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公开(公告)号：US12033994B2
公开(公告)日：2024-07-09
申请号：US17204562
申请日：2021-03-17
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhijun Lv , Feng Zhang , Liwen Dong , Wenqu Liu , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Dongfei Hou , Qi Yao
CPC classification number: H01L25/167 , H01L24/32 , H01L24/83 , H01L24/98 , H01L27/1262 , H01L33/62 , H01L2224/32145 , H01L2224/83005 , H01L2224/83048 , H01L2224/838 , H01L2924/12041 , H01L2933/0066
Abstract: The present application discloses a display panel and a preparation method thereof. The display panel includes a base substrate provided with a circuit area and a light-emitting area; a driving circuit located in the circuit area of the base substrate; an organic insulating layer covering the light-emitting area of the base substrate; a light-emitting element embedded in the organic insulating layer, where an overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0; and a first lapping electrode located on the side, facing away from the base substrate, of the light-emitting element, where the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.
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公开(公告)号：US11759778B2
公开(公告)日：2023-09-19
申请号：US16763838
申请日：2019-12-06
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Zhao Cui , Qi Yao
CPC classification number: B01L3/502715 , B01L3/50273 , B01L3/502707 , B01L2200/027 , B01L2200/12 , B01L2300/0645 , B01L2300/0816 , B01L2300/165 , B01L2300/166 , B01L2400/022 , B01L2400/088 , B05D7/56 , C23C14/086
Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.
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公开(公告)号：US20220373840A1
公开(公告)日：2022-11-24
申请号：US17770205
申请日：2021-06-08
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Liwen Dong , Zhao Cui , Detian Meng , Libo Wang , Dongfei Hou , Qi Yao , Xue Dong
IPC: G02F1/13357 , G02F1/1335
Abstract: The present disclosure relates to a backlight module, a method for designing the same, and a display device. The backlight module includes: a first substrate; a plurality of LED chips on the first substrate; and a light control structure on the first substrate. The backlight module includes a plurality of light control region groups in one-to-one correspondence with the plurality of light-emitting diode chips, each light control region group includes at least a first light control region and a second light control region. The light control structure includes a plurality of light control substructure groups respectively located in the plurality of light control region groups. Each light control substructure group includes at least a first light control substructure in the first light control region and a second light control substructure in the second light control region.
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公开(公告)号：US11460735B2
公开(公告)日：2022-10-04
申请号：US17244979
申请日：2021-04-30
Applicant: BOE Technology Group Co., Ltd.
Inventor： Liwen Dong , Qi Yao , Guangcai Yuan , Feng Zhang , Zhijun Lv , Wenqu Liu , Zhao Cui , Xiaoxin Song , Detian Meng
IPC: G02F1/1339 , G02F1/13357 , G02F1/1335 , F21V8/00
Abstract: Provided are a display panel and a preparation method thereof, and a display apparatus. The display panel includes a first substrate and a second substrate which are aligned and combined into a cell, wherein the first substrate includes a backlight structure layer and an array structure layer arranged on a side of the backlight structure layer facing the second substrate, the backlight structure layer includes a light guide plate, a grating layer arranged on a side of the light guide plate facing the array structure layer and a refractive layer covering the grating layer, the grating layer includes a plurality of grating units, the array structure layer includes a plurality of pixel electrodes, and the grating units are in one-to-one correspondence with the pixel electrodes.
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公开(公告)号：US11301082B2
公开(公告)日：2022-04-12
申请号：US17242511
申请日：2021-04-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu Liu , Qi Yao , Feng Zhang , Zhao Cui , Libo Wang , Dongfei Hou , Xiaoxin Song , Zhijun Lv , Liwen Dong , Detian Meng , Jalil Ryu , Yang Yue , Haitao Huang
Abstract: The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.
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Patent Agency Ranking
公开(公告)号：US11094740B2
公开(公告)日：2021-08-17
申请号：US16534362
申请日：2019-08-07
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhijun Lv , Liwen Dong , Wenqu Liu , Xiaoxin Song , Zhao Cui , Feng Zhang , Qi Yao , Changzheng Wang
Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.
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公开(公告)号：US20210220826A1
公开(公告)日：2021-07-22
申请号：US16763838
申请日：2019-12-06
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Zhao Cui , Qi Yao
IPC: B01L3/00
Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.
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28.发明申请公开(公告)号：US20210089739A1
公开(公告)日：2021-03-25
申请号：US16826196
申请日：2020-03-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu LIU , Qi Yao , Feng Zhang , Zhijun Lv , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Mingqi Chen , Changzheng Wang
IPC: G06K9/00 , H01L41/08 , H01L41/193 , H01L41/257 , H01L41/29 , H01L41/331 , H01L41/45 , B06B1/06
Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
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公开(公告)号：US20200083481A1
公开(公告)日：2020-03-12
申请号：US16429531
申请日：2019-06-03
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu Liu , Feng Zhang , Qi Yao , Zhijun Lv , Liwen Dong , Shizheng Zhang , Ning Dang , Xiaoxin Song , Zhao Cui
Abstract: A display substrate, a manufacturing method thereof, and a display device are provided, in the field of display technology. The display substrate includes a base substrate, and a thin-film transistor, a light-emitting device, an encapsulation structure, and a conductive film layer sequentially disposed on the base substrate in a direction away from the base substrate. Since the display substrate includes a conductive film layer on a side of the encapsulation structure away from the base substrate, when the protective film layer on the side of the conductive film layer away from the base substrate is peeled off, static electricity generated by the separation of the film layer can be released to the conductive film layer, avoiding electron transition to the active layer of the thin-film transistor in the display substrate to cause offset of the threshold voltage of the thin-film transistor. The display brightness uniformity of the display substrate can be ensured.
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公开(公告)号：US12183987B2
公开(公告)日：2024-12-31
申请号：US18024022
申请日：2022-05-10
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhao Cui , Zhonglan Zhao , Feng Zhang , Liwen Dong , Dongfei Hou , Yuqiao Li , Wenqu Liu , Zhijun Lv , Detian Meng , Liuqing Li , Yong Ma , Mengya Song , Feng Qu
Abstract: Provided are a phase shifter, a method for manufacturing the same, and an electronic device. The phase shifter includes: a first substrate and a second substrate that are oppositely arranged, and heat conduction structures arranged between the first substrate and the second substrate. Orthographic projections of the heat conduction structures and orthographic projections of phase shifting units on the same substrate do not overlap each other.
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