structure includes a plurality of light control substructure groups respectively located in the plurality of light control region groups. Each light control substructure group includes at least a first light control substructure in the first light control region and a second light control substructure in the second light control region.

公开(公告)号：US11460735B2

公开(公告)日：2022-10-04

申请号：US17244979

申请日：2021-04-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liwen Dong ,  Qi Yao ,  Guangcai Yuan ,  Feng Zhang ,  Zhijun Lv ,  Wenqu Liu ,  Zhao Cui ,  Xiaoxin Song ,  Detian Meng

IPC: G02F1/1339 ,  G02F1/13357 ,  G02F1/1335 ,  F21V8/00

Abstract: Provided are a display panel and a preparation method thereof, and a display apparatus. The display panel includes a first substrate and a second substrate which are aligned and combined into a cell, wherein the first substrate includes a backlight structure layer and an array structure layer arranged on a side of the backlight structure layer facing the second substrate, the backlight structure layer includes a light guide plate, a grating layer arranged on a side of the light guide plate facing the array structure layer and a refractive layer covering the grating layer, the grating layer includes a plurality of grating units, the array structure layer includes a plurality of pixel electrodes, and the grating units are in one-to-one correspondence with the pixel electrodes.

公开(公告)号：US11301082B2

公开(公告)日：2022-04-12

申请号：US17242511

申请日：2021-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu Liu ,  Qi Yao ,  Feng Zhang ,  Zhao Cui ,  Libo Wang ,  Dongfei Hou ,  Xiaoxin Song ,  Zhijun Lv ,  Liwen Dong ,  Detian Meng ,  Jalil Ryu ,  Yang Yue ,  Haitao Huang

IPC: G06F3/041 ,  G06F3/045 ,  G06F3/044 ,  G06K9/00

Abstract: The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.

公开(公告)号：US11094740B2

公开(公告)日：2021-08-17

申请号：US16534362

申请日：2019-08-07

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhijun Lv ,  Liwen Dong ,  Wenqu Liu ,  Xiaoxin Song ,  Zhao Cui ,  Feng Zhang ,  Qi Yao ,  Changzheng Wang

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.